Emil Casey Israel

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Nijmegen, NL

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Patents Grantslast 30 patents

Information Patent Grant
Exposed die clip bond power package
- Patent number 9,263,299
- Issue date Feb 16, 2016
- NXP B.V.
- Leonardus Antonius Elisabeth van Gemert
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EXPOSED DIE CLIP BOND POWER PACKAGE
- Publication number 20160005626
- Publication date Jan 7, 2016
- NXP B.V.
- Leonardus Antonius Elisabeth van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Exposed-Heatsink Quad Flat No-Leads (QFN) Package
- Publication number 20160005680
- Publication date Jan 7, 2016
- NXP B.V.
- Emil Casey Israel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPOSED DIE QUAD FLAT NO-LEADS (QFN) PACKAGE
- Publication number 20160005679
- Publication date Jan 7, 2016
- NXP B.V.
- Emil Casey Israel
- H01 - BASIC ELECTRIC ELEMENTS