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Penang, MY
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Patents Grants
last 30 patents
Information
Patent Grant
Multi-use package architecture
Patent number
11,929,295
Issue date
Mar 12, 2024
Intel Corporation
Eng Huat Goh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stripped redistrubution-layer fabrication for package-top embedded...
Patent number
11,908,793
Issue date
Feb 20, 2024
Intel Corporation
Jiun Hann Sir
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Systems and apparatuses for implementing a pad on solder mask (POSM...
Patent number
11,823,994
Issue date
Nov 21, 2023
Intel Corporation
Eng Huat Goh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Organic mold interconnects in shielded interconnects frames for int...
Patent number
11,699,644
Issue date
Jul 11, 2023
Intel Corporation
Jiun Hann Sir
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wrappable EMI shields
Patent number
11,699,664
Issue date
Jul 11, 2023
Intel Corporation
Eng Huat Goh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reverse-bridge multi-die interconnect for integrated-circuit packages
Patent number
11,664,317
Issue date
May 30, 2023
Intel Corporation
Min Suet Lim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
RFI free picture frame metal stiffener
Patent number
11,658,127
Issue date
May 23, 2023
Intel Corporation
Eng Huat Goh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stripped redistrubution-layer fabrication for package-top embedded...
Patent number
11,658,111
Issue date
May 23, 2023
Intel Corporation
Jiun Hann Sir
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Disaggregated die interconnection with on-silicon cavity bridge
Patent number
11,652,057
Issue date
May 16, 2023
Intel Corporation
Khang Choong Yong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device package on package (POP)
Patent number
11,587,844
Issue date
Feb 21, 2023
Intel Corporation
Eng Huat Goh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
System in package dual connector
Patent number
11,589,460
Issue date
Feb 21, 2023
Intel Corporation
Tin Poay Chuah
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Slot antenna on a printed circuit board (PCB)
Patent number
11,552,403
Issue date
Jan 10, 2023
Intel Corporation
Eng Huat Goh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Combination stiffener and capacitor
Patent number
11,538,633
Issue date
Dec 27, 2022
Intel Corporation
Eng Huat Goh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chassis interconnect for an electronic device
Patent number
11,445,608
Issue date
Sep 13, 2022
Intel Corporation
Chee How Lim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Floating-bridge interconnects and methods of assembling same
Patent number
11,393,760
Issue date
Jul 19, 2022
Intel Corporation
Boon Ping Koh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Top-to-bottom interconnects with molded lead-frame module for integ...
Patent number
11,322,434
Issue date
May 3, 2022
Intel Corporation
Jiun Hann Sir
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Board to board interconnect
Patent number
11,304,299
Issue date
Apr 12, 2022
Intel Corporation
Chee Ling Wong
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Systems, methods, and apparatuses for implementing a pad on solder...
Patent number
11,289,414
Issue date
Mar 29, 2022
Intel Corporation
Eng Huat Goh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Extended package air core inductor
Patent number
11,264,160
Issue date
Mar 1, 2022
Intel Corporation
Eng Huat Goh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic package with passive component between substrates
Patent number
11,264,315
Issue date
Mar 1, 2022
Intel Corporation
Eng Huat Goh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Slot antenna on a printed circuit board (PCB)
Patent number
11,211,714
Issue date
Dec 28, 2021
Intel Corporation
Eng Huat Goh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Organic mold interconnects in shielded interconnects frames for int...
Patent number
11,205,613
Issue date
Dec 21, 2021
Intel Corporation
Jiun Hann Sir
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flexible shield for semiconductor devices
Patent number
11,177,226
Issue date
Nov 16, 2021
Intel Corporation
Bok Eng Cheah
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flexible printed circuit EMI enclosure
Patent number
11,178,768
Issue date
Nov 16, 2021
Intel Corporation
Khang Choong Yong
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Multi-planar circuit board having reduced z-height
Patent number
11,172,581
Issue date
Nov 9, 2021
Intel Corporation
Eng Huat Goh
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electronic device packaging
Patent number
11,133,261
Issue date
Sep 28, 2021
Intel Corporation
Eng Huat Goh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrating system in package (SiP) with input/output (IO) board fo...
Patent number
11,114,421
Issue date
Sep 7, 2021
Intel Corporation
Eng Huat Goh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stripped redistrubution-layer fabrication for package-top embedded...
Patent number
10,998,262
Issue date
May 4, 2021
Intel Corporation
Jiun Hann Sir
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Programmable redistribution die
Patent number
10,943,864
Issue date
Mar 9, 2021
Intel Corporation
Eng Huat Goh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having integrated stiffener region
Patent number
10,923,415
Issue date
Feb 16, 2021
Intel Corporation
Eng Huat Goh
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
COPPER FILL FOR HEAT MANAGEMENT IN INTEGRATED CIRCUIT DEVICE
Publication number
20240136243
Publication date
Apr 25, 2024
Intel Corporation
Min Suet Lim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED INDUCTOR OVER TRANSISTOR LAYER
Publication number
20240136279
Publication date
Apr 25, 2024
Intel Corporation
Min Suet LIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRIPPED REDISTRUBUTION-LAYER FABRICATION FOR PACKAGE-TOP EMBEDDED...
Publication number
20240136278
Publication date
Apr 25, 2024
Intel Corporation
Jiun Hann Sir
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DYNAMIC RANDOM-ACCESS MEMORY IN A MOLDING BENEATH A DIE
Publication number
20240113033
Publication date
Apr 4, 2024
Intel Corporation
Eng Huat GOH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONNECTOR TO ELECTRICALLY COUPLE MULTIPLE SUBSTRATES
Publication number
20240106139
Publication date
Mar 28, 2024
Intel Corporation
Jiun Hann SIR
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH STIFFENER BASKET PORTION
Publication number
20240071948
Publication date
Feb 29, 2024
Intel Corporation
Jiun Hann SIR
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE-STACKED AND MOLDED ARCHITECTURE FOR MEMORY ON PACKAGE (MOP)
Publication number
20240006399
Publication date
Jan 4, 2024
Intel Corporation
Seok Ling Lim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SHIELD TO REDUCE SUBSTRATE ELECTROMAGNETIC INTERFERENCE AND WARPAGE
Publication number
20240006336
Publication date
Jan 4, 2024
Intel Corporation
Telesphor KAMGAING
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRICAL CONDUCTOR EXTENDING FROM A SURFACE OF A SUBSTRATE
Publication number
20230420354
Publication date
Dec 28, 2023
Intel Corporation
Telesphor KAMGAING
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYPER DENSITY PACKAGE SUBSTRATE AND MEMORY COUPLED TO A MODIFIED SE...
Publication number
20230420350
Publication date
Dec 28, 2023
Intel Corporation
Kavitha NAGARAJAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SLOTTED STIFFENER FOR A PACKAGE SUBSTRATE
Publication number
20230420384
Publication date
Dec 28, 2023
Intel Corporation
Kavitha NAGARAJAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE WITH PSEUDO-STRIPLINE ARCHITECTURE
Publication number
20230420379
Publication date
Dec 28, 2023
Intel Corporation
Eng Huat Goh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRICALLY CONDUCTIVE STRIPS ON A SIDE OF A MEMORY MODULE
Publication number
20230420342
Publication date
Dec 28, 2023
Intel Corporation
Min Suet LIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COPPER RINGS FOR BGA COUNT REDUCTION IN SMALL FORM FACTOR PACKAGES
Publication number
20230420345
Publication date
Dec 28, 2023
Intel Corporation
Kavitha NAGARAJAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MEMORY ON PACKAGE (MOP) ARCHITECTURE
Publication number
20230395576
Publication date
Dec 7, 2023
Intel Corporation
Eng Huat GOH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ON PACKAGE INTERCONNECT ARCHITECTURE FOR HIGH-SPEED MEMORY
Publication number
20230395493
Publication date
Dec 7, 2023
Intel Corporation
Jooi Wah WONG
G11 - INFORMATION STORAGE
Information
Patent Application
MEMORY PACKAGE ON EXTENDED BASE DIE OVER SOC DIE FOR PACKAGE LAYER...
Publication number
20230395578
Publication date
Dec 7, 2023
Intel Corporation
Min Suet LIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EMI CAGE FOR MICROSTRIP ROUTING VIA DUAL LAYER UNDERFILL CONCEPT
Publication number
20230395524
Publication date
Dec 7, 2023
Intel Corporation
Eng Huat GOH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ULTRA-LASER THOUGH HOLE (ULTH) BY MULTI-STACKED CORE CONCEPT
Publication number
20230397333
Publication date
Dec 7, 2023
Intel Corporation
Eng Huat GOH
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SOC-MEMORY INTEGRATION TO ACHIEVE SMALLEST AND THINNEST MEMORY ON P...
Publication number
20230395577
Publication date
Dec 7, 2023
Intel Corporation
Eng Huat GOH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MOLDED INTERCONNECT MEMORY ON PACKAGE
Publication number
20230369232
Publication date
Nov 16, 2023
Intel Corporation
Hazwani Jaffar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND APPARATUS TO REDUCE THICKNESS OF ON-PACKAGE MEMORY ARCH...
Publication number
20230178502
Publication date
Jun 8, 2023
Intel Corporation
Eng Huat Goh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGES WITH ON PACKAGE MEMORY ARCHITECTURES
Publication number
20230091395
Publication date
Mar 23, 2023
Intel Corporation
Eng Huat Goh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRIPPED REDISTRUBUTION-LAYER FABRICATION FOR PACKAGE-TOP EMBEDDED...
Publication number
20220230958
Publication date
Jul 21, 2022
Intel Corporation
Jiun Hann Sir
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THROUGH-SUBSTRATE UNDERFILL FORMATION FOR AN INTEGRATED CIRCUIT ASS...
Publication number
20220181289
Publication date
Jun 9, 2022
Intel Corporation
Eng Huat Goh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-USE PACKAGE ARCHITECTURE
Publication number
20220181227
Publication date
Jun 9, 2022
Intel Corporation
Eng Huat Goh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CO-PLANAR INTERCONNECTION MECHANISMS FOR CIRCUIT BOARDS
Publication number
20220174820
Publication date
Jun 2, 2022
Intel Corporation
Mooi Ling Chang
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
SYSTEMS, METHODS, AND APPARATUSES FOR IMPLEMENTING A PAD ON SOLDER...
Publication number
20220173027
Publication date
Jun 2, 2022
Intel Corporation
Eng Huat GOH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE WITH PASSIVE COMPONENT BETWEEN SUBSTRATES
Publication number
20220139814
Publication date
May 5, 2022
Intel Corporation
Eng Huat Goh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STEPPED PACKAGE AND RECESSED CIRCUIT BOARD
Publication number
20220110214
Publication date
Apr 7, 2022
Intel Corporation
Martin M. Chang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR