Enis Tuncer

Person

Niskayuna, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor fuse with multi-bond wire
- Patent number 12,191,252
- Issue date Jan 7, 2025
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated magnetic assembly with conductive field plates
- Patent number 12,183,693
- Issue date Dec 31, 2024
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated high voltage electronic device with high relative permit...
- Patent number 12,170,164
- Issue date Dec 17, 2024
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated semiconductor device isolation package
- Patent number 12,027,572
- Issue date Jul 2, 2024
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of the same
- Patent number 11,935,844
- Issue date Mar 19, 2024
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric field control for bond pads in semiconductor device package
- Patent number 11,881,461
- Issue date Jan 23, 2024
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage semiconductor device lead frame and method of fabrication
- Patent number 11,881,445
- Issue date Jan 23, 2024
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolated temperature sensor package with embedded spacer in dielect...
- Patent number 11,879,790
- Issue date Jan 23, 2024
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Acoustic device package and method of making
- Patent number 11,838,004
- Issue date Dec 5, 2023
- Texas Instruments Incorporated
- Enis Tuncer
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor die with blast shielding
- Patent number 11,756,882
- Issue date Sep 12, 2023
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated magnetic assembly with conductive field plates
- Patent number 11,728,289
- Issue date Aug 15, 2023
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolated temperature sensor device package
- Patent number 11,658,101
- Issue date May 23, 2023
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with isolated semiconductor die and el...
- Patent number 11,621,215
- Issue date Apr 4, 2023
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device package with isolation
- Patent number 11,614,482
- Issue date Mar 28, 2023
- Texas Instruments Incorporated
- Enis Tuncer
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device for sensing impedance changes in a medium
- Patent number 11,598,742
- Issue date Mar 7, 2023
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bondwire protrusions on conductive members
- Patent number 11,594,474
- Issue date Feb 28, 2023
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Humidity sensor
- Patent number 11,573,203
- Issue date Feb 7, 2023
- Texas Instruments Incorporated
- Enis Tuncer
- G01 - MEASURING TESTING
Information Patent Grant
Optical sensor package with optically transparent mold compound
- Patent number 11,569,396
- Issue date Jan 31, 2023
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframes with folded conductor portion and devices therefrom
- Patent number 11,569,153
- Issue date Jan 31, 2023
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hall-effect sensor package with added current path
- Patent number 11,557,722
- Issue date Jan 17, 2023
- Texas Instruments Incorporated
- Ming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fuses for packaged semiconductor devices
- Patent number 11,552,013
- Issue date Jan 10, 2023
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolated temperature sensor device
- Patent number 11,538,738
- Issue date Dec 27, 2022
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolated component design
- Patent number 11,342,251
- Issue date May 24, 2022
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hall sensor packages
- Patent number 11,322,433
- Issue date May 3, 2022
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Testing semiconductor components
- Patent number 11,201,065
- Issue date Dec 14, 2021
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage semiconductor device lead frame and method of fabrication
- Patent number 10,998,256
- Issue date May 4, 2021
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hall-effect sensor package with added current path
- Patent number 10,892,405
- Issue date Jan 12, 2021
- Texas Instruments Incorporated
- Ming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device for sensing impedance changes in a medium
- Patent number 10,883,953
- Issue date Jan 5, 2021
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolated component design
- Patent number 10,770,378
- Issue date Sep 8, 2020
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Acoustic device package and method of making
- Patent number 10,284,172
- Issue date May 7, 2019
- Texas Instruments Incorporated
- Enis Tuncer
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
DIE-PACKAGE INTERCONNECT TO FACILITATE THERMAL CONDUCTION
- Publication number 20240355700
- Publication date Oct 24, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Siraj Akhtar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH BLAST SHIELDING
- Publication number 20240266306
- Publication date Aug 8, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Enis TUNCER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED MAGNETIC ASSEMBLY WITH CONDUCTIVE FIELD PLATES
- Publication number 20230387043
- Publication date Nov 30, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Enis TUNCER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATED TEMPERATURE SENSOR DEVICE PACKAGE
- Publication number 20230298979
- Publication date Sep 21, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Enis TUNCER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH ISOLATED SEMICONDUCTOR DIE AND EL...
- Publication number 20230245957
- Publication date Aug 3, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED HIGH VOLTAGE ELECTRONIC DEVICE WITH HIGH RELATIVE PERMIT...
- Publication number 20230187121
- Publication date Jun 15, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Enis TUNCER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR FUSE WITH MULTI-BOND WIRE
- Publication number 20230187348
- Publication date Jun 15, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Enis TUNCER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATED TEMPERATURE SENSOR PACKAGE WITH EMBEDDED SPACER IN DIELECT...
- Publication number 20230138475
- Publication date May 4, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Enis Tuncer
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED SEMICONDUCTOR DEVICE ISOLATION PACKAGE
- Publication number 20230094556
- Publication date Mar 30, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Enis TUNCER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRIC FIELD CONTROL FOR BOND PADS IN SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20230097816
- Publication date Mar 30, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Enis TUNCER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH TEMPERATURE SENSOR
- Publication number 20230014718
- Publication date Jan 19, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Enis TUNCER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED MAGNETIC ASSEMBLY WITH CONDUCTIVE FIELD PLATES
- Publication number 20220384370
- Publication date Dec 1, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Enis TUNCER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDWIRE PROTRUSIONS ON CONDUCTIVE MEMBERS
- Publication number 20220352054
- Publication date Nov 3, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Enis TUNCER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FUSES FOR PACKAGED SEMICONDUCTOR DEVICES
- Publication number 20220319988
- Publication date Oct 6, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Enis TUNCER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATED TEMPERATURE SENSOR DEVICE PACKAGE
- Publication number 20220319966
- Publication date Oct 6, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Enis TUNCER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH BLAST SHIELDING
- Publication number 20220208699
- Publication date Jun 30, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Enis TUNCER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE WITH BLAST SHIELDING
- Publication number 20220208676
- Publication date Jun 30, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Enis TUNCER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SENSOR PACKAGE WITH OPTICALLY TRANSPARENT MOLD COMPOUND
- Publication number 20220140154
- Publication date May 5, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TESTING SEMICONDUCTOR COMPONENTS
- Publication number 20220108896
- Publication date Apr 7, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Enis TUNCER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HUMIDITY SENSOR
- Publication number 20220091067
- Publication date Mar 24, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Enis Tuncer
- G01 - MEASURING TESTING
Information Patent Application
HALL SENSOR PACKAGES
- Publication number 20210313258
- Publication date Oct 7, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Enis TUNCER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA CLEANING FOR PACKAGING ELECTRONIC DEVICES
- Publication number 20210305024
- Publication date Sep 30, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH VOLTAGE SEMICONDUCTOR DEVICE LEAD FRAME AND METHOD OF FABRICATION
- Publication number 20210296212
- Publication date Sep 23, 2021
- Enis TUNCER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAMES WITH FOLDED CONDUCTOR PORTION AND DEVICES THEREFROM
- Publication number 20210287970
- Publication date Sep 16, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH VOLTAGE INTEGRATED CIRCUIT TESTING INTERFACE ASSEMBLY
- Publication number 20210231729
- Publication date Jul 29, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Ming-Chuan You
- G01 - MEASURING TESTING
Information Patent Application
CHIP SCALE PACKAGE WITH REDISTRIBUTION LAYER INTERRUPTS
- Publication number 20210210462
- Publication date Jul 8, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package for Isolation Dies
- Publication number 20210175326
- Publication date Jun 10, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HALL-EFFECT SENSOR PACKAGE WITH ADDED CURRENT PATH
- Publication number 20210159403
- Publication date May 27, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Ming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TESTING SEMICONDUCTOR COMPONENTS
- Publication number 20210134610
- Publication date May 6, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Enis TUNCER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE FOR SENSING IMPEDANCE CHANGES IN A MEDIUM
- Publication number 20210116407
- Publication date Apr 22, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS

Enis Tuncer

Person

Patents Grantslast 30 patents

Semiconductor fuse with multi-bond wire

Integrated magnetic assembly with conductive field plates

Integrated high voltage electronic device with high relative permit...

Integrated semiconductor device isolation package

Semiconductor device and method of the same

Electric field control for bond pads in semiconductor device package

High voltage semiconductor device lead frame and method of fabrication

Isolated temperature sensor package with embedded spacer in dielect...

Acoustic device package and method of making

Semiconductor die with blast shielding

Integrated magnetic assembly with conductive field plates

Isolated temperature sensor device package

Semiconductor device package with isolated semiconductor die and el...

Method for manufacturing semiconductor device package with isolation

Semiconductor device for sensing impedance changes in a medium

Bondwire protrusions on conductive members

Humidity sensor

Optical sensor package with optically transparent mold compound

Leadframes with folded conductor portion and devices therefrom

Hall-effect sensor package with added current path

Fuses for packaged semiconductor devices

Isolated temperature sensor device

Isolated component design

Hall sensor packages

Testing semiconductor components

High voltage semiconductor device lead frame and method of fabrication

Hall-effect sensor package with added current path

Semiconductor device for sensing impedance changes in a medium

Isolated component design

Acoustic device package and method of making

Patents Applicationslast 30 patents

DIE-PACKAGE INTERCONNECT TO FACILITATE THERMAL CONDUCTION

SEMICONDUCTOR PACKAGE WITH BLAST SHIELDING

INTEGRATED MAGNETIC ASSEMBLY WITH CONDUCTIVE FIELD PLATES

ISOLATED TEMPERATURE SENSOR DEVICE PACKAGE

SEMICONDUCTOR DEVICE PACKAGE WITH ISOLATED SEMICONDUCTOR DIE AND EL...

INTEGRATED HIGH VOLTAGE ELECTRONIC DEVICE WITH HIGH RELATIVE PERMIT...

SEMICONDUCTOR FUSE WITH MULTI-BOND WIRE

ISOLATED TEMPERATURE SENSOR PACKAGE WITH EMBEDDED SPACER IN DIELECT...

INTEGRATED SEMICONDUCTOR DEVICE ISOLATION PACKAGE

ELECTRIC FIELD CONTROL FOR BOND PADS IN SEMICONDUCTOR DEVICE PACKAGE

SEMICONDUCTOR PACKAGE WITH TEMPERATURE SENSOR

INTEGRATED MAGNETIC ASSEMBLY WITH CONDUCTIVE FIELD PLATES

BONDWIRE PROTRUSIONS ON CONDUCTIVE MEMBERS

FUSES FOR PACKAGED SEMICONDUCTOR DEVICES

ISOLATED TEMPERATURE SENSOR DEVICE PACKAGE

SEMICONDUCTOR PACKAGE WITH BLAST SHIELDING

SEMICONDUCTOR DIE WITH BLAST SHIELDING

OPTICAL SENSOR PACKAGE WITH OPTICALLY TRANSPARENT MOLD COMPOUND

TESTING SEMICONDUCTOR COMPONENTS

HUMIDITY SENSOR

HALL SENSOR PACKAGES

PLASMA CLEANING FOR PACKAGING ELECTRONIC DEVICES

HIGH VOLTAGE SEMICONDUCTOR DEVICE LEAD FRAME AND METHOD OF FABRICATION

LEADFRAMES WITH FOLDED CONDUCTOR PORTION AND DEVICES THEREFROM

HIGH VOLTAGE INTEGRATED CIRCUIT TESTING INTERFACE ASSEMBLY

CHIP SCALE PACKAGE WITH REDISTRIBUTION LAYER INTERRUPTS

Integrated Circuit Package for Isolation Dies

HALL-EFFECT SENSOR PACKAGE WITH ADDED CURRENT PATH

TESTING SEMICONDUCTOR COMPONENTS

SEMICONDUCTOR DEVICE FOR SENSING IMPEDANCE CHANGES IN A MEDIUM