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Eric Chang

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  • Hsinchu Hsien, TW
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Patents Applicationslast 30 patents

  • Information Patent Application

    Image sensor package
    • Publication number 20050098709
    • Publication date May 12, 2005
    • Jackson Hsieh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Image sensor package
    • Publication number 20040245590
    • Publication date Dec 9, 2004
    • Jackson Hsieh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Wire bonding capillary for an image sensor
    • Publication number 20040211814
    • Publication date Oct 28, 2004
    • Jackson Hsieh
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Image sensor having improved functions
    • Publication number 20040178335
    • Publication date Sep 16, 2004
    • Jackson Hsieh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Image sensor package without a frame layer
    • Publication number 20040113286
    • Publication date Jun 17, 2004
    • Jackson Hsieh
    • H01 - BASIC ELECTRIC ELEMENTS