Patent Application
20050098709
1. Field of the Invention
The invention relates to an image sensor module package, and more particularly to an image sensor with increased product reliability and facilitated manufacturing processes.
2. Description of the Related Art
Referring to
The above-mentioned the patent has some advantages, but it has following drawbacks.
1.Since the wires 20 are electrically connected the chip18 to the upper surface38 of the upper metal sheets12 for transmitting signals from the chip18 to the lower metal sheets12. Thus, the upper metals12 and the lower metal sheets10 much be tight stacked.
An object of the invention is to provide an image sensor package with improved package reliability.
Still another object of the invention is to provide an image sensor package, wherein the wire bonding process may be easily performed and the product yield may be increased.
To achieve the above-mentioned objects, the invention includes a plurality of lower metal sheets arranged in an array, each of the lower metal sheets have an upper surface and a lower surface. A plurality of upper metal sheets arranged in an array, each of the upper metal sheets has an upper surface and a lower surface. The upper metal sheets are shorter than that of the lower metal sheet. The lower surfaces of the upper metal sheets being stacked on the upper surfaces of the lower metal sheets, so a part of the upper surface of the lower metals sheets are exposed from the upper metal sheets. An encapsulant is encapsulated the lower metal sheets and the upper metal sheets. Wherein the upper surfaces of the lower metal sheets are exposed from the encapsulant. The lower surfaces of the lower metal sheets are exposed from the encapsulant and electrically connected to the printed circuit board, and the encapsulant is formed with a frame layer around the upper surfaces of the upper metal sheets to define a chamber together with the upper metal sheets. A photosensitive chip is arranged within the chamber. A plurality of wires are electrically connected the photosensitive chip to the upper surfaces of the lower metal sheets. A transparent layer is arranged on the frame layer of the encapsulant to cover the photosensitive chip.
Referring to
Each lower metal sheet 46 has an upper surface 60 and a lower surface 62.
A plurality of upper metal sheets48 is arranged in an array, each of the upper metal sheets48 have an upper surface68 and a lower surface70. The upper metal sheets48 are shorter than that of the lower metal sheet46. The lower surfaces70 of the upper metal sheets48 are stacked on the upper surfaces60 of the lower metal sheets46, so part of the upper surface68 of the lower metal sheets48 are exposed from the upper metal sheets46.
Please referring to
The photosensitive chip 54 is arranged on the middle board 67 and located within the chamber 74.
The plurality of wires 56 are electrically connected the photosensitive chip 54 to the upper surfaces 60 of the upper metal sheets 46 so as to transfer signals from the photosensitive chip 54 to the lower metal sheets 46.
The transparent layer 58 is a piece of transparent glass arranged on the frame layer 52 of the encapsulant 50 to cover the photosensitive chip 54. Thus, the photosensitive chip 54 may receive optical signals passing through the transparent layer 58.
The invention has the following advantages.
While the invention has been described by way of examples and in terms of preferred embodiments, it is to be understood that the invention is not limited to the disclosed embodiments. To the contrary, it is intended to cover various modifications. Therefore, the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications.
