Eric Duchesne

Person

Granby, CA

People

Patents Grantslast 30 patents

Information Patent Grant
Carbon nanotube-based multi-sensor
- Patent number 10,739,209
- Issue date Aug 11, 2020
- International Business Machines Corporation
- Eric Duchesne
- G01 - MEASURING TESTING
Information Patent Grant
Enhanced cleaning for water-soluble flux soldering
- Patent number 10,636,763
- Issue date Apr 28, 2020
- International Business Machines Corporation
- Charles C. Bureau
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carbon nanotube-based multi-sensor
- Patent number 10,564,047
- Issue date Feb 18, 2020
- International Business Machines Corporation
- Eric Duchesne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced cleaning for water-soluble flux soldering
- Patent number 9,818,717
- Issue date Nov 14, 2017
- International Business Machines Corporation
- Charles C. Bureau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flux composition and process for use thereof
- Patent number 7,780,801
- Issue date Aug 24, 2010
- International Business Machines Corporation
- Eric Duchesne
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of removing metallic, inorganic and organic contaminants fro...
- Patent number 7,771,541
- Issue date Aug 10, 2010
- International Business Machines Corporation
- Claude Blais
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flux composition and techniques for use thereof
- Patent number 7,740,713
- Issue date Jun 22, 2010
- International Business Machines Corporation
- Eric Duchesne
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method to optimize the manufacturing of interconnects in microelect...
- Patent number 7,484,190
- Issue date Jan 27, 2009
- International Business Machines Corporation
- Eric Duchesne
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronically grounded heat spreader
- Patent number 7,176,563
- Issue date Feb 13, 2007
- International Business Machine Corporation
- Eric Duchesne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adjusting fillet geometry to couple a heat spreader to a chip carrier
- Patent number 6,984,286
- Issue date Jan 10, 2006
- International Business Machines Corporation
- Barry A. Bonitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grounding and thermal dissipation for integrated circuit packages
- Patent number 6,819,566
- Issue date Nov 16, 2004
- International Business Machines Corporation
- David Danovitch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adjusting fillet geometry to couple a heat spreader to a chip carrier
- Patent number 6,545,869
- Issue date Apr 8, 2003
- International Business Machines Corporation
- Barry A. Bonitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced and mechanically balanced flip chip package and...
- Patent number 6,410,988
- Issue date Jun 25, 2002
- International Business Machines Corporation
- David V. Caletka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced and mechanically balanced flip chip package and...
- Patent number 6,104,093
- Issue date Aug 15, 2000
- International Business Machines Corporation
- David V. Caletka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CARBON NANOTUBE-BASED MULTI-SENSOR
- Publication number 20180231483
- Publication date Aug 16, 2018
- International Business Machines Corporation
- Eric Duchesne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARBON NANOTUBE-BASED MULTI-SENSOR
- Publication number 20180231484
- Publication date Aug 16, 2018
- International Business Machines Corporation
- Eric Duchesne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED CLEANING FOR WATER-SOLUBLE FLUX SOLDERING
- Publication number 20180005975
- Publication date Jan 4, 2018
- International Business Machines Corporation
- Charles C. Bureau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED CLEANING FOR WATER-SOLUBLE FLUX SOLDERING
- Publication number 20170243852
- Publication date Aug 24, 2017
- International Business Machines Corporation
- Charles C. Bureau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Removing Metallic, Inorganic and Organic Contaminants Fro...
- Publication number 20100218894
- Publication date Sep 2, 2010
- International Business Machines Corporation
- Claude Blais
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
New Flux Composition and Process For Use Thereof
- Publication number 20100175790
- Publication date Jul 15, 2010
- International Business Machines Corporation
- Eric Duchesne
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS TO MINIMIZE STRESS DURING REFLOW PROCESS
- Publication number 20090298206
- Publication date Dec 3, 2009
- International Business Machines
- Eric Duchesne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Removing Metallic, Inorganic and Organic Contaminants fro...
- Publication number 20080233755
- Publication date Sep 25, 2008
- Claude Blais
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR CONTROLLED COLLAPSE CHIP CONNECTION WITH DISPLACED CA...
- Publication number 20080230901
- Publication date Sep 25, 2008
- International Business Machines Corporation
- Eric Duchesne
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
New flux composition and process for use thereof
- Publication number 20080124568
- Publication date May 29, 2008
- Eric Duchesne
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flux composition and techniques for use thereof
- Publication number 20050241731
- Publication date Nov 3, 2005
- International Business Machines Corporation
- Eric Duchesne
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronically grounded heat spreader
- Publication number 20050062154
- Publication date Mar 24, 2005
- International Business Machines Corporation
- Eric Duchesne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPROVEMENTS IN GROUNDING AND THERMAL DISSIPATION FOR INTEGRATED CI...
- Publication number 20040233638
- Publication date Nov 25, 2004
- International Business Machines Corporation
- David Danovitch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adjusting fillet geometry to couple a heat spreader to a chip carrier
- Publication number 20030101582
- Publication date Jun 5, 2003
- Barry A. Bonitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adjusting fillet geometry to couple a heat spreader to a chip carrier
- Publication number 20020141160
- Publication date Oct 3, 2002
- Barry A. Bonitz
- H01 - BASIC ELECTRIC ELEMENTS

Eric Duchesne

Person

Patents Grantslast 30 patents

Carbon nanotube-based multi-sensor

Enhanced cleaning for water-soluble flux soldering

Carbon nanotube-based multi-sensor

Enhanced cleaning for water-soluble flux soldering

Flux composition and process for use thereof

Method of removing metallic, inorganic and organic contaminants fro...

Flux composition and techniques for use thereof

Method to optimize the manufacturing of interconnects in microelect...

Electronically grounded heat spreader

Adjusting fillet geometry to couple a heat spreader to a chip carrier

Grounding and thermal dissipation for integrated circuit packages

Adjusting fillet geometry to couple a heat spreader to a chip carrier

Thermally enhanced and mechanically balanced flip chip package and...

Thermally enhanced and mechanically balanced flip chip package and...

Patents Applicationslast 30 patents

CARBON NANOTUBE-BASED MULTI-SENSOR

CARBON NANOTUBE-BASED MULTI-SENSOR

ENHANCED CLEANING FOR WATER-SOLUBLE FLUX SOLDERING

ENHANCED CLEANING FOR WATER-SOLUBLE FLUX SOLDERING

Method of Removing Metallic, Inorganic and Organic Contaminants Fro...

New Flux Composition and Process For Use Thereof

METHOD AND APPARATUS TO MINIMIZE STRESS DURING REFLOW PROCESS

Method of Removing Metallic, Inorganic and Organic Contaminants fro...

STRUCTURE FOR CONTROLLED COLLAPSE CHIP CONNECTION WITH DISPLACED CA...

New flux composition and process for use thereof

Flux composition and techniques for use thereof

Electronically grounded heat spreader

IMPROVEMENTS IN GROUNDING AND THERMAL DISSIPATION FOR INTEGRATED CI...

Adjusting fillet geometry to couple a heat spreader to a chip carrier

Adjusting fillet geometry to couple a heat spreader to a chip carrier