ERIC HSIEH

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TAIPEI-HSIEN, TW

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Patents Grantslast 30 patents

Information Patent Grant
Mixing apparatus for mixing bonding adhesive at die bonder before d...
- Patent number 9,272,302
- Issue date Mar 1, 2016
- Texas Instruments Incorporated
- Frank Yu
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Mixing bonding adhesive at die bonder before dispense
- Patent number 8,668,794
- Issue date Mar 11, 2014
- Texas Instruments Incorporated
- Frank Yu
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Package substrate having die pad with outer raised portion and inte...
- Patent number 8,546,184
- Issue date Oct 1, 2013
- Texas Instruments Incorporated
- Chih-Chien Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate having die pad with outer raised portion and inte...
- Patent number 8,455,989
- Issue date Jun 4, 2013
- Texas Instruments Incorporated
- Chih-Chien Ho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Mixing Apparatus for Mixing Bonding Adhesive at Die Bonder Before D...
- Publication number 20130298827
- Publication date Nov 14, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Frank Yu
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
Package Substrate Having Die Pad with Outer Raised Portion and Inte...
- Publication number 20130122654
- Publication date May 16, 2013
- TEXAS INSTRUMENTS INCORPORATED
- CHIH-CHIEN HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE HAVING DIE PAD WITH OUTER RAISED PORTION AND INTE...
- Publication number 20130001760
- Publication date Jan 3, 2013
- TEXAS INSTRUMENTS INCORPORATED
- CHIH-CHIEN HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIXING BONDING ADHESIVE AT DIE BONDER BEFORE DISPENSE
- Publication number 20120199285
- Publication date Aug 9, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Frank Yu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
DIE BONDER INCLUDING AUTOMATIC BOND LINE THICKNESS MEASUREMENT
- Publication number 20120202300
- Publication date Aug 9, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Frank Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AI EPOXY ADJUSTMENT
- Publication number 20120040477
- Publication date Feb 16, 2012
- Frank Yu
- H01 - BASIC ELECTRIC ELEMENTS