Eric J. Bergman

Person

Kalispell, MT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Parameter adjustment model for semiconductor processing chambers
- Patent number 12,116,686
- Issue date Oct 15, 2024
- Applied Materials, Inc.
- Eric J. Bergman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Systems and methods for shielding features of a workpiece during el...
- Patent number 11,987,897
- Issue date May 21, 2024
- Applied Materials, Inc.
- Eric J. Bergman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating system
- Patent number 11,982,008
- Issue date May 14, 2024
- Applied Materials, Inc.
- Paul R McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Nanotwin copper materials in semiconductor devices
- Patent number 11,973,034
- Issue date Apr 30, 2024
- Applied Materials, Inc.
- Eric J. Bergman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Diffusion layers in metal interconnects
- Patent number 11,901,225
- Issue date Feb 13, 2024
- Applied Materials, Inc.
- Eric J. Bergman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate cleaning components and methods in a plating system
- Patent number 11,814,744
- Issue date Nov 14, 2023
- Applied Materials, Inc.
- Nolan Zimmerman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Fluid recovery in semiconductor processing
- Patent number 11,788,200
- Issue date Oct 17, 2023
- Applied Materials, Inc.
- Sam Lee
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Methods of reducing or eliminating deposits after electrochemical p...
- Patent number 11,697,888
- Issue date Jul 11, 2023
- Applied Materials, Inc.
- Eric J Bergman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Glass carrier cleaning using ozone
- Patent number 11,673,830
- Issue date Jun 13, 2023
- Applied Materials, Inc.
- Eric J. Bergman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrochemical depositions of nanotwin copper materials
- Patent number 11,634,830
- Issue date Apr 25, 2023
- Applied Materials, Inc.
- Jing Xu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrochemical depositions of ruthenium-containing materials
- Patent number 11,629,423
- Issue date Apr 18, 2023
- Applied Materials, Inc.
- Eric J. Bergman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroplating system
- Patent number 11,578,422
- Issue date Feb 14, 2023
- Applied Materials, Inc.
- Paul R McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Methods of reducing or eliminating deposits after electrochemical p...
- Patent number 11,371,159
- Issue date Jun 28, 2022
- Applied Materials, Inc.
- Eric J Bergman
- B08 - CLEANING
Information Patent Grant
Fluid recovery in semiconductor processing
- Patent number 11,352,711
- Issue date Jun 7, 2022
- Applied Materials, Inc.
- Sam Lee
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating system
- Patent number 11,268,208
- Issue date Mar 8, 2022
- Applied Materials, Inc.
- Paul R McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Cleaning components and methods in a plating system
- Patent number 11,241,718
- Issue date Feb 8, 2022
- Applied Materials, Inc.
- Joseph Antony Jonathan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Systems and methods for copper (I) suppression in electrochemical d...
- Patent number 11,211,252
- Issue date Dec 28, 2021
- Applied Materials, Inc.
- Eric J. Bergman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Drying high aspect ratio features
- Patent number 10,971,354
- Issue date Apr 6, 2021
- Applied Materials, Inc.
- Eric J. Bergman
- B08 - CLEANING
Information Patent Grant
Controlled etch of nitride features
- Patent number 10,840,104
- Issue date Nov 17, 2020
- Applied Materials, Inc.
- Eric J. Bergman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Drying high aspect ratio features
- Patent number 10,546,762
- Issue date Jan 28, 2020
- Applied Materials, Inc.
- Eric J. Bergman
- B08 - CLEANING
Information Patent Grant
Techniques for improved removal of sacrificial mask
- Patent number 10,354,875
- Issue date Jul 16, 2019
- Varian Semiconductor Equipment Associates, Inc.
- Rajesh Prasad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adaptive electric field shielding in an electroplating processor us...
- Patent number 10,240,248
- Issue date Mar 26, 2019
- Applied Materials, Inc.
- Paul Van Valkenburg
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Removing photoresist from a wafer
- Patent number 10,191,379
- Issue date Jan 29, 2019
- Applied Materials, Inc.
- Paul R. McHugh
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Methods for chemical mechanical polishing (CMP) processing with ozone
- Patent number 10,002,771
- Issue date Jun 19, 2018
- Applied Materials, Inc.
- Prayudi Lianto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer handling system
- Patent number 8,028,978
- Issue date Oct 4, 2011
- Semitool, Inc.
- Gordon R. Nelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process and apparatus for treating a workpiece with gases
- Patent number 7,416,611
- Issue date Aug 26, 2008
- Semitool, Inc.
- Eric J. Bergman
- B08 - CLEANING
Information Patent Grant
Methods of thinning a silicon wafer using HF and ozone
- Patent number 7,404,863
- Issue date Jul 29, 2008
- Semitool, Inc.
- Eric J. Bergman
- B08 - CLEANING
Information Patent Grant
System and methods for polishing a wafer
- Patent number 7,378,355
- Issue date May 27, 2008
- Semitool, Inc.
- Eric J. Bergman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vapor phase etching MEMS devices
- Patent number 7,279,431
- Issue date Oct 9, 2007
- Semitool, Inc.
- Eric J. Bergman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Process and apparatus for treating a workpiece using ozone
- Patent number 7,264,680
- Issue date Sep 4, 2007
- Semitool, Inc.
- Thomas Maximilia Gebhart
- B08 - CLEANING

Patents Applicationslast 30 patents

Information Patent Application
ELECTROLESS PLATING WITH A FLOATING POTENTIAL
- Publication number 20240218519
- Publication date Jul 4, 2024
- Applied Materials, Inc.
- Eric J. Bergman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROCHEMICAL DEPOSITIONS OF NANOTWIN COPPER MATERIALS
- Publication number 20230272547
- Publication date Aug 31, 2023
- Applied Materials, Inc.
- Jing Xu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PARAMETER ADJUSTMENT MODEL FOR SEMICONDUCTOR PROCESSING CHAMBERS
- Publication number 20230257900
- Publication date Aug 17, 2023
- Applied Materials, Inc.
- Eric J. Bergman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WATER VAPOR PLASMA TO ENHANCE SURFACE HYDROPHILICITY
- Publication number 20230100863
- Publication date Mar 30, 2023
- Prayudi LIANTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFUSION LAYERS IN METAL INTERCONNECTS
- Publication number 20230077737
- Publication date Mar 16, 2023
- Applied Materials, Inc.
- Eric J. Bergman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROCHEMICAL DEPOSITIONS OF NANOTWIN COPPER MATERIALS
- Publication number 20230068074
- Publication date Mar 2, 2023
- Applied Materials, Inc.
- Jing Xu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROCHEMICAL DEPOSITIONS OF RUTHENIUM-CONTAINING MATERIALS
- Publication number 20230066404
- Publication date Mar 2, 2023
- Applied Materials, Inc.
- Eric J. Bergman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
NANOTWIN COPPER MATERIALS IN SEMICONDUCTOR DEVICES
- Publication number 20230065426
- Publication date Mar 2, 2023
- Applied Materials, Inc.
- Eric J. Bergman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHODS OF REDUCING OR ELIMINATING DEPOSITS AFTER ELECTROCHEMICAL P...
- Publication number 20220282394
- Publication date Sep 8, 2022
- Applied Materials, Inc.
- Eric J. Bergman
- B08 - CLEANING
Information Patent Application
FLUID RECOVERY IN SEMICONDUCTOR PROCESSING
- Publication number 20220259756
- Publication date Aug 18, 2022
- Applied Materials, Inc.
- Sam Lee
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING SYSTEM
- Publication number 20220145489
- Publication date May 12, 2022
- Applied Materials, Inc.
- Paul R McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
GLASS CARRIER CLEANING USING OZONE
- Publication number 20220144699
- Publication date May 12, 2022
- Applied Materials, Inc.
- Eric J. Bergman
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
ELECTROPLATING SYSTEM
- Publication number 20210348296
- Publication date Nov 11, 2021
- Applied Materials, Inc.
- Paul R McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
FLUID RECOVERY IN SEMICONDUCTOR PROCESSING
- Publication number 20210017665
- Publication date Jan 21, 2021
- Applied Materials, Inc.
- Sam Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF REDUCING OR ELIMINATING DEPOSITS AFTER ELECTROCHEMICAL P...
- Publication number 20200399779
- Publication date Dec 24, 2020
- Applied Materials, Inc.
- Eric J. Bergman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CLEANING COMPONENTS AND METHODS IN A PLATING SYSTEM
- Publication number 20190321861
- Publication date Oct 24, 2019
- Applied Materials, Inc.
- Joseph A. Jonathan
- B08 - CLEANING
Information Patent Application
SUBSTRATE CLEANING COMPONENTS AND METHODS IN A PLATING SYSTEM
- Publication number 20190301049
- Publication date Oct 3, 2019
- Applied Materials, Inc.
- Nolan Zimmerman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SYSTEMS AND METHODS FOR COPPER (I) SUPPRESSION IN ELECTROCHEMICAL D...
- Publication number 20190237335
- Publication date Aug 1, 2019
- Applied Materials, Inc.
- Eric J. Bergman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TECHNIQUES FOR IMPROVED REMOVAL OF SACRIFICIAL MASK
- Publication number 20190214255
- Publication date Jul 11, 2019
- Varian Semiconductor Equipment Associates, Inc.
- Rajesh Prasad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLED ETCH OF NITRIDE FEATURES
- Publication number 20190019688
- Publication date Jan 17, 2019
- Applied Materials, Inc.
- Eric J. Bergman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRYING HIGH ASPECT RATIO FEATURES
- Publication number 20180144954
- Publication date May 24, 2018
- Applied Materials, Inc.
- Eric J. Bergman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRYING HIGH ASPECT RATIO FEATURES
- Publication number 20180019119
- Publication date Jan 18, 2018
- Applied Materials Inc,
- Eric J. Bergman
- B08 - CLEANING
Information Patent Application
REMOVING PHOTORESIST FROM A WAFER
- Publication number 20170357158
- Publication date Dec 14, 2017
- Applied Materials, Inc.
- Paul R. McHugh
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
SYSTEMS AND METHODS FOR SHIELDING FEATURES OF A WORKPIECE DURING EL...
- Publication number 20170191180
- Publication date Jul 6, 2017
- Applied Materials, Inc.
- Eric J. Bergman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ADAPTIVE ELECTRIC FIELD SHIELDING IN AN ELECTROPLATING PROCESSOR US...
- Publication number 20170051423
- Publication date Feb 23, 2017
- Applied Materials, Inc.
- Paul Van Valkenburg
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHODS FOR INCREASING THE RATE OF ELECTROCHEMICAL DEPOSITION
- Publication number 20160333492
- Publication date Nov 17, 2016
- Applied Materials, Inc.
- Eric J. Bergman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SELECTIVE SILICON NITRIDE ETCH
- Publication number 20120289056
- Publication date Nov 15, 2012
- Applied Materials, Inc.
- Eric J. Bergman
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SYSTEMS AND METHODS FOR ETCHING SILICON NITRIDE
- Publication number 20120015523
- Publication date Jan 19, 2012
- Jerry Dustin LEONHARD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTORESIST REMOVING PROCESSOR AND METHODS
- Publication number 20110217848
- Publication date Sep 8, 2011
- Eric J. Bergman
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHODS FOR REMOVING PHOTORESIST
- Publication number 20070227556
- Publication date Oct 4, 2007
- Eric J. Bergman
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Eric J. Bergman

Person

Patents Grantslast 30 patents

Parameter adjustment model for semiconductor processing chambers

Systems and methods for shielding features of a workpiece during el...

Electroplating system

Nanotwin copper materials in semiconductor devices

Diffusion layers in metal interconnects

Substrate cleaning components and methods in a plating system

Fluid recovery in semiconductor processing

Methods of reducing or eliminating deposits after electrochemical p...

Glass carrier cleaning using ozone

Electrochemical depositions of nanotwin copper materials

Electrochemical depositions of ruthenium-containing materials

Electroplating system

Methods of reducing or eliminating deposits after electrochemical p...

Fluid recovery in semiconductor processing

Electroplating system

Cleaning components and methods in a plating system

Systems and methods for copper (I) suppression in electrochemical d...

Drying high aspect ratio features

Controlled etch of nitride features

Drying high aspect ratio features

Techniques for improved removal of sacrificial mask

Adaptive electric field shielding in an electroplating processor us...

Removing photoresist from a wafer

Methods for chemical mechanical polishing (CMP) processing with ozone

Wafer handling system

Process and apparatus for treating a workpiece with gases

Methods of thinning a silicon wafer using HF and ozone

System and methods for polishing a wafer

Vapor phase etching MEMS devices

Process and apparatus for treating a workpiece using ozone

Patents Applicationslast 30 patents

ELECTROLESS PLATING WITH A FLOATING POTENTIAL

ELECTROCHEMICAL DEPOSITIONS OF NANOTWIN COPPER MATERIALS

PARAMETER ADJUSTMENT MODEL FOR SEMICONDUCTOR PROCESSING CHAMBERS

WATER VAPOR PLASMA TO ENHANCE SURFACE HYDROPHILICITY

DIFFUSION LAYERS IN METAL INTERCONNECTS

ELECTROCHEMICAL DEPOSITIONS OF NANOTWIN COPPER MATERIALS

ELECTROCHEMICAL DEPOSITIONS OF RUTHENIUM-CONTAINING MATERIALS

NANOTWIN COPPER MATERIALS IN SEMICONDUCTOR DEVICES

METHODS OF REDUCING OR ELIMINATING DEPOSITS AFTER ELECTROCHEMICAL P...

FLUID RECOVERY IN SEMICONDUCTOR PROCESSING

ELECTROPLATING SYSTEM

GLASS CARRIER CLEANING USING OZONE

ELECTROPLATING SYSTEM

FLUID RECOVERY IN SEMICONDUCTOR PROCESSING

METHODS OF REDUCING OR ELIMINATING DEPOSITS AFTER ELECTROCHEMICAL P...

CLEANING COMPONENTS AND METHODS IN A PLATING SYSTEM

SUBSTRATE CLEANING COMPONENTS AND METHODS IN A PLATING SYSTEM

SYSTEMS AND METHODS FOR COPPER (I) SUPPRESSION IN ELECTROCHEMICAL D...

TECHNIQUES FOR IMPROVED REMOVAL OF SACRIFICIAL MASK

CONTROLLED ETCH OF NITRIDE FEATURES

DRYING HIGH ASPECT RATIO FEATURES

DRYING HIGH ASPECT RATIO FEATURES

REMOVING PHOTORESIST FROM A WAFER

SYSTEMS AND METHODS FOR SHIELDING FEATURES OF A WORKPIECE DURING EL...

ADAPTIVE ELECTRIC FIELD SHIELDING IN AN ELECTROPLATING PROCESSOR US...

METHODS FOR INCREASING THE RATE OF ELECTROCHEMICAL DEPOSITION

SELECTIVE SILICON NITRIDE ETCH

SYSTEMS AND METHODS FOR ETCHING SILICON NITRIDE

PHOTORESIST REMOVING PROCESSOR AND METHODS

METHODS FOR REMOVING PHOTORESIST