-
Printhead assembly
-
Patent number 11,117,376
-
Issue date Sep 14, 2021
-
Hewlett-Packard Development Company, L.P.
-
Si-lam J. Choy
-
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
-
Fluidic micro electromechanical system
-
Patent number 10,557,567
-
Issue date Feb 11, 2020
-
Hewlett-Packard Development Company, L.P.
-
Eric L. Nikkel
-
F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
-
-
Printhead assembly
-
Patent number 10,195,852
-
Issue date Feb 5, 2019
-
Hewlett-Packard Development Company, L.P.
-
Silam J Choy
-
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
-
-
Printing device
-
Patent number 8,333,459
-
Issue date Dec 18, 2012
-
Hewlett-Packard Development Company, L.P.
-
Rio Rivas
-
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
-
-
-
-
-
Piezo resistive pressure sensor
-
Patent number 7,571,650
-
Issue date Aug 11, 2009
-
Hewlett-Packard Development Company, L.P.
-
James C. McKinnell
-
H04 - ELECTRIC COMMUNICATION TECHNIQUE
-
-
-
Flexures
-
Patent number 7,471,441
-
Issue date Dec 30, 2008
-
Hewlett-Packard Development Company, L.P.
-
James R. Przybyla
-
G02 - OPTICS
-
-
-
-
Light modulator device
-
Patent number 7,199,916
-
Issue date Apr 3, 2007
-
Hewlett-Packard Development Company, L.P.
-
Kenneth J. Faase
-
G02 - OPTICS
-
-
-
-
-
Micro-electromechanical system
-
Patent number 6,979,585
-
Issue date Dec 27, 2005
-
Hewlett-Packard Development Company, L.P.
-
Eric L. Nikkel
-
B81 - MICRO-STRUCTURAL TECHNOLOGY
-
-
-
-
Method of forming MEMS device
-
Patent number 6,861,277
-
Issue date Mar 1, 2005
-
Hewlett-Packard Development Company, L.P.
-
Michael G. Monroe
-
B81 - MICRO-STRUCTURAL TECHNOLOGY
-
Slotted substrate and slotting process
-
Patent number 6,818,138
-
Issue date Nov 16, 2004
-
Hewlett-Packard Development Company, L.P.
-
Jeffrey Scott Obert
-
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
-
-