Eric P. Dibble

Person

Endicott, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Process of producing plastic pin grid array
- Patent number 6,438,830
- Issue date Aug 27, 2002
- International Business Machines Corporation
- Eric P. Dibble
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of improved cavity BGA circuit package
- Patent number 6,040,631
- Issue date Mar 21, 2000
- International Business Machines Corporation
- Eric P. Dibble
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pin attach structure for an electronic package
- Patent number 5,952,716
- Issue date Sep 14, 1999
- International Business Machines Corporation
- Eric P. Dibble
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Applying solder to high density substrates
- Patent number 5,316,788
- Issue date May 31, 1994
- International Business Machines Corporation
- Eric P. Dibble
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connector for connecting flexible film circuit carrier to board or...
- Patent number 4,976,626
- Issue date Dec 11, 1990
- International Business Machines Corporation
- Eric P. Dibble
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for preparing low electrical contact resistance composition
- Patent number 4,849,079
- Issue date Jul 18, 1989
- International Business Machines Corp.
- Jerome J. Cuomo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Low contact electrical resistant composition, substrates coated the...
- Patent number 4,774,151
- Issue date Sep 27, 1988
- International Business Machines Corporation
- Jerome J. Cuomo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Masking for selective electroplating jet method
- Patent number 4,409,071
- Issue date Oct 11, 1983
- International Business Machines Corporation
- Eric P. Dibble
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Eric P. Dibble

Person

Patents Grantslast 30 patents

Process of producing plastic pin grid array

Method of improved cavity BGA circuit package

Pin attach structure for an electronic package

Applying solder to high density substrates

Connector for connecting flexible film circuit carrier to board or...

Process for preparing low electrical contact resistance composition

Low contact electrical resistant composition, substrates coated the...

Masking for selective electroplating jet method