Tadahiro Nomura, English Translation of Japanese Patent 196196. |
Principles of Electronic Packaging, Ed., Seraphim et al., published 1989, Chapter 19, pp. 577-610 by Senger et al. |
Microelectronics Packaging Handbook, Ed., Trummala et al., published 1989, chapter 1, pp. 16 and 42-43, Chapter 11, pp. 779-780, 803 and 814 ff and Chapter 15, p. 1041. |
IBM TDB vol. 29, No. 2, Jul. 1986, "Electrolytic Process for Substrate Manufacturing", by Dunkel et al. |
IBM TDB vol. 29, No. 7, Dec. 1986, "Immersion Wave Soldering Flux" by Rott et al. |
IBM TDB vol. 24, No. 6, Nov. 1981, "Penetrating Low Temperature Immersion Tin", by Albrecht et al. |
IBM Journal of Research & Development, vol. 26, No. 3, May, 1982, pp. 379-382, "Immersion Wave Soldering Process", by Getten et al. |