Eric R. Miller

Person

Lompoc, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Iterative formation of damascene interconnects
- Patent number 12,148,721
- Issue date Nov 19, 2024
- Raytheon Company
- Eric R. Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit having vertical routing to bond pads
- Patent number 11,837,623
- Issue date Dec 5, 2023
- Raytheon Company
- Eric Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Indium electroplating on physical vapor deposition tantalum
- Patent number 11,753,736
- Issue date Sep 12, 2023
- Raytheon Company
- Michael J. Rondon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrating optical elements with electro-optical sensors via direc...
- Patent number 11,710,756
- Issue date Jul 25, 2023
- Raytheon Company
- Jamal I. Mustafa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Iterative formation of damascene interconnects
- Patent number 11,430,753
- Issue date Aug 30, 2022
- Raytheon Company
- Eric R. Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level shim processing
- Patent number 11,393,869
- Issue date Jul 19, 2022
- Raytheon Company
- Jeffery H. Burkhart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing wafer level low melting temperature interco...
- Patent number 11,222,813
- Issue date Jan 11, 2022
- Raytheon Company
- Sean P. Kilcoyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level shim processing
- Patent number 10,847,569
- Issue date Nov 24, 2020
- Raytheon Company
- Jeffery H. Burkhart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of wafer bonding of dissimilar thickness die
- Patent number 10,515,837
- Issue date Dec 24, 2019
- Raytheon Company
- Sean P. Kilcoyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing wafer level low melting temperature interco...
- Patent number 10,504,777
- Issue date Dec 10, 2019
- Raytheon Company
- Sean P. Kilcoyne
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Process Control Monitor Device Structure for Buried TSV Formation i...
- Publication number 20240120242
- Publication date Apr 11, 2024
- Raytheon Company
- Sean P. Kilcoyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HAVING VERTICAL ROUTING TO BOND PADS
- Publication number 20240055466
- Publication date Feb 15, 2024
- Raytheon Company
- Eric Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDIUM ELECTROPLATING ON PHYSICAL VAPOR DEPOSITION TANTALUM
- Publication number 20240018684
- Publication date Jan 18, 2024
- Raytheon Company
- Michael J. Rondon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LOW-STRESS DIELECTRIC LAYER, PLANARIZATION METHOD, AND LOW-TEMPERAT...
- Publication number 20220416095
- Publication date Dec 29, 2022
- Raytheon Company
- Chad Fulk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ITERATIVE FORMATION OF DAMASCENE INTERCONNECTS
- Publication number 20220359437
- Publication date Nov 10, 2022
- Raytheon Company
- Eric R. Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOSAIC FOCAL PLANE ARRAY
- Publication number 20220310690
- Publication date Sep 29, 2022
- Raytheon Company
- David J. Gulbransen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDIUM ELECTROPLATING ON PHYSICAL VAPOR DEPOSITION TANTALUM
- Publication number 20220154359
- Publication date May 19, 2022
- Raytheon Company
- Michael J. Rondon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTEGRATING OPTICAL ELEMENTS WITH ELECTRO-OPTICAL SENSORS VIA DIREC...
- Publication number 20220157881
- Publication date May 19, 2022
- Raytheon Company
- Jamal I. Mustafa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HAVING VERTICAL ROUTING TO BOND PADS
- Publication number 20220115423
- Publication date Apr 14, 2022
- Raytheon Company
- Eric Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ITERATIVE FORMATION OF DAMASCENE INTERCONNECTS
- Publication number 20220013478
- Publication date Jan 13, 2022
- Raytheon Company
- Eric R. Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL SHIM PROCESSING
- Publication number 20210043665
- Publication date Feb 11, 2021
- Raytheon Company
- Jeffery H. Burkhart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL SHIM PROCESSING
- Publication number 20200273893
- Publication date Aug 27, 2020
- Raytheon Company
- Jeffery H. Burkhart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING WAFER LEVEL LOW MELTING TEMPERATURE INTERCO...
- Publication number 20200075396
- Publication date Mar 5, 2020
- Raytheon Company
- Sean P. Kilcoyne
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MANUFACTURING WAFER LEVEL LOW MELTING TEMPERATURE INTERCO...
- Publication number 20190252244
- Publication date Aug 15, 2019
- Raytheon Company
- Sean P. Kilcoyne
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF WAFER BONDING OF DISSIMILAR THICKNESS DIE
- Publication number 20180301365
- Publication date Oct 18, 2018
- Raytheon Company
- Sean P. Kilcoyne
- H01 - BASIC ELECTRIC ELEMENTS

Eric R. Miller

Person

Patents Grantslast 30 patents

Iterative formation of damascene interconnects

Integrated circuit having vertical routing to bond pads

Indium electroplating on physical vapor deposition tantalum

Integrating optical elements with electro-optical sensors via direc...

Iterative formation of damascene interconnects

Wafer level shim processing

Method of manufacturing wafer level low melting temperature interco...

Wafer level shim processing

Method of wafer bonding of dissimilar thickness die

Method of manufacturing wafer level low melting temperature interco...

Patents Applicationslast 30 patents

Process Control Monitor Device Structure for Buried TSV Formation i...

INTEGRATED CIRCUIT HAVING VERTICAL ROUTING TO BOND PADS

INDIUM ELECTROPLATING ON PHYSICAL VAPOR DEPOSITION TANTALUM

LOW-STRESS DIELECTRIC LAYER, PLANARIZATION METHOD, AND LOW-TEMPERAT...

ITERATIVE FORMATION OF DAMASCENE INTERCONNECTS

MOSAIC FOCAL PLANE ARRAY

INDIUM ELECTROPLATING ON PHYSICAL VAPOR DEPOSITION TANTALUM

INTEGRATING OPTICAL ELEMENTS WITH ELECTRO-OPTICAL SENSORS VIA DIREC...

INTEGRATED CIRCUIT HAVING VERTICAL ROUTING TO BOND PADS

ITERATIVE FORMATION OF DAMASCENE INTERCONNECTS

WAFER LEVEL SHIM PROCESSING

WAFER LEVEL SHIM PROCESSING

METHOD OF MANUFACTURING WAFER LEVEL LOW MELTING TEMPERATURE INTERCO...

METHOD OF MANUFACTURING WAFER LEVEL LOW MELTING TEMPERATURE INTERCO...

METHOD OF WAFER BONDING OF DISSIMILAR THICKNESS DIE