Eric Tosaya

Person

Fremont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Light emitting diode device with reconstituted LED components on su...
- Patent number 10,008,652
- Issue date Jun 26, 2018
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode device with reconstituted LED components on su...
- Patent number 9,620,436
- Issue date Apr 11, 2017
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Holding of interposers and other microelectronic workpieces in posi...
- Patent number 9,524,883
- Issue date Dec 20, 2016
- Invensas Corporation
- Charles G. Woychik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of underfill tape in microelectronic components, and microelect...
- Patent number 9,496,154
- Issue date Nov 15, 2016
- Invensas Corporation
- Eric S. Tosaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with channel stiffener frame
- Patent number 8,405,187
- Issue date Mar 26, 2013
- GLOBALFOUNDRIES Inc.
- Eric Tosaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with channel stiffener frame
- Patent number 8,008,133
- Issue date Aug 30, 2011
- GLOBALFOUNDRIES Inc.
- Eric Tosaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for automatically routing connections between top side condu...
- Patent number 7,243,327
- Issue date Jul 10, 2007
- Cisco Technology, Inc.
- Alex Tain
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for automatically connecting top side conductors with bottom...
- Patent number 7,055,122
- Issue date May 30, 2006
- Cisco Technology, Inc.
- Alex Tain
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for automatically routing connections between top side condu...
- Patent number 6,976,236
- Issue date Dec 13, 2005
- Procket Networks, Inc.
- Alex Tain
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Heat spreader having holes for rivet-like adhesive connections
- Patent number 6,538,320
- Issue date Mar 25, 2003
- Advanced Micro Devices, Inc.
- Eric S. Tosaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink grounded to a grounded package lid
- Patent number 6,512,675
- Issue date Jan 28, 2003
- Advanced Micro Devices, Inc.
- Thomas S. Tarter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for precoining BGA type packages prior to elec...
- Patent number 6,508,845
- Issue date Jan 21, 2003
- Advanced Micro Devices, Inc.
- Eric S. Tosaya
- G01 - MEASURING TESTING
Information Patent Grant
Extruded heat spreader
- Patent number 6,483,169
- Issue date Nov 19, 2002
- Advanced Micro Devices, Inc.
- Eric S. Tosaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for precoining BGA type packages prior to elec...
- Patent number 6,399,474
- Issue date Jun 4, 2002
- Advanced Micro Devices, Inc.
- Eric S. Tosaya
- G01 - MEASURING TESTING
Information Patent Grant
Multilayer IC semiconductor package
- Patent number 5,414,222
- Issue date May 9, 1995
- LSI Logic Corporation
- Bidyut K. Sen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer IC semiconductor package
- Patent number 5,304,743
- Issue date Apr 19, 1994
- LSI Logic Corporation
- Bidyut K. Sen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LIGHT EMITTING DIODE DEVICE WITH RECONSTITUTED LED COMPONENTS ON SU...
- Publication number 20170200877
- Publication date Jul 13, 2017
- Invensas Corporation
- Liang Wang
- G01 - MEASURING TESTING
Information Patent Application
USE OF UNDERFILL TAPE IN MICROELECTRONIC COMPONENTS, AND MICROELECT...
- Publication number 20160079093
- Publication date Mar 17, 2016
- Invensas Corporation
- Eric S. TOSAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOLDING OF INTERPOSERS AND OTHER MICROELECTRONIC WORKPIECES IN POSI...
- Publication number 20150333049
- Publication date Nov 19, 2015
- Invensas Corporation
- Charles G. Woychik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE DEVICE WITH RECONSTITUTED LED COMPONENTS ON SU...
- Publication number 20150295009
- Publication date Oct 15, 2015
- Invensas Corporation
- Liang Wang
- G01 - MEASURING TESTING
Information Patent Application
STIFFENER FRAME WITH CIRCUIT BOARD CORNER PROTECTION
- Publication number 20130258619
- Publication date Oct 3, 2013
- Tom J. Ley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP PACKAGE WITH CHANNEL STIFFENER FRAME
- Publication number 20110241161
- Publication date Oct 6, 2011
- GLOBALFOUNDRIES INC.
- Eric Tosaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Package with Pin Stabilization Layer
- Publication number 20090246916
- Publication date Oct 1, 2009
- Eric Tosaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Package with Channel Stiffener Frame
- Publication number 20090200659
- Publication date Aug 13, 2009
- Eric Tosaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Package with Stiffener Ring
- Publication number 20080284047
- Publication date Nov 20, 2008
- Eric Tosaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Package with Pin Stabilization Layer
- Publication number 20080283999
- Publication date Nov 20, 2008
- Eric Tosaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Decoupling Capacitor with Controlled Equivalent Series Resistance
- Publication number 20080186650
- Publication date Aug 7, 2008
- Benjamin Beker
- H01 - BASIC ELECTRIC ELEMENTS

Eric Tosaya

Person

Patents Grantslast 30 patents

Light emitting diode device with reconstituted LED components on su...

Light emitting diode device with reconstituted LED components on su...

Holding of interposers and other microelectronic workpieces in posi...

Use of underfill tape in microelectronic components, and microelect...

Chip package with channel stiffener frame

Chip package with channel stiffener frame

Method for automatically routing connections between top side condu...

Method for automatically connecting top side conductors with bottom...

Method for automatically routing connections between top side condu...

Heat spreader having holes for rivet-like adhesive connections

Heat sink grounded to a grounded package lid

Method and apparatus for precoining BGA type packages prior to elec...

Extruded heat spreader

Method and apparatus for precoining BGA type packages prior to elec...

Multilayer IC semiconductor package

Multilayer IC semiconductor package

Patents Applicationslast 30 patents

LIGHT EMITTING DIODE DEVICE WITH RECONSTITUTED LED COMPONENTS ON SU...

USE OF UNDERFILL TAPE IN MICROELECTRONIC COMPONENTS, AND MICROELECT...

HOLDING OF INTERPOSERS AND OTHER MICROELECTRONIC WORKPIECES IN POSI...

LIGHT EMITTING DIODE DEVICE WITH RECONSTITUTED LED COMPONENTS ON SU...

STIFFENER FRAME WITH CIRCUIT BOARD CORNER PROTECTION

CHIP PACKAGE WITH CHANNEL STIFFENER FRAME

Chip Package with Pin Stabilization Layer

Chip Package with Channel Stiffener Frame

Chip Package with Stiffener Ring

Chip Package with Pin Stabilization Layer

Decoupling Capacitor with Controlled Equivalent Series Resistance