Eric W. Tremble

Person

Jericho, VT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Lateral escape using triangular structure of transceivers
- Patent number 12,095,494
- Issue date Sep 17, 2024
- MARVELL ASIA PTE. LTD.
- Aatreya Chakravarti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Partitioned substrates with interconnect bridge
- Patent number 11,282,806
- Issue date Mar 22, 2022
- Marvell Asia Pte, Ltd.
- Wolfgang Sauter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnected integrated circuit (IC) chip structure and packaging...
- Patent number 10,714,411
- Issue date Jul 14, 2020
- GLOBALFOUNDRIES Inc.
- Wolfgang Sauter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Split ball grid array pad for multi-chip modules
- Patent number 10,483,233
- Issue date Nov 19, 2019
- International Business Machines Corporation
- Anson J. Call
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated interface structure
- Patent number 9,875,956
- Issue date Jan 23, 2018
- GLOBALFOUNDRIES Inc.
- Wolfgang Sauter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Split ball grid array pad for multi-chip modules
- Patent number 9,633,914
- Issue date Apr 25, 2017
- International Business Machines Corporation
- Anson J. Call
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Early decoupling capacitor optimization method for hierarchical cir...
- Patent number 8,438,520
- Issue date May 7, 2013
- International Business Machines Corporation
- Kurt A. Carlsen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
System-level method for reducing power supply noise in an electroni...
- Patent number 8,429,590
- Issue date Apr 23, 2013
- International Business Machines Corporation
- Timothy W. Budell
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi-segments modeling bond wire interconnects with 2D simulations...
- Patent number 8,312,404
- Issue date Nov 13, 2012
- International Business Machines Corporation
- Haitian Hu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Automatic verification of adequate conductive return-current paths
- Patent number 7,882,469
- Issue date Feb 1, 2011
- International Business Machines Corporation
- Timothy W. Budell
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit redistribution package
- Patent number 6,945,791
- Issue date Sep 20, 2005
- International Business Machines Corporation
- Timothy W. Budell
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Customized heat dissipation from different types of integrated circ...
- Publication number 20250029888
- Publication date Jan 23, 2025
- Marvell Asia Pte Ltd.
- Carl E. Benes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lateral escape using triangular structure of transceivers
- Publication number 20240405795
- Publication date Dec 5, 2024
- Marvell Asia Pte Ltd.
- Aatreya Chakravarti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PARTITIONED SUBSTRATES WITH INTERCONNECT BRIDGE
- Publication number 20210111141
- Publication date Apr 15, 2021
- GLOBALFOUNDRIES INC.
- Wolfgang SAUTER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT CONNECTIONS OF PROCESSORS ON A PANEL ASSEMBLY
- Publication number 20190363047
- Publication date Nov 28, 2019
- GLOBALFOUNDRIES INC.
- Edmund Blackshear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTED INTEGRATED CIRCUIT (IC) CHIP STRUCTURE AND PACKAGING...
- Publication number 20190287879
- Publication date Sep 19, 2019
- GLOBALFOUNDRIES INC.
- Wolfgang Sauter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPLIT BALL GRID ARRAY PAD FOR MULTI-CHIP MODULES
- Publication number 20170141078
- Publication date May 18, 2017
- International Business Machines Corporation
- Anson J. Call
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPLIT BALL GRID ARRAY PAD FOR MULTI-CHIP MODULES
- Publication number 20170077000
- Publication date Mar 16, 2017
- International Business Machines Corporation
- Anson J. Call
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EARLY DECOUPLING CAPACITOR OPTIMIZATION METHOD FOR HIERARCHICAL CIR...
- Publication number 20130054202
- Publication date Feb 28, 2013
- International Business Machines Corporation
- Kurt A. Carlsen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEM-LEVEL METHOD FOR REDUCING POWER SUPPLY NOISE IN AN ELECTRONI...
- Publication number 20130024831
- Publication date Jan 24, 2013
- International Business Machines Corporation
- Timothy W. Budell
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method of Multi-segments Modeling Bond Wire Interconnects with 2D S...
- Publication number 20100332193
- Publication date Dec 30, 2010
- International Business Machines Corporation
- Haitian Hu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
AUTOMATIC VERIFICATION OF ADEQUATE CONDUCTIVE RETURN-CURRENT PATHS
- Publication number 20090138836
- Publication date May 28, 2009
- Timothy W. Budell
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR RAPID RETURN PATH TRACING
- Publication number 20090094564
- Publication date Apr 9, 2009
- Timothy W. Budell
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED CIRCUIT REDISTRIBUTION PACKAGE
- Publication number 20050176273
- Publication date Aug 11, 2005
- International Business Machines Corporation
- Timothy W. Budell
- H01 - BASIC ELECTRIC ELEMENTS

Eric W. Tremble

Person

Patents Grantslast 30 patents

Lateral escape using triangular structure of transceivers

Partitioned substrates with interconnect bridge

Interconnected integrated circuit (IC) chip structure and packaging...

Split ball grid array pad for multi-chip modules

Integrated interface structure

Split ball grid array pad for multi-chip modules

Early decoupling capacitor optimization method for hierarchical cir...

System-level method for reducing power supply noise in an electroni...

Multi-segments modeling bond wire interconnects with 2D simulations...

Automatic verification of adequate conductive return-current paths

Integrated circuit redistribution package

Patents Applicationslast 30 patents

Customized heat dissipation from different types of integrated circ...

Lateral escape using triangular structure of transceivers

PARTITIONED SUBSTRATES WITH INTERCONNECT BRIDGE

FAN-OUT CONNECTIONS OF PROCESSORS ON A PANEL ASSEMBLY

INTERCONNECTED INTEGRATED CIRCUIT (IC) CHIP STRUCTURE AND PACKAGING...

SPLIT BALL GRID ARRAY PAD FOR MULTI-CHIP MODULES

SPLIT BALL GRID ARRAY PAD FOR MULTI-CHIP MODULES

EARLY DECOUPLING CAPACITOR OPTIMIZATION METHOD FOR HIERARCHICAL CIR...

SYSTEM-LEVEL METHOD FOR REDUCING POWER SUPPLY NOISE IN AN ELECTRONI...

Method of Multi-segments Modeling Bond Wire Interconnects with 2D S...

AUTOMATIC VERIFICATION OF ADEQUATE CONDUCTIVE RETURN-CURRENT PATHS

METHOD FOR RAPID RETURN PATH TRACING

INTEGRATED CIRCUIT REDISTRIBUTION PACKAGE