Eric Yakobson

Person

San Juan Capistrano, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and wet chemical compositions for diffusion barrier formation
- Patent number 12,157,944
- Issue date Dec 3, 2024
- MacDermid Enthone Inc.
- Richard W. Hurtubise
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and wet chemical compositions for diffusion barrier formation
- Patent number 11,846,018
- Issue date Dec 19, 2023
- MacDermid Enthone Inc.
- Richard W. Hurtubise
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Cobalt filling of interconnects
- Patent number 11,401,618
- Issue date Aug 2, 2022
- MacDermid Enthone Inc.
- John Commander
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Cobalt filling of interconnects
- Patent number 11,035,048
- Issue date Jun 15, 2021
- MacDermid Enthone Inc.
- John Commander
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Adhesion promotion in printed circuit boards
- Patent number 9,040,117
- Issue date May 26, 2015
- Enthone Inc.
- Abayomi I. Owei
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Adhesion promotion in printed circuit boards
- Patent number 8,142,840
- Issue date Mar 27, 2012
- Enthone Inc.
- Abayomi I. Owei
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Adhesion promotion in printed circuit boards
- Patent number 7,682,432
- Issue date Mar 23, 2010
- Enthone Inc.
- Abayomi I. Owei
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Capping of metal interconnects in integrated circuit electronic dev...
- Patent number 7,393,781
- Issue date Jul 1, 2008
- Enthone Inc.
- Eric Yakobson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cobalt and nickel electroless plating in microelectronic devices
- Patent number 7,332,193
- Issue date Feb 19, 2008
- Enthone, Inc.
- Charles Valverde
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Capping of metal interconnects in integrated circuit electronic dev...
- Patent number 7,268,074
- Issue date Sep 11, 2007
- Enthone, Inc.
- Eric Yakobson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesion promotion in printed circuit boards
- Patent number 7,232,478
- Issue date Jun 19, 2007
- Enthone Inc.
- Abayomi I. Owei
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Resist stripping process
- Patent number 6,440,647
- Issue date Aug 27, 2002
- Alpha Metals, Inc.
- Eric Yakobson
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Cathodic photoresist stripping process
- Patent number 6,436,276
- Issue date Aug 20, 2002
- Polyclad Laminates, Inc.
- Eric Yakobson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Post-treatment for copper on printed circuit boards
- Patent number 6,294,220
- Issue date Sep 25, 2001
- Alpha Metals, Inc.
- Peter T. McGrath
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Method and Wet Chemical Compositions for Diffusion Barrier Formation
- Publication number 20230407467
- Publication date Dec 21, 2023
- MacDermid Enthone Inc.
- Richard W. Hurtubise
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and Wet Chemical Compositions for Diffusion Barrier Formation
- Publication number 20220259724
- Publication date Aug 18, 2022
- MacDermid Enthone Inc.
- Richard W. Hurtubise
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Composition and Method for Fabrication of Nickel Interconnects
- Publication number 20220064811
- Publication date Mar 3, 2022
- MacDermid Enthone Inc.
- Eric Yakobson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Cobalt Filling of Interconnects
- Publication number 20210332491
- Publication date Oct 28, 2021
- MacDermid Enthone Inc.
- John Commander
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Cobalt Filling of Interconnects
- Publication number 20190010624
- Publication date Jan 10, 2019
- MacDermid Enthone Inc.
- John Commander
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ADHESION PROMOTION IN PRINTED CIRCUIT BOARDS
- Publication number 20130078367
- Publication date Mar 28, 2013
- Enthone Inc.
- Abayomi I. Owei
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CAPPING OF METAL INTERCONNECTS IN INTEGRATED CIRCUIT ELECTRONIC DEV...
- Publication number 20070298609
- Publication date Dec 27, 2007
- Enthone Inc.
- Eric Yakobson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESION PROMOTION IN PRINTED CIRCUIT BOARDS
- Publication number 20070228333
- Publication date Oct 4, 2007
- ENTHONE, INC.
- Abayomi I. Owei
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ADHESION PROMOTION IN PRINTED CIRCUIT BOARDS
- Publication number 20070227625
- Publication date Oct 4, 2007
- ENTHONE, INC.
- Abayomi I. Owei
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Cobalt and nickel electroless plating in microelectronic devices
- Publication number 20060083850
- Publication date Apr 20, 2006
- Enthone Inc.
- Charles Valverde
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Capping of metal interconnects in integrated circuit electronic dev...
- Publication number 20050275100
- Publication date Dec 15, 2005
- Enthone Inc.
- Eric Yakobson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Adhesion promotion in printed circuit boards
- Publication number 20050011400
- Publication date Jan 20, 2005
- Abayomi I. Owei
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Eric Yakobson

Person

Patents Grantslast 30 patents

Method and wet chemical compositions for diffusion barrier formation

Method and wet chemical compositions for diffusion barrier formation

Cobalt filling of interconnects

Cobalt filling of interconnects

Adhesion promotion in printed circuit boards

Adhesion promotion in printed circuit boards

Adhesion promotion in printed circuit boards

Capping of metal interconnects in integrated circuit electronic dev...

Cobalt and nickel electroless plating in microelectronic devices

Capping of metal interconnects in integrated circuit electronic dev...

Adhesion promotion in printed circuit boards

Resist stripping process

Cathodic photoresist stripping process

Post-treatment for copper on printed circuit boards

Patents Applicationslast 30 patents

Method and Wet Chemical Compositions for Diffusion Barrier Formation

Method and Wet Chemical Compositions for Diffusion Barrier Formation

Composition and Method for Fabrication of Nickel Interconnects

Cobalt Filling of Interconnects

Cobalt Filling of Interconnects

ADHESION PROMOTION IN PRINTED CIRCUIT BOARDS

CAPPING OF METAL INTERCONNECTS IN INTEGRATED CIRCUIT ELECTRONIC DEV...

ADHESION PROMOTION IN PRINTED CIRCUIT BOARDS

ADHESION PROMOTION IN PRINTED CIRCUIT BOARDS

Cobalt and nickel electroless plating in microelectronic devices

Capping of metal interconnects in integrated circuit electronic dev...

Adhesion promotion in printed circuit boards