Erica C. Elvey

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Owings Mills, MD, US

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Patents Grantslast 30 patents

Information Patent Grant
Method of thinning a semiconductor structure
- Patent number 7,253,083
- Issue date Aug 7, 2007
- Northrop Grumman Corporation
- Rowland C. Clarke
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Novel thinning process for 3 - dimensional integration via wafer bo...
- Publication number 20060286767
- Publication date Dec 21, 2006
- Rowland C. Clarke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayered substrate obtained via wafer bonding for power applica...
- Publication number 20060284167
- Publication date Dec 21, 2006
- Godfrey Augustine
- H01 - BASIC ELECTRIC ELEMENTS