Ernest Norman Levine

Person

Poughkeepsie, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Dual damascene interconnect structure using low stress fluorosilica...
- Patent number 7,034,400
- Issue date Apr 25, 2006
- International Business Machines Corporation
- Edward P. Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked via-stud with improved reliability in copper metallurgy
- Patent number 6,972,209
- Issue date Dec 6, 2005
- International Business Machines Corporation
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-surface fabrication process
- Patent number 6,335,151
- Issue date Jan 1, 2002
- International Business Machines Corporation
- Christopher P. Ausschnitt
- G02 - OPTICS
Information Patent Grant
Adhesion of silicon carbide films
- Patent number 6,252,295
- Issue date Jun 26, 2001
- International Business Machines Corporation
- Donna R. Cote
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Manufacturing methods and uses for micro pipe systems
- Patent number 6,228,744
- Issue date May 8, 2001
- International Business Machines Corporation
- Ernest Norman Levine
- G02 - OPTICS
Information Patent Grant
Manipulation of micromechanical objects
- Patent number 6,199,269
- Issue date Mar 13, 2001
- International Business Machines Corporation
- Nancy Anne Greco
- G02 - OPTICS
Information Patent Grant
Low temperature via fill using liquid phase transport
- Patent number 6,177,348
- Issue date Jan 23, 2001
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a crack stop for interlevel dielectric layers
- Patent number 6,174,814
- Issue date Jan 16, 2001
- International Business Machines Corporation
- Robert F. Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Casting of complex micromechanical objects
- Patent number 6,098,788
- Issue date Aug 8, 2000
- International Business Machines Corporation
- Nancy Anne Greco
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Integrated circuit having crack stop for interlevel dielectric layers
- Patent number 6,091,131
- Issue date Jul 18, 2000
- International Business Machines Corporation
- Robert F. Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal deposition process for metal lines over topography
- Patent number 6,083,823
- Issue date Jul 4, 2000
- International Business Machines Corporation
- Parth P. Dave
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures containing a micro pipe system therein
- Patent number 6,031,286
- Issue date Feb 29, 2000
- International Business Machines Corporation
- Ernest Norman Levine
- G02 - OPTICS
Information Patent Grant
Methods for metal etching with reduced sidewall build up during int...
- Patent number 5,846,884
- Issue date Dec 8, 1998
- Siemens Aktiengesellschaft
- Munir D. Naeem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Energy relieving crack stop
- Patent number 5,834,829
- Issue date Nov 10, 1998
- International Business Machines Corporation
- Bettina A. Dinkel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automated non-visual method of locating periodically arranged sub-m...
- Patent number 5,747,802
- Issue date May 5, 1998
- Siemens Aktiengesellschaft
- Norbert Arnold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for forming improved solder connections for semiconductor d...
- Patent number 4,611,746
- Issue date Sep 16, 1986
- International Business Machines Corporation
- Ernest N. Levine
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Stacked via-stud with improved reliability in copper metallurgy
- Publication number 20060014376
- Publication date Jan 19, 2006
- International Business Machines Corporation
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked via-stud with improved reliability in copper metallurgy
- Publication number 20040101663
- Publication date May 27, 2004
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual damascene interconnect structure using low stress fluorosilica...
- Publication number 20040061235
- Publication date Apr 1, 2004
- Edward P. Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL DAMASCENE INTERCONNECT STRUCTURE USING LOW STRESS FLOUROSILICA...
- Publication number 20020076917
- Publication date Jun 20, 2002
- EDWARD P BARTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal deposition process for metal lines over topography
- Publication number 20020017726
- Publication date Feb 14, 2002
- Parth P. Dave
- H01 - BASIC ELECTRIC ELEMENTS

Ernest Norman Levine

Person

Patents Grantslast 30 patents

Dual damascene interconnect structure using low stress fluorosilica...

Stacked via-stud with improved reliability in copper metallurgy

Micro-surface fabrication process

Adhesion of silicon carbide films

Manufacturing methods and uses for micro pipe systems

Manipulation of micromechanical objects

Low temperature via fill using liquid phase transport

Method for producing a crack stop for interlevel dielectric layers

Casting of complex micromechanical objects

Integrated circuit having crack stop for interlevel dielectric layers

Metal deposition process for metal lines over topography

Semiconductor structures containing a micro pipe system therein

Methods for metal etching with reduced sidewall build up during int...

Energy relieving crack stop

Automated non-visual method of locating periodically arranged sub-m...

Process for forming improved solder connections for semiconductor d...

Patents Applicationslast 30 patents

Stacked via-stud with improved reliability in copper metallurgy

Stacked via-stud with improved reliability in copper metallurgy

Dual damascene interconnect structure using low stress fluorosilica...

DUAL DAMASCENE INTERCONNECT STRUCTURE USING LOW STRESS FLOUROSILICA...

Metal deposition process for metal lines over topography