Errol Todd Ryan

Person

Wappingers Falls, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Devices and methods of forming low resistivity noble metal intercon...
- Patent number 10,679,937
- Issue date Jun 9, 2020
- GLOBALFOUNDRIES Inc.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Skip via structures
- Patent number 10,636,698
- Issue date Apr 28, 2020
- GLOBALFOUNDRIES Inc.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects formed by a metal displacement reaction
- Patent number 10,580,696
- Issue date Mar 3, 2020
- GLOBALFOUNDRIES Inc.
- Sean Xuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via and skip via structures
- Patent number 10,485,111
- Issue date Nov 19, 2019
- GLOBALFOUNDRIES Inc.
- Shao Beng Law
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects formed by a metal replacement process
- Patent number 10,283,372
- Issue date May 7, 2019
- GLOBALFOUNDRIES Inc.
- Sean Xuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Skip via structures
- Patent number 10,262,892
- Issue date Apr 16, 2019
- GLOBALFOUNDRIES Inc.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via and skip via structures
- Patent number 10,199,261
- Issue date Feb 5, 2019
- GLOBALFOUNDRIES Inc.
- James McMahon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liner recess for fully aligned via
- Patent number 10,181,421
- Issue date Jan 15, 2019
- GLOBALFOUNDRIES Inc.
- Errol Todd Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing fully aligned via structures having relaxe...
- Patent number 10,177,028
- Issue date Jan 8, 2019
- GLOBALFOUNDRIES Inc.
- Nicholas V. LiCausi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for recessing a carbon-doped layer of a semiconductor structure
- Patent number 10,170,330
- Issue date Jan 1, 2019
- GLOBALFOUNDRIES Inc.
- Errol Todd Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-mandrel cut formation
- Patent number 10,163,633
- Issue date Dec 25, 2018
- GLOBALFOUNDRIES Inc.
- Shao Beng Law
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallization levels and methods of making thereof
- Patent number 10,134,580
- Issue date Nov 20, 2018
- GLOBALFOUNDRIES Inc.
- Nicholas V. LiCausi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch profile control during skip via formation
- Patent number 10,109,526
- Issue date Oct 23, 2018
- GLOBALFOUNDRIES Inc.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods of forming asymmetric line/space with barrierle...
- Patent number 10,008,408
- Issue date Jun 26, 2018
- GLOBALFOUNDRIES Inc.
- Errol Todd Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods of forming low resistivity noble metal intercon...
- Patent number 9,831,174
- Issue date Nov 28, 2017
- GLOBALFOUNDRIES Inc.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits including modified liners and methods for fabri...
- Patent number 9,613,906
- Issue date Apr 4, 2017
- GLOBALFOUNDRIES, INC.
- Errol Todd Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic material damage process for etching low-K dielectric ma...
- Patent number 9,583,380
- Issue date Feb 28, 2017
- GLOBALFOUNDRIES Inc.
- Errol Todd Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of IC structure with pair of unitary metal fins
- Patent number 9,570,394
- Issue date Feb 14, 2017
- GLOBALFOUNDRIES Inc.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming an improved via to contact interface by selectiv...
- Patent number 9,559,059
- Issue date Jan 31, 2017
- GLOBALFOUNDRIES Inc.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods, apparatus and system for forming a dielectric field for du...
- Patent number 9,530,691
- Issue date Dec 27, 2016
- GLOBALFOUNDRIES Inc.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits and methods for fabricating integrated circuits...
- Patent number 9,520,321
- Issue date Dec 13, 2016
- GLOBALFOUNDRIES, INC.
- Errol Todd Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming an improved via to contact interface by selectiv...
- Patent number 9,466,530
- Issue date Oct 11, 2016
- GLOBALFOUNDRIES Inc.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of optical components in integrated circuits by separat...
- Patent number 9,435,947
- Issue date Sep 6, 2016
- GLOBALFOUNDRIES Inc.
- Errol T Ryan
- G02 - OPTICS
Information Patent Grant
Methods of producing integrated circuits with an air gap
- Patent number 9,431,294
- Issue date Aug 30, 2016
- GLOBALFOUNDRIES, INC.
- Ming He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for defining an isolation region(s) of a semiconductor struc...
- Patent number 9,349,631
- Issue date May 24, 2016
- GLOBALFOUNDRIES Inc.
- Errol Todd Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to etch Cu/Ta/TaN selectively using dilute aqueous HF/H2SO4...
- Patent number 9,343,408
- Issue date May 17, 2016
- Intermolecular, Inc.
- Anh Duong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper based nitride liner passivation layers for conductive copper...
- Patent number 9,318,436
- Issue date Apr 19, 2016
- GLOBALFOUNDRIES Inc.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to etch cu/Ta/TaN selectively using dilute aqueous Hf/hCl so...
- Patent number 9,224,639
- Issue date Dec 29, 2015
- Intermolecular, Inc.
- Anh Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of optical components in integrated circuits
- Patent number 9,209,075
- Issue date Dec 8, 2015
- GLOBALFOUNDRIES Inc.
- Errol T Ryan
- G02 - OPTICS
Information Patent Grant
Method to etch Cu/Ta/TaN selectively using dilute aqueous HF/HCI so...
- Patent number 9,123,785
- Issue date Sep 1, 2015
- Intermolecular, Inc.
- Anh Duong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERCONNECTS FORMED BY A METAL DISPLACEMENT REACTION
- Publication number 20200066585
- Publication date Feb 27, 2020
- GLOBALFOUNDRIES INC.
- Sean Xuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SKIP VIA STRUCTURES
- Publication number 20190221473
- Publication date Jul 18, 2019
- GLOBALFOUNDRIES INC.
- Xunyuan ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTS FORMED BY A METAL REPLACEMENT PROCESS
- Publication number 20190088500
- Publication date Mar 21, 2019
- GLOBALFOUNDRIES INC.
- Sean Xuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA AND SKIP VIA STRUCTURES
- Publication number 20190027401
- Publication date Jan 24, 2019
- GLOBALFOUNDRIES INC.
- James McMahon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LINER RECESS FOR FULLY ALIGNED VIA
- Publication number 20190019726
- Publication date Jan 17, 2019
- GLOBALFOUNDRIES INC.
- Errol Todd RYAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA AND SKIP VIA STRUCTURES
- Publication number 20190021176
- Publication date Jan 17, 2019
- GLOBALFOUNDRIES INC.
- Shao Beng Law
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING FULLY ALIGNED VIA STRUCTURES HAVING RELAXE...
- Publication number 20190013236
- Publication date Jan 10, 2019
- GLOBALFOUNDRIES INC.
- Nicholas V. LiCausi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTS FORMED WITH STRUCTURALLY-MODIFIED CAPS
- Publication number 20190013240
- Publication date Jan 10, 2019
- GLOBALFOUNDRIES INC.
- Nicholas V. LiCausi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-MANDREL CUT FORMATION
- Publication number 20180261457
- Publication date Sep 13, 2018
- GLOBALFOUNDRIES INC.
- Shao Beng Law
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SKIP VIA STRUCTURES
- Publication number 20180130699
- Publication date May 10, 2018
- GLOBALFOUNDRIES INC.
- Xunyuan ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS OF FORMING LOW RESISTIVITY NOBLE METAL INTERCON...
- Publication number 20180040555
- Publication date Feb 8, 2018
- GLOBALFOUNDRIES INC.
- Xunyuan ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS OF FORMING ASYMMETRIC LINE/SPACE WITH BARRIERLE...
- Publication number 20170365509
- Publication date Dec 21, 2017
- GLOBALFOUNDRIES INC.
- Errol Todd RYAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS OF FORMING LOW RESISTIVITY NOBLE METAL INTERCON...
- Publication number 20170345766
- Publication date Nov 30, 2017
- GLOBALFOUNDRIES INC.
- Xunyuan ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS OF FORMING LOW RESISTIVITY NOBLE METAL INTERCON...
- Publication number 20170345752
- Publication date Nov 30, 2017
- GLOBALFOUNDRIES INC.
- Xunyuan ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC MATERIAL DAMAGE PROCESS FOR ETCHING LOW-K DIELECTRIC MA...
- Publication number 20170125288
- Publication date May 4, 2017
- GLOBALFOUNDRIES INC.
- Errol Todd Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS AND METHODS FOR FABRICATING INTEGRATED CIRCUITS...
- Publication number 20160254185
- Publication date Sep 1, 2016
- GLOBALFOUNDRIES, Inc.
- Errol Todd Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR RECESSING A CARBON-DOPED LAYER OF A SEMICONDUCTOR STRUCTURE
- Publication number 20160163559
- Publication date Jun 9, 2016
- GLOBALFOUNDRIES INC.
- Errol Todd Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING AN IMPROVED VIA TO CONTACT INTERFACE BY SELECTIV...
- Publication number 20160126190
- Publication date May 5, 2016
- GLOBALFOUNDRIES INC.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING AN IMPROVED VIA TO CONTACT INTERFACE BY SELECTIV...
- Publication number 20160126135
- Publication date May 5, 2016
- GLOBALFOUNDRIES INC.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS WITH AN AIR GAP AND METHODS OF PRODUCING THE SAME
- Publication number 20160118292
- Publication date Apr 28, 2016
- GLOBALFOUNDRIES, Inc.
- Ming He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DEFINING AN ISOLATION REGION(S) OF A SEMICONDUCTOR STRUC...
- Publication number 20160099168
- Publication date Apr 7, 2016
- GLOBALFOUNDRIES INC.
- Errol Todd Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC MATERIAL DAMAGE PROCESS FOR ETCHING LOW-K DIELECTRIC MA...
- Publication number 20160020140
- Publication date Jan 21, 2016
- GLOBALFOUNDRIES INC.
- Errol Todd Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF OPTICAL COMPONENTS IN INTEGRATED CIRCUITS
- Publication number 20150378096
- Publication date Dec 31, 2015
- GLOBALFOUNDRIES INC.
- Errol T. RYAN
- G02 - OPTICS
Information Patent Application
INTEGRATED CIRCUITS INCLUDING MODIFIED LINERS AND METHODS FOR FABRI...
- Publication number 20150371898
- Publication date Dec 24, 2015
- GLOBAL FOUNDRIES, INC.
- ERROL TODD RYAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to etch cu/Ta/TaN selectively using dilute aqueous Hf/hCl so...
- Publication number 20150348833
- Publication date Dec 3, 2015
- INTERMOLECULAR INC.
- Anh Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PRODUCING INTEGRATED CIRCUITS WITH AN INSULTATING LAYER
- Publication number 20150340274
- Publication date Nov 26, 2015
- GLOBALFOUNDRIES, Inc.
- Errol Todd Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO ETCH CU/TA/TAN SELECTIVELY USING DILUTE AQUEOUS HF/HCL SO...
- Publication number 20150255340
- Publication date Sep 10, 2015
- GLOBALFOUNDRIES, Inc.
- Anh Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
method to etch cu/Ta/TaN selectively using dilute aqueous Hf/h2so4...
- Publication number 20150130065
- Publication date May 14, 2015
- GLOBALFOUNDRIES, INC.
- Anh Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FABRICATING INTEGRATED CIRCUITS USING SURFACE MODIFICAT...
- Publication number 20150126028
- Publication date May 7, 2015
- GLOBALFOUNDRIES, Inc.
- Errol Todd Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF OPTICAL COMPONENTS IN INTEGRATED CIRCUITS
- Publication number 20140374915
- Publication date Dec 25, 2014
- Errol T. RYAN
- G02 - OPTICS

Errol Todd Ryan

Person

Patents Grantslast 30 patents

Devices and methods of forming low resistivity noble metal intercon...

Skip via structures

Interconnects formed by a metal displacement reaction

Via and skip via structures

Interconnects formed by a metal replacement process

Skip via structures

Via and skip via structures

Liner recess for fully aligned via

Method for manufacturing fully aligned via structures having relaxe...

Method for recessing a carbon-doped layer of a semiconductor structure

Non-mandrel cut formation

Metallization levels and methods of making thereof

Etch profile control during skip via formation

Devices and methods of forming asymmetric line/space with barrierle...

Devices and methods of forming low resistivity noble metal intercon...

Integrated circuits including modified liners and methods for fabri...

Anisotropic material damage process for etching low-K dielectric ma...

Formation of IC structure with pair of unitary metal fins

Methods of forming an improved via to contact interface by selectiv...

Methods, apparatus and system for forming a dielectric field for du...

Integrated circuits and methods for fabricating integrated circuits...

Methods of forming an improved via to contact interface by selectiv...

Integration of optical components in integrated circuits by separat...

Methods of producing integrated circuits with an air gap

Method for defining an isolation region(s) of a semiconductor struc...

Method to etch Cu/Ta/TaN selectively using dilute aqueous HF/H2SO4...

Copper based nitride liner passivation layers for conductive copper...

Method to etch cu/Ta/TaN selectively using dilute aqueous Hf/hCl so...

Integration of optical components in integrated circuits

Method to etch Cu/Ta/TaN selectively using dilute aqueous HF/HCI so...

Patents Applicationslast 30 patents

INTERCONNECTS FORMED BY A METAL DISPLACEMENT REACTION

SKIP VIA STRUCTURES

INTERCONNECTS FORMED BY A METAL REPLACEMENT PROCESS

VIA AND SKIP VIA STRUCTURES

LINER RECESS FOR FULLY ALIGNED VIA

VIA AND SKIP VIA STRUCTURES

METHOD FOR MANUFACTURING FULLY ALIGNED VIA STRUCTURES HAVING RELAXE...

INTERCONNECTS FORMED WITH STRUCTURALLY-MODIFIED CAPS

NON-MANDREL CUT FORMATION

SKIP VIA STRUCTURES

DEVICES AND METHODS OF FORMING LOW RESISTIVITY NOBLE METAL INTERCON...

DEVICES AND METHODS OF FORMING ASYMMETRIC LINE/SPACE WITH BARRIERLE...

DEVICES AND METHODS OF FORMING LOW RESISTIVITY NOBLE METAL INTERCON...

DEVICES AND METHODS OF FORMING LOW RESISTIVITY NOBLE METAL INTERCON...

ANISOTROPIC MATERIAL DAMAGE PROCESS FOR ETCHING LOW-K DIELECTRIC MA...

INTEGRATED CIRCUITS AND METHODS FOR FABRICATING INTEGRATED CIRCUITS...

METHOD FOR RECESSING A CARBON-DOPED LAYER OF A SEMICONDUCTOR STRUCTURE

METHODS OF FORMING AN IMPROVED VIA TO CONTACT INTERFACE BY SELECTIV...

METHODS OF FORMING AN IMPROVED VIA TO CONTACT INTERFACE BY SELECTIV...

INTEGRATED CIRCUITS WITH AN AIR GAP AND METHODS OF PRODUCING THE SAME

METHOD FOR DEFINING AN ISOLATION REGION(S) OF A SEMICONDUCTOR STRUC...

ANISOTROPIC MATERIAL DAMAGE PROCESS FOR ETCHING LOW-K DIELECTRIC MA...

INTEGRATION OF OPTICAL COMPONENTS IN INTEGRATED CIRCUITS

INTEGRATED CIRCUITS INCLUDING MODIFIED LINERS AND METHODS FOR FABRI...

Method to etch cu/Ta/TaN selectively using dilute aqueous Hf/hCl so...

METHODS FOR PRODUCING INTEGRATED CIRCUITS WITH AN INSULTATING LAYER

METHOD TO ETCH CU/TA/TAN SELECTIVELY USING DILUTE AQUEOUS HF/HCL SO...

method to etch cu/Ta/TaN selectively using dilute aqueous Hf/h2so4...

METHODS FOR FABRICATING INTEGRATED CIRCUITS USING SURFACE MODIFICAT...

INTEGRATION OF OPTICAL COMPONENTS IN INTEGRATED CIRCUITS