Erwin B. Cohen

Person

South Burlington, VT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Split ball grid array pad for multi-chip modules
- Patent number 10,483,233
- Issue date Nov 19, 2019
- International Business Machines Corporation
- Anson J. Call
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Split ball grid array pad for multi-chip modules
- Patent number 9,633,914
- Issue date Apr 25, 2017
- International Business Machines Corporation
- Anson J. Call
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Land grid array (LGA) socket cartridge and method of forming
- Patent number 9,059,552
- Issue date Jun 16, 2015
- International Business Machines Corporation
- Erwin B. Cohen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making an electronic package
- Patent number 8,806,742
- Issue date Aug 19, 2014
- International Business Machines Corporation
- Erwin B Cohen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Elastic modulus mapping of a chip carrier in a flip chip package
- Patent number 8,756,546
- Issue date Jun 17, 2014
- International Business Machines Corporation
- Erwin B. Cohen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electromagnetic interference shield for semiconductors using a cont...
- Patent number 7,759,168
- Issue date Jul 20, 2010
- International Business Machines Corporation
- J. Richard Behun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of dynamically controlling cache size
- Patent number 7,127,560
- Issue date Oct 24, 2006
- International Business Machines Corporation
- Erwin B. Cohen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Clock dithering system and method during frequency scaling
- Patent number 7,106,110
- Issue date Sep 12, 2006
- International Business Machines Corporation
- Miles G. Canada
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
SPLIT BALL GRID ARRAY PAD FOR MULTI-CHIP MODULES
- Publication number 20170141078
- Publication date May 18, 2017
- International Business Machines Corporation
- Anson J. Call
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPLIT BALL GRID ARRAY PAD FOR MULTI-CHIP MODULES
- Publication number 20170077000
- Publication date Mar 16, 2017
- International Business Machines Corporation
- Anson J. Call
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAND GRID ARRAY (LGA) SOCKET CARTRIDGE AND METHOD OF FORMING
- Publication number 20140206206
- Publication date Jul 24, 2014
- International Business Machines Corporation
- Erwin B. Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELASTIC MODULUS MAPPING OF A CHIP CARRIER IN A FLIP CHIP PACKAGE
- Publication number 20140033148
- Publication date Jan 30, 2014
- International Business Machines Corporation
- Erwin B. Cohen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Electronic Package and Process
- Publication number 20110048795
- Publication date Mar 3, 2011
- International Business Machines Corporation
- Erwin B. Cohen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROMAGNETIC INTERFERENCE SHIELD FOR SEMICONDUCTORS USING A CONT...
- Publication number 20090283876
- Publication date Nov 19, 2009
- International Business Machines Corporation
- J. Richard Behun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER GRID TUNING FOR DC VOLTAGE EQUALIZATION
- Publication number 20080195986
- Publication date Aug 14, 2008
- International Business Machines Corporation
- Erwin B. Cohen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CLOCK DITHERING SYSTEM AND METHOD DURING FREQUENCY SCALING
- Publication number 20060022723
- Publication date Feb 2, 2006
- International Business Machines Corporation
- Miles G. Canada
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF DYNAMICALLY CONTROLLING CACHE SIZE
- Publication number 20050080994
- Publication date Apr 14, 2005
- International Business Machines Corporation
- Erwin B. Cohen
- G06 - COMPUTING CALCULATING COUNTING

Erwin B. Cohen

Person

Patents Grantslast 30 patents

Split ball grid array pad for multi-chip modules

Split ball grid array pad for multi-chip modules

Land grid array (LGA) socket cartridge and method of forming

Method of making an electronic package

Elastic modulus mapping of a chip carrier in a flip chip package

Electromagnetic interference shield for semiconductors using a cont...

Method of dynamically controlling cache size

Clock dithering system and method during frequency scaling

Patents Applicationslast 30 patents

SPLIT BALL GRID ARRAY PAD FOR MULTI-CHIP MODULES

SPLIT BALL GRID ARRAY PAD FOR MULTI-CHIP MODULES

LAND GRID ARRAY (LGA) SOCKET CARTRIDGE AND METHOD OF FORMING

ELASTIC MODULUS MAPPING OF A CHIP CARRIER IN A FLIP CHIP PACKAGE

Electronic Package and Process

ELECTROMAGNETIC INTERFERENCE SHIELD FOR SEMICONDUCTORS USING A CONT...

POWER GRID TUNING FOR DC VOLTAGE EQUALIZATION

CLOCK DITHERING SYSTEM AND METHOD DURING FREQUENCY SCALING

METHOD OF DYNAMICALLY CONTROLLING CACHE SIZE