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Erwin R. Estepa
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Baguio City, PH
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last 30 patents
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Patent Grant
Low cost substrate for an integrated circuit device with bondpads f...
Patent number
6,969,638
Issue date
Nov 29, 2005
Texas Instruments Incorporated
Erwin R. Estepa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
Intermediate Bond Pad for Stacked Semiconductor Chip Package
Publication number
20090206460
Publication date
Aug 20, 2009
Elaine Bautista Reyes
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Singulation Process for Block-Molded Packages
Publication number
20080003718
Publication date
Jan 3, 2008
Erwin Remoblas Estepa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Surface treatment for oxidation removal in integrated circuit packa...
Publication number
20060024974
Publication date
Feb 2, 2006
Texas Instruments, Inc.
Maria Alesssandra Azuri
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Surface treatment for oxidation removal in integrated circuit packa...
Publication number
20050074920
Publication date
Apr 7, 2005
Texas Instruments, Inc.
Erwin R. Estepa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Multi-flip-chip semiconductor assembly
Publication number
20020030261
Publication date
Mar 14, 2002
Ruben A. Rolda
H01 - BASIC ELECTRIC ELEMENTS