Erwin Victor R. Cruz

Person

South Cotabato, PH

People

Patents Grantslast 30 patents

Information Patent Grant
Pre-molded clip structure
- Patent number 8,513,059
- Issue date Aug 20, 2013
- Fairchild Semiconductor Corporation
- Erwin Victor Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package and method for making the same
- Patent number 8,497,164
- Issue date Jul 30, 2013
- Fairchild Semiconductor Corporation
- Armand Vincent C. Jereza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package using leadframe and clip and method of ma...
- Patent number 8,058,107
- Issue date Nov 15, 2011
- Erwin Victor R. Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-molded clip structure
- Patent number 8,008,759
- Issue date Aug 30, 2011
- Fairchild Semiconductor Corporation
- Erwin Victor Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package including exposed connections
- Patent number 7,972,906
- Issue date Jul 5, 2011
- Fairchild Semiconductor Corporation
- Erwin Victor R. Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual metal stud bumping for flip chip applications
- Patent number 7,932,171
- Issue date Apr 26, 2011
- Fairchild Semiconductor Corporation
- Rajeev Joshi
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Pre-molded clip structure
- Patent number 7,838,340
- Issue date Nov 23, 2010
- Fairchild Semiconductor Corporation
- Erwin Victor Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-molded clip structure
- Patent number 7,768,105
- Issue date Aug 3, 2010
- Fairchild Semiconductor Corporation
- Erwin Victor Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual metal stud bumping for flip chip applications
- Patent number 7,501,337
- Issue date Mar 10, 2009
- Fairchild Semiconductor Corporation
- Rajeev Joshi
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Folded frame carrier for MOSFET BGA
- Patent number 7,402,462
- Issue date Jul 22, 2008
- Fairchild Semiconductor Corporation
- Ruben P. Madrid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package using leadframe and clip and method of ma...
- Patent number 7,285,849
- Issue date Oct 23, 2007
- Fairchild Semiconductor Corporation
- Erwin Victor R. Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual metal stud bumping for flip chip applications
- Patent number 7,271,497
- Issue date Sep 18, 2007
- Fairchild Semiconductor Corporation
- Rajeev Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for maintaining solder thickness in flipchip attach packagin...
- Patent number 6,943,434
- Issue date Sep 13, 2005
- Fairchild Semiconductor Corporation
- Consuelo N. Tangpuz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level coated copper stud bumps
- Patent number 6,731,003
- Issue date May 4, 2004
- Fairchild Semiconductor Corporation
- Rajeev Joshi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20120329214
- Publication date Dec 27, 2012
- Armand Vincent C. Jereza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-MOLDED CLIP STRUCTURE
- Publication number 20110272794
- Publication date Nov 10, 2011
- Erwin Victor Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-MOLDED CLIP STRUCTURE
- Publication number 20100258924
- Publication date Oct 14, 2010
- Erwin Victor Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-MOLDED CLIP STRUCTURE
- Publication number 20100258923
- Publication date Oct 14, 2010
- Erwin Victor Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20100193921
- Publication date Aug 5, 2010
- Armand Vincent C. Jereza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE INCLUDING EXPOSED CONNECTIONS
- Publication number 20090224383
- Publication date Sep 10, 2009
- Erwin Victor Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL METAL STUD BUMPING FOR FLIP CHIP APPLICATIONS
- Publication number 20090186452
- Publication date Jul 23, 2009
- Rajeev Joshi
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
SEMICONDUCTOR DIE PACKAGE INCLUDING STAND OFF STRUCTURES
- Publication number 20090057855
- Publication date Mar 5, 2009
- Maria Clemens Quinones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-MOLDED CLIP STRUCTURE
- Publication number 20080173991
- Publication date Jul 24, 2008
- Erwin Victor Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE USING LEADFRAME AND CLIP AND METHOD OF MA...
- Publication number 20080044946
- Publication date Feb 21, 2008
- Erwin Victor R. Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual metal stud bumping for flip chip applications
- Publication number 20060189116
- Publication date Aug 24, 2006
- Rajeev Joshi
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
Method for maintaining solder thickness in flipchip attach packagin...
- Publication number 20050224940
- Publication date Oct 13, 2005
- Consuelo N. Tangpuz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual metal stud bumping for flip chip applications
- Publication number 20040178481
- Publication date Sep 16, 2004
- Rajeev Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for maintaining solder thickness in flipchip attach packagin...
- Publication number 20040130009
- Publication date Jul 8, 2004
- Consuelo N. Tangpuz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer-level coated copper stud bumps
- Publication number 20030173684
- Publication date Sep 18, 2003
- Rajeev Joshi
- H01 - BASIC ELECTRIC ELEMENTS

Erwin Victor R. Cruz

Person

Patents Grantslast 30 patents

Pre-molded clip structure

Semiconductor die package and method for making the same

Semiconductor die package using leadframe and clip and method of ma...

Pre-molded clip structure

Semiconductor die package including exposed connections

Dual metal stud bumping for flip chip applications

Pre-molded clip structure

Pre-molded clip structure

Dual metal stud bumping for flip chip applications

Folded frame carrier for MOSFET BGA

Semiconductor die package using leadframe and clip and method of ma...

Dual metal stud bumping for flip chip applications

Method for maintaining solder thickness in flipchip attach packagin...

Wafer-level coated copper stud bumps

Patents Applicationslast 30 patents

SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME

PRE-MOLDED CLIP STRUCTURE

PRE-MOLDED CLIP STRUCTURE

PRE-MOLDED CLIP STRUCTURE

SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME

SEMICONDUCTOR DIE PACKAGE INCLUDING EXPOSED CONNECTIONS

DUAL METAL STUD BUMPING FOR FLIP CHIP APPLICATIONS

SEMICONDUCTOR DIE PACKAGE INCLUDING STAND OFF STRUCTURES

PRE-MOLDED CLIP STRUCTURE

SEMICONDUCTOR DIE PACKAGE USING LEADFRAME AND CLIP AND METHOD OF MA...

Dual metal stud bumping for flip chip applications

Method for maintaining solder thickness in flipchip attach packagin...

Dual metal stud bumping for flip chip applications

Method for maintaining solder thickness in flipchip attach packagin...

Wafer-level coated copper stud bumps