Etsu Takeuchi

Person

Shinagawa-ku, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Temporary bonding adhesive for a semiconductor wafer and method for...
- Patent number 9,399,725
- Issue date Jul 26, 2016
- Sumitomo Bakelite Co., Ltd.
- Etsu Takeuchi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Directly photodefinable polymer compositions and methods thereof
- Patent number 8,053,515
- Issue date Nov 8, 2011
- Promerus LLC
- Edmund Elce
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Photosensitive dielectric resin compositions, films formed therefro...
- Patent number 7,858,721
- Issue date Dec 28, 2010
- Promerus LLC
- Dino Amoroso
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Photosensitive dielectric resin compositions, films formed therefro...
- Patent number 7,524,594
- Issue date Apr 28, 2009
- Promerus LLC
- Dino Amoroso
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Printed wiring board and semiconductor device and processes to prep...
- Patent number 6,709,804
- Issue date Mar 23, 2004
- Riken
- Yusuke Tajima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
PHOTOSENSITIVE RESIN COMPOSITION, PRINTED WIRING BOARD, SUBSTRATE F...
- Patent number 6,528,231
- Issue date Mar 4, 2003
- Riken
- Yusuke Tajima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for producing two-layered tape for tab
- Patent number 5,507,903
- Issue date Apr 16, 1996
- Sumitomo Bakelite Company Limited
- Yoshiyuki Yamamori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Positive photo-sensitive resin composition comprising a photosensit...
- Patent number 5,449,584
- Issue date Sep 12, 1995
- Sumitomo Bakelite Company, Ltd.
- Toshio Banba
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Photosensitive resin composition and semiconductor apparatus using it
- Patent number 5,385,808
- Issue date Jan 31, 1995
- Sumitomo Bakelite Company Limited
- Akira Tokoh
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Photosensitive resin composition with polyamic acid polymer
- Patent number 5,238,784
- Issue date Aug 24, 1993
- Sumitomo Bakelite Company Limited
- Akira Tokoh
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURE OF LIGHT-EMITTING ELEMENT AND LIGHT-EMITTING...
- Publication number 20130009172
- Publication date Jan 10, 2013
- SUMITOMO BAKELITE CO., LTD.
- Junya Kusunoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC DEVICE, ELECTRONIC DEVICE, METH...
- Publication number 20120228782
- Publication date Sep 13, 2012
- Sumitomo Bakelite Co, Ltd.
- Masakazu Kawata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPORARY BONDING ADHESIVE FOR A SEMICONDUCTOR WAFER AND METHOD FOR...
- Publication number 20110318938
- Publication date Dec 29, 2011
- SUMITOMO BAKELITE CO., LTD.
- Etsu Takeuchi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
TEMPORARY BONDING ADHESIVE FOR A SEMICONDUCTOR WAFER AND METHOD FOR...
- Publication number 20110263095
- Publication date Oct 27, 2011
- SUMITOMO BAKELITE CO., LTD.
- Etsu Takeuchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Photosensitive dielectric resin compositions, films formed therefro...
- Publication number 20090215976
- Publication date Aug 27, 2009
- Promerus LLC
- Dino Amoroso
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
DIRECTLY PHOTODEFINABLE POLYMER COMPOSITIONS AND METHODS THEREOF
- Publication number 20080194740
- Publication date Aug 14, 2008
- Edmund Elce
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Photosensitive dielectric resin compositions, films formed therefro...
- Publication number 20060008734
- Publication date Jan 12, 2006
- Dino Amoroso
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Printed wiring board and semiconductor device and processes to prep...
- Publication number 20030194621
- Publication date Oct 16, 2003
- Riken
- Yusuke Tajima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Etsu Takeuchi

Person

Patents Grantslast 30 patents

Temporary bonding adhesive for a semiconductor wafer and method for...

Directly photodefinable polymer compositions and methods thereof

Photosensitive dielectric resin compositions, films formed therefro...

Photosensitive dielectric resin compositions, films formed therefro...

Printed wiring board and semiconductor device and processes to prep...

PHOTOSENSITIVE RESIN COMPOSITION, PRINTED WIRING BOARD, SUBSTRATE F...

Process for producing two-layered tape for tab

Positive photo-sensitive resin composition comprising a photosensit...

Photosensitive resin composition and semiconductor apparatus using it

Photosensitive resin composition with polyamic acid polymer

Patents Applicationslast 30 patents

METHOD OF MANUFACTURE OF LIGHT-EMITTING ELEMENT AND LIGHT-EMITTING...

METHOD FOR MANUFACTURING ELECTRONIC DEVICE, ELECTRONIC DEVICE, METH...

TEMPORARY BONDING ADHESIVE FOR A SEMICONDUCTOR WAFER AND METHOD FOR...

TEMPORARY BONDING ADHESIVE FOR A SEMICONDUCTOR WAFER AND METHOD FOR...

Photosensitive dielectric resin compositions, films formed therefro...

DIRECTLY PHOTODEFINABLE POLYMER COMPOSITIONS AND METHODS THEREOF

Photosensitive dielectric resin compositions, films formed therefro...

Printed wiring board and semiconductor device and processes to prep...