Etsurou Morita

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer surface measuring apparatus
- Patent number 8,284,395
- Issue date Oct 9, 2012
- Sumco Corporation
- Eiji Kamiyama
- G01 - MEASURING TESTING
Information Patent Grant
Method of manufacturing semiconductor wafer by forming a strain rel...
- Patent number 8,110,486
- Issue date Feb 7, 2012
- Sumco Corporation
- Koji Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing bonded wafer
- Patent number 8,048,769
- Issue date Nov 1, 2011
- Sumco Corporation
- Nobuyuki Morimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of controlling film thinning of semiconductor wafer for soli...
- Patent number 7,960,225
- Issue date Jun 14, 2011
- Sumco Corporation
- Etsurou Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer and method of producing the same
- Patent number 7,951,716
- Issue date May 31, 2011
- Sumco Corporation
- Etsurou Morita
- B24 - GRINDING POLISHING
Information Patent Grant
Method for manufacturing direct bonded SOI wafer and direct bonded...
- Patent number 7,855,129
- Issue date Dec 21, 2010
- Sumco Corporation
- Etsurou Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for regeneration of a layer transferred wafer and regenerat...
- Patent number 7,829,436
- Issue date Nov 9, 2010
- Sumco Corporation
- Etsurou Morita
- B24 - GRINDING POLISHING
Information Patent Grant
Method for manufacturing direct bonded SOI wafer and direct bonded...
- Patent number 7,781,309
- Issue date Aug 24, 2010
- Sumco Corporation
- Etsurou Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon-on insulator substrate and method for manufacturing the same
- Patent number 7,736,998
- Issue date Jun 15, 2010
- Sumco Corporation
- Etsurou Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded wafer and method of producing the same
- Patent number 7,718,507
- Issue date May 18, 2010
- Sumco Corporation
- Etsurou Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing SOI substrate
- Patent number 7,416,960
- Issue date Aug 26, 2008
- Sumco Corporation
- Akihiko Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing SOI substrate
- Patent number 7,364,984
- Issue date Apr 29, 2008
- Sumco Corporation
- Akihiko Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing SOI substrate
- Patent number 7,354,844
- Issue date Apr 8, 2008
- Sumco Corporation
- Akihiko Endo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF CONTROLLING FILM THINNING OF SEMICONDUCTOR WAFER FOR SOLI...
- Publication number 20110136267
- Publication date Jun 9, 2011
- SUMCO CORPORATION
- Etsurou MORITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING DIRECT BONDED SOI WAFER AND DIRECT BONDED...
- Publication number 20100219500
- Publication date Sep 2, 2010
- SUMCO CORPORATION
- Etsurou Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER SURFACE MEASURING APPARATUS
- Publication number 20100201976
- Publication date Aug 12, 2010
- SUMCO CORPORATION
- Eiji KAMIYAMA
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR PRODUCING BONDED WAFER
- Publication number 20100015779
- Publication date Jan 21, 2010
- SUMCO CORPORATION
- Nobuyuki Morimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon-on Insulator Substrate and Method for manufacturing the Same
- Publication number 20080063840
- Publication date Mar 13, 2008
- Etsurou Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing SOI Substrate
- Publication number 20080014716
- Publication date Jan 17, 2008
- Akihiko Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing SOI Substrate
- Publication number 20080014717
- Publication date Jan 17, 2008
- Akihiko Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonded wafer and method of producing the same
- Publication number 20070243694
- Publication date Oct 18, 2007
- Etsurou Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer and method of producing the same
- Publication number 20070197035
- Publication date Aug 23, 2007
- SUMCO CORPORATION
- Etsurou Morita
- B24 - GRINDING POLISHING
Information Patent Application
Method of producing semiconductor wafer
- Publication number 20070166929
- Publication date Jul 19, 2007
- SUMCO CORPORATION
- Koji Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing Direct Bonded SOI Wafer and Direct Bonded...
- Publication number 20070148912
- Publication date Jun 28, 2007
- Etsurou Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for Regeneration of a Layer Transferred Wafer and Regenerat...
- Publication number 20070148914
- Publication date Jun 28, 2007
- Etsurou Morita
- B24 - GRINDING POLISHING
Information Patent Application
Process for Regeneration of a Layer Transferred Wafer and Regenerat...
- Publication number 20070148917
- Publication date Jun 28, 2007
- SUMCO CORPORATION
- Etsurou Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing SOI substrate
- Publication number 20060177993
- Publication date Aug 10, 2006
- Akihiko Endo
- H01 - BASIC ELECTRIC ELEMENTS

Etsurou Morita

Person

Patents Grantslast 30 patents

Wafer surface measuring apparatus

Method of manufacturing semiconductor wafer by forming a strain rel...

Method for producing bonded wafer

Method of controlling film thinning of semiconductor wafer for soli...

Wafer and method of producing the same

Method for manufacturing direct bonded SOI wafer and direct bonded...

Process for regeneration of a layer transferred wafer and regenerat...

Method for manufacturing direct bonded SOI wafer and direct bonded...

Silicon-on insulator substrate and method for manufacturing the same

Bonded wafer and method of producing the same

Method for manufacturing SOI substrate

Method for manufacturing SOI substrate

Method for manufacturing SOI substrate

Patents Applicationslast 30 patents

METHOD OF CONTROLLING FILM THINNING OF SEMICONDUCTOR WAFER FOR SOLI...

METHOD FOR MANUFACTURING DIRECT BONDED SOI WAFER AND DIRECT BONDED...

WAFER SURFACE MEASURING APPARATUS

METHOD FOR PRODUCING BONDED WAFER

Silicon-on Insulator Substrate and Method for manufacturing the Same

Method for Manufacturing SOI Substrate

Method for Manufacturing SOI Substrate

Bonded wafer and method of producing the same

Wafer and method of producing the same

Method of producing semiconductor wafer

Method for Manufacturing Direct Bonded SOI Wafer and Direct Bonded...

Process for Regeneration of a Layer Transferred Wafer and Regenerat...

Process for Regeneration of a Layer Transferred Wafer and Regenerat...

Method for manufacturing SOI substrate