Eun Row

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for depositing a thin film adhesion layer
- Patent number 7,300,556
- Issue date Nov 27, 2007
- Hitachi Global Storage Technologies Netherlands B.V.
- Cherngye Hwang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Planarization method for a structure having a first surface for etc...
- Patent number 7,263,763
- Issue date Sep 4, 2007
- International Business Machines Corporation
- Qing Dai
- G11 - INFORMATION STORAGE
Information Patent Grant
Planarization in an encapsulation process for thin film surfaces
- Patent number 7,223,350
- Issue date May 29, 2007
- International Business Machines Corporation
- Ping-Wei Chang
- G11 - INFORMATION STORAGE
Information Patent Grant
Planarization process for thin film surfaces
- Patent number 6,922,890
- Issue date Aug 2, 2005
- International Business Machines Corporation
- Qing Dai
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of fabricating slider pads for a transducer operating with m...
- Patent number 6,793,778
- Issue date Sep 21, 2004
- Hitachi Global Storage Technologies Netherlands N.V.
- Detlef Gador
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for grading surface topography for improved step coverage an...
- Patent number 6,569,295
- Issue date May 27, 2003
- International Business Machines Corporation
- Cherngye Hwang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Vibration damper for a multiple disk drive unit
- Patent number 5,422,767
- Issue date Jun 6, 1995
- International Business Machines Corporation
- Michael R. Hatchett
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
IMPROVED PLANARIZATION PROCESS FOR PRODUCING CARRIERS WITH LOW STEP...
- Publication number 20060232886
- Publication date Oct 19, 2006
- Ping-Wei Chang
- G11 - INFORMATION STORAGE
Information Patent Application
Planarization process for thin film surfaces
- Publication number 20050235485
- Publication date Oct 27, 2005
- Qing Dai
- G11 - INFORMATION STORAGE
Information Patent Application
Method for depositing a thin film adhesion layer
- Publication number 20050045468
- Publication date Mar 3, 2005
- Cherngye Hwang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Planarization process for thin film surfaces
- Publication number 20040093719
- Publication date May 20, 2004
- Qing Dai
- G11 - INFORMATION STORAGE
Information Patent Application
Method of fabricating slider pads for a transducer operating with m...
- Publication number 20040007454
- Publication date Jan 15, 2004
- Detlef Gador
- G11 - INFORMATION STORAGE
Information Patent Application
Planarization in an encapsulation process for thin film surfaces
- Publication number 20030184917
- Publication date Oct 2, 2003
- Ping-Wei Chang
- G11 - INFORMATION STORAGE
Information Patent Application
Method for grading surface topography for improved step coverage an...
- Publication number 20020134672
- Publication date Sep 26, 2002
- Cherngye Hwang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Person

Patents Grantslast 30 patents

Method for depositing a thin film adhesion layer

Planarization method for a structure having a first surface for etc...

Planarization in an encapsulation process for thin film surfaces

Planarization process for thin film surfaces

Method of fabricating slider pads for a transducer operating with m...

Method for grading surface topography for improved step coverage an...

Vibration damper for a multiple disk drive unit

Patents Applicationslast 30 patents

IMPROVED PLANARIZATION PROCESS FOR PRODUCING CARRIERS WITH LOW STEP...

Planarization process for thin film surfaces

Method for depositing a thin film adhesion layer

Planarization process for thin film surfaces

Method of fabricating slider pads for a transducer operating with m...

Planarization in an encapsulation process for thin film surfaces

Method for grading surface topography for improved step coverage an...