Evelyn Napetschnig

Person

Diex, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including bonding pad metal layer structure
- Patent number 12,183,696
- Issue date Dec 31, 2024
- Infineon Technologies AG
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming a chip package
- Patent number 12,040,288
- Issue date Jul 16, 2024
- Infineon Technologies AG
- Harry Walter Sax
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a solder compound containing a compo...
- Patent number 11,776,927
- Issue date Oct 3, 2023
- Infineon Technologies AG
- Thomas Behrens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device including bonding pad metal layer structure
- Patent number 11,764,176
- Issue date Sep 19, 2023
- Infineon Technologies AG
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming a chip package
- Patent number 11,735,534
- Issue date Aug 22, 2023
- Infineon Technologies AG
- Harry Walter Sax
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device, electronic module and methods for fabricating th...
- Patent number 11,615,963
- Issue date Mar 28, 2023
- Infineon Technologies AG
- Paul Frank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of producing a semiconductor device
- Patent number 11,501,979
- Issue date Nov 15, 2022
- Infineon Technologies Austria AG
- Markus Beninger-Bina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an aluminum oxide layer, metal surface with alumi...
- Patent number 11,424,201
- Issue date Aug 23, 2022
- Infineon Technologies AG
- Michael Rogalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate having a bond pad material based on aluminum
- Patent number 11,410,950
- Issue date Aug 9, 2022
- Infineon Technologies AG
- Gert Pfahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component and method of manufacturing a component using an ultrathi...
- Patent number 11,367,654
- Issue date Jun 21, 2022
- Infineon Technologies AG
- Karl Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a solder compound containing a compo...
- Patent number 11,069,644
- Issue date Jul 20, 2021
- Infineon Technologies AG
- Thomas Behrens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip arrangements
- Patent number 10,930,614
- Issue date Feb 23, 2021
- Infineon Technologies AG
- Manfred Mengel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Porous Cu on Cu surface for semiconductor packages
- Patent number 10,914,018
- Issue date Feb 9, 2021
- Infineon Technologies AG
- Norbert Pielmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device, electronic module and methods for fabricating th...
- Patent number 10,741,402
- Issue date Aug 11, 2020
- Infineon Technologies AG
- Paul Frank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder metallization stack and methods of formation thereof
- Patent number 10,573,611
- Issue date Feb 25, 2020
- Infineon Technologies AG
- Kamil Karlovsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a semiconductor region and an electronic device
- Patent number 10,276,362
- Issue date Apr 30, 2019
- Infineon Technologies AG
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of forming thereof
- Patent number 10,262,959
- Issue date Apr 16, 2019
- Infineon Technologies AG
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component and method of manufacturing a component using an ultrathi...
- Patent number 10,186,458
- Issue date Jan 22, 2019
- Infineon Technologies AG
- Karl Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder metallization stack and methods of formation thereof
- Patent number 10,115,688
- Issue date Oct 30, 2018
- Infineon Technologies AG
- Kamil Karlovsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder alloys and arrangements
- Patent number 9,735,126
- Issue date Aug 15, 2017
- Infineon Technologies AG
- Manfred Mengel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for processing a semiconductor workpiece and semiconductor w...
- Patent number 9,627,335
- Issue date Apr 18, 2017
- Infineon Technologies AG
- Stephan Henneck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of forming thereof
- Patent number 9,484,316
- Issue date Nov 1, 2016
- Infineon Technologies AG
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside processing of semiconductor devices
- Patent number 8,866,299
- Issue date Oct 21, 2014
- Infineon Technologies AG
- Mark Harrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside processing of semiconductor devices
- Patent number 8,487,440
- Issue date Jul 16, 2013
- Infineon Technologies AG
- Mark Harrison
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE
- Publication number 20240371796
- Publication date Nov 7, 2024
- INFINEON TECHNOLOGIES AG
- Harry Walter SAX
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, BATTERY MANAGEMENT SYSTEM AND METHOD OF PRODU...
- Publication number 20240030502
- Publication date Jan 25, 2024
- Infineon Technologies Austria AG
- Christian Ranacher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE
- Publication number 20230395532
- Publication date Dec 7, 2023
- INFINEON TECHNOLOGIES AG
- Harry Walter SAX
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Including Bonding Pad Metal Layer Structure
- Publication number 20230395539
- Publication date Dec 7, 2023
- INFINEON TECHNOLOGIES AG
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component and Method of Manufacturing a Component Using an Ultrathi...
- Publication number 20220246475
- Publication date Aug 4, 2022
- INFINEON TECHNOLOGIES AG
- Karl Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A SOLDER COMPOUND CONTAINING A COMPO...
- Publication number 20220216173
- Publication date Jul 7, 2022
- INFINEON TECHNOLOGIES AG
- Thomas Behrens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device Including Bonding Pad Metal Layer Structure
- Publication number 20220059477
- Publication date Feb 24, 2022
- INFINEON TECHNOLOGIES AG
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE
- Publication number 20210375792
- Publication date Dec 2, 2021
- INFINEON TECHNOLOGIES AG
- Harry Walter SAX
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENTS
- Publication number 20210167034
- Publication date Jun 3, 2021
- INFINEON TECHNOLOGIES AG
- Manfred MENGEL
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Substrate Having a Bond Pad Material Based on Aluminum
- Publication number 20210091025
- Publication date Mar 25, 2021
- INFINEON TECHNOLOGIES AG
- Gert Pfahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, ELECTRONIC MODULE AND METHODS FOR FABRICATING TH...
- Publication number 20200343094
- Publication date Oct 29, 2020
- INFINEON TECHNOLOGIES AG
- Paul Frank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Porous Cu on Cu Surface for Semiconductor Packages
- Publication number 20200291538
- Publication date Sep 17, 2020
- INFINEON TECHNOLOGIES AG
- Norbert Pielmeier
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A SOLDER COMPOUND CONTAINING A COMPO...
- Publication number 20200105704
- Publication date Apr 2, 2020
- INFINEON TECHNOLOGIES AG
- Thomas Behrens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Adhesion Enhancing Structures for a Package
- Publication number 20200043876
- Publication date Feb 6, 2020
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component and Method of Manufacturing a Component Using an Ultrathi...
- Publication number 20190148233
- Publication date May 16, 2019
- INFINEON TECHNOLOGIES AG
- Karl Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder Metallization Stack and Methods of Formation Thereof
- Publication number 20190051624
- Publication date Feb 14, 2019
- INFINEON TECHNOLOGIES AG
- Kamil Karlovsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming an Aluminum Oxide Layer, Metal Surface with Alumi...
- Publication number 20180366427
- Publication date Dec 20, 2018
- INFINEON TECHNOLOGIES AG
- Michael Rogalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, ELECTRONIC MODULE AND METHODS FOR FABRICATING TH...
- Publication number 20180082848
- Publication date Mar 22, 2018
- INFINEON TECHNOLOGIES AG
- Paul Frank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENTS
- Publication number 20170323865
- Publication date Nov 9, 2017
- INFINEON TECHNOLOGIES AG
- Manfred MENGEL
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
METHOD FOR PROCESSING A SEMICONDUCTOR REGION AND AN ELECTRONIC DEVICE
- Publication number 20170316934
- Publication date Nov 2, 2017
- INFINEON TECHNOLOGIES AG
- Evelyn NAPETSCHNIG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Forming Thereof
- Publication number 20170033066
- Publication date Feb 2, 2017
- INFINEON TECHNOLOGIES AG
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder Metallization Stack and Methods of Formation Thereof
- Publication number 20160351516
- Publication date Dec 1, 2016
- INFINEON TECHNOLOGIES AG
- Kamil Karlovsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Processing a Semiconductor Workpiece and Semiconductor W...
- Publication number 20150325535
- Publication date Nov 12, 2015
- INFINEON TECHNOLOGIES AG
- Stephan HENNECK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYER STACKS AND INTEGRATED CIRCUIT ARRANGEMENTS
- Publication number 20150228607
- Publication date Aug 13, 2015
- INFINEON TECHNOLOGIES AG
- Tobias Schmidt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Forming Thereof
- Publication number 20150123264
- Publication date May 7, 2015
- INFINEON TECHNOLOGIES AG
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Backside Processing of Semiconductor Devices
- Publication number 20140015141
- Publication date Jan 16, 2014
- Infineon Technoloiges AG
- Mark Harrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component and Method of Manufacturing a Component Using an Ultrathi...
- Publication number 20140008805
- Publication date Jan 9, 2014
- INFINEON TECHNOLOGIES AG
- Karl Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER ALLOYS AND ARRANGEMENTS
- Publication number 20120313230
- Publication date Dec 13, 2012
- INFINEON TECHNOLOGIES AG
- Manfred MENGEL
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
LAYER STACKS AND INTEGRATED CIRCUIT ARRANGEMENTS
- Publication number 20120068345
- Publication date Mar 22, 2012
- INFINEON TECHNOLOGIES AG
- Tobias Schmidt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Backside Processing of Semiconductor Devices
- Publication number 20120007244
- Publication date Jan 12, 2012
- Mark Harrison
- H01 - BASIC ELECTRIC ELEMENTS

Evelyn Napetschnig

Person

Patents Grantslast 30 patents

Semiconductor device including bonding pad metal layer structure

Chip package and method of forming a chip package

Semiconductor device including a solder compound containing a compo...

Semiconductor device including bonding pad metal layer structure

Chip package and method of forming a chip package

Electronic device, electronic module and methods for fabricating th...

Semiconductor device and method of producing a semiconductor device

Method of forming an aluminum oxide layer, metal surface with alumi...

Semiconductor substrate having a bond pad material based on aluminum

Component and method of manufacturing a component using an ultrathi...

Semiconductor device including a solder compound containing a compo...

Chip arrangements

Porous Cu on Cu surface for semiconductor packages

Electronic device, electronic module and methods for fabricating th...

Solder metallization stack and methods of formation thereof

Method for processing a semiconductor region and an electronic device

Semiconductor devices and methods of forming thereof

Component and method of manufacturing a component using an ultrathi...

Solder metallization stack and methods of formation thereof

Solder alloys and arrangements

Method for processing a semiconductor workpiece and semiconductor w...

Semiconductor devices and methods of forming thereof

Backside processing of semiconductor devices

Backside processing of semiconductor devices

Patents Applicationslast 30 patents

CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE

SEMICONDUCTOR DEVICE, BATTERY MANAGEMENT SYSTEM AND METHOD OF PRODU...

CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE

Semiconductor Device Including Bonding Pad Metal Layer Structure

Component and Method of Manufacturing a Component Using an Ultrathi...

SEMICONDUCTOR DEVICE INCLUDING A SOLDER COMPOUND CONTAINING A COMPO...

Semiconductor Device Including Bonding Pad Metal Layer Structure

CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE

CHIP ARRANGEMENTS

Semiconductor Substrate Having a Bond Pad Material Based on Aluminum

ELECTRONIC DEVICE, ELECTRONIC MODULE AND METHODS FOR FABRICATING TH...

Porous Cu on Cu Surface for Semiconductor Packages

SEMICONDUCTOR DEVICE INCLUDING A SOLDER COMPOUND CONTAINING A COMPO...

Adhesion Enhancing Structures for a Package

Component and Method of Manufacturing a Component Using an Ultrathi...

Solder Metallization Stack and Methods of Formation Thereof

Method of Forming an Aluminum Oxide Layer, Metal Surface with Alumi...

ELECTRONIC DEVICE, ELECTRONIC MODULE AND METHODS FOR FABRICATING TH...

CHIP ARRANGEMENTS

METHOD FOR PROCESSING A SEMICONDUCTOR REGION AND AN ELECTRONIC DEVICE

Semiconductor Devices and Methods of Forming Thereof

Solder Metallization Stack and Methods of Formation Thereof

Method for Processing a Semiconductor Workpiece and Semiconductor W...

LAYER STACKS AND INTEGRATED CIRCUIT ARRANGEMENTS

Semiconductor Devices and Methods of Forming Thereof

Backside Processing of Semiconductor Devices

Component and Method of Manufacturing a Component Using an Ultrathi...

SOLDER ALLOYS AND ARRANGEMENTS

LAYER STACKS AND INTEGRATED CIRCUIT ARRANGEMENTS

Backside Processing of Semiconductor Devices