Everett Allen McTeer

Person

Eagle, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Memories having vertically stacked conductive filled structures
- Patent number 12,114,492
- Issue date Oct 8, 2024
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assemblies which include wordlines having a first metal-containing...
- Patent number 12,034,057
- Issue date Jul 9, 2024
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses including a conductive contact including a dielectric m...
- Patent number 12,002,759
- Issue date Jun 4, 2024
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assemblies having conductive structures with three or more differen...
- Patent number 11,990,528
- Issue date May 21, 2024
- David Ross Economy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices including staircase structures, and related...
- Patent number 11,894,305
- Issue date Feb 6, 2024
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tungsten structures and methods of forming the structures
- Patent number 11,791,268
- Issue date Oct 17, 2023
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive interconnects
- Patent number 11,742,282
- Issue date Aug 29, 2023
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assemblies having conductive structures with three or more differen...
- Patent number 11,705,500
- Issue date Jul 18, 2023
- Micron Technology, Inc.
- David Ross Economy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices comprising threshold switching materials
- Patent number 11,672,191
- Issue date Jun 6, 2023
- Micron Technology, Inc.
- Tsz W. Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices including conductive levels having varying...
- Patent number 11,594,495
- Issue date Feb 28, 2023
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and electronic systems including an etch stop...
- Patent number 11,527,548
- Issue date Dec 13, 2022
- Micron Technology, Inc.
- Haoyu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming microelectronic devices, and related microelectr...
- Patent number 11,393,756
- Issue date Jul 19, 2022
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus including a dielectric material in a central portion of a...
- Patent number 11,342,265
- Issue date May 24, 2022
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming microelectronic devices, and related microelectr...
- Patent number 11,315,877
- Issue date Apr 26, 2022
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tungsten structures and methods of forming the structures
- Patent number 11,244,903
- Issue date Feb 8, 2022
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assemblies which include wordlines having a first metal-containing...
- Patent number 11,158,718
- Issue date Oct 26, 2021
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ohmic contacts for semiconductor structures
- Patent number 10,998,481
- Issue date May 4, 2021
- Micron Technology, Inc.
- Yongjun Jeff Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assemblies having conductive structures with three or more differen...
- Patent number 10,957,775
- Issue date Mar 23, 2021
- Micron Technology, Inc.
- David Ross Economy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated structures with conductive regions having at least one e...
- Patent number 10,957,644
- Issue date Mar 23, 2021
- Micron Technology, Inc.
- Christopher W. Petz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming integrated assemblies
- Patent number 10,943,921
- Issue date Mar 9, 2021
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming memory cells and memory devices
- Patent number 10,923,657
- Issue date Feb 16, 2021
- Micron Technology, Inc.
- Tsz W. Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assemblies having vertically-extending structures, and methods of f...
- Patent number 10,916,564
- Issue date Feb 9, 2021
- Micron Technology, Inc.
- David Ross Economy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of filling openings with conductive material, and assemblie...
- Patent number 10,840,255
- Issue date Nov 17, 2020
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate stacks
- Patent number 10,777,651
- Issue date Sep 15, 2020
- Micron Technology, Inc.
- Yushi Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source material for electronic device applications
- Patent number 10,731,273
- Issue date Aug 4, 2020
- Micron Technology, Inc.
- John Mark Meldrim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Phase change memory stack with treated sidewalls
- Patent number 10,720,574
- Issue date Jul 21, 2020
- Micron Technology, Inc.
- Tsz W. Chan
- G11 - INFORMATION STORAGE
Information Patent Grant
Assemblies having vertically-extending structures, and methods of f...
- Patent number 10,700,091
- Issue date Jun 30, 2020
- Micron Technology, Inc.
- David Ross Economy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Variable resistance memory stack with treated sidewalls
- Patent number 10,692,572
- Issue date Jun 23, 2020
- Micron Technology, Inc.
- Yongjun Jeff Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of filling horizontally-extending openings of integrated as...
- Patent number 10,573,661
- Issue date Feb 25, 2020
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assemblies having vertically-stacked conductive structures
- Patent number 10,559,579
- Issue date Feb 11, 2020
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUSES INCLUDING INTERCONNECT STRUCTURES INCLUDING DIELECTRIC...
- Publication number 20240290722
- Publication date Aug 29, 2024
- Lodestar Licensing Group LLC
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING STAIRCASE STRUCTURES, AND RELATED...
- Publication number 20240153877
- Publication date May 9, 2024
- Lodestar Licensing Group LLC
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...
- Publication number 20230395149
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES COMPRISING A BORON-CONTAINING MATERIAL, AND...
- Publication number 20230397424
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Jordan D. Greenlee
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING STACK STRUCTURES HAVING DOPED INT...
- Publication number 20230387229
- Publication date Nov 30, 2023
- Everett A. McTeer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Circuitry And Method Used In Forming Memory Circuitry
- Publication number 20230389313
- Publication date Nov 30, 2023
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES AND MEMORY DEVICES INCLUDING CONDUCTIVE LEV...
- Publication number 20230154856
- Publication date May 18, 2023
- Micron Technology, Inc.
- Jordan D. Greenlee
- G11 - INFORMATION STORAGE
Information Patent Application
Assemblies Having Conductive Structures with Three or More Differen...
- Publication number 20230121315
- Publication date Apr 20, 2023
- Micron Technology, Inc.
- David Ross Economy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transistor And Memory Circuitry Comprising Strings Of Memory Cells
- Publication number 20230016742
- Publication date Jan 19, 2023
- Micron Technology, Inc.
- Daniel Billingsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING CONDUCTIVE LEVELS HAVING VARYING...
- Publication number 20220310522
- Publication date Sep 29, 2022
- Micron Technology, Inc.
- Jordan D. Greenlee
- G11 - INFORMATION STORAGE
Information Patent Application
MEMORY DEVICE INCLUDING CONTROL GATES HAVING TUNGSTEN STRUCTURE
- Publication number 20220310524
- Publication date Sep 29, 2022
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE INCLUDING CONTROL GATES HAVING TUNGSTEN STRUCTURE
- Publication number 20220310525
- Publication date Sep 29, 2022
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...
- Publication number 20220302032
- Publication date Sep 22, 2022
- Micron Technology Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES INCLUDING A CONDUCTIVE CONTACT INCLUDING A DIELECTRIC M...
- Publication number 20220254727
- Publication date Aug 11, 2022
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING STAIRCASE STRUCTURES, AND RELATED...
- Publication number 20220238444
- Publication date Jul 28, 2022
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNGSTEN STRUCTURES AND METHODS OF FORMING THE STRUCTURES
- Publication number 20220230962
- Publication date Jul 21, 2022
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Interconnects
- Publication number 20220044999
- Publication date Feb 10, 2022
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assemblies Which Include Wordlines Having a First Metal-Containing...
- Publication number 20220028996
- Publication date Jan 27, 2022
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...
- Publication number 20210287990
- Publication date Sep 16, 2021
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...
- Publication number 20210287989
- Publication date Sep 16, 2021
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OHMIC CONTACTS FOR SEMICONDUCTOR STRUCTURES
- Publication number 20210257526
- Publication date Aug 19, 2021
- Micron Technology, Inc.
- Yongjun Jeff Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNGSTEN STRUCTURES AND METHODS OF FORMING THE STRUCTURES
- Publication number 20210202388
- Publication date Jul 1, 2021
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assemblies Having Conductive Structures with Three or More Differen...
- Publication number 20210202710
- Publication date Jul 1, 2021
- Micron Technology, Inc.
- David Ross Economy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS INCLUDING A DIELECTRIC MATERIAL IN A CENTRAL PORTION OF A...
- Publication number 20210167020
- Publication date Jun 3, 2021
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES COMPRISING THRESHOLD SWITCHING MATERIALS
- Publication number 20210151676
- Publication date May 20, 2021
- Micron Technology, Inc.
- Tsz W. Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Filling Openings with Conductive Material, and Assemblie...
- Publication number 20210066332
- Publication date Mar 4, 2021
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assemblies Having Conductive Structures with Three or More Differen...
- Publication number 20210005732
- Publication date Jan 7, 2021
- Micron Technology, Inc.
- David Ross Economy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assemblies Which Include Wordlines Having a First Metal-Containing...
- Publication number 20200328284
- Publication date Oct 15, 2020
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assemblies Having Vertically-Extending Structures, and Methods of F...
- Publication number 20200266210
- Publication date Aug 20, 2020
- Micron Technology, Inc.
- David Ross Economy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND ELECTRONIC SYSTEMS INCLUDING AN ETCH STOP...
- Publication number 20200185406
- Publication date Jun 11, 2020
- Micron Technology, Inc.
- Haoyu Li
- H01 - BASIC ELECTRIC ELEMENTS

Everett Allen McTeer

Person

Patents Grantslast 30 patents

Memories having vertically stacked conductive filled structures

Assemblies which include wordlines having a first metal-containing...

Apparatuses including a conductive contact including a dielectric m...

Assemblies having conductive structures with three or more differen...

Microelectronic devices including staircase structures, and related...

Tungsten structures and methods of forming the structures

Conductive interconnects

Assemblies having conductive structures with three or more differen...

Semiconductor devices comprising threshold switching materials

Microelectronic devices including conductive levels having varying...

Semiconductor devices and electronic systems including an etch stop...

Methods of forming microelectronic devices, and related microelectr...

Apparatus including a dielectric material in a central portion of a...

Methods of forming microelectronic devices, and related microelectr...

Tungsten structures and methods of forming the structures

Assemblies which include wordlines having a first metal-containing...

Ohmic contacts for semiconductor structures

Assemblies having conductive structures with three or more differen...

Integrated structures with conductive regions having at least one e...

Methods of forming integrated assemblies

Methods of forming memory cells and memory devices

Assemblies having vertically-extending structures, and methods of f...

Methods of filling openings with conductive material, and assemblie...

Gate stacks

Source material for electronic device applications

Phase change memory stack with treated sidewalls

Assemblies having vertically-extending structures, and methods of f...

Variable resistance memory stack with treated sidewalls

Methods of filling horizontally-extending openings of integrated as...

Assemblies having vertically-stacked conductive structures

Patents Applicationslast 30 patents

APPARATUSES INCLUDING INTERCONNECT STRUCTURES INCLUDING DIELECTRIC...

MICROELECTRONIC DEVICES INCLUDING STAIRCASE STRUCTURES, AND RELATED...

Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...

MICROELECTRONIC DEVICES COMPRISING A BORON-CONTAINING MATERIAL, AND...

MICROELECTRONIC DEVICES INCLUDING STACK STRUCTURES HAVING DOPED INT...

Memory Circuitry And Method Used In Forming Memory Circuitry

MICROELECTRONIC DEVICES AND MEMORY DEVICES INCLUDING CONDUCTIVE LEV...

Assemblies Having Conductive Structures with Three or More Differen...

Transistor And Memory Circuitry Comprising Strings Of Memory Cells

MICROELECTRONIC DEVICES INCLUDING CONDUCTIVE LEVELS HAVING VARYING...

MEMORY DEVICE INCLUDING CONTROL GATES HAVING TUNGSTEN STRUCTURE

MEMORY DEVICE INCLUDING CONTROL GATES HAVING TUNGSTEN STRUCTURE

METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...

APPARATUSES INCLUDING A CONDUCTIVE CONTACT INCLUDING A DIELECTRIC M...

MICROELECTRONIC DEVICES INCLUDING STAIRCASE STRUCTURES, AND RELATED...

TUNGSTEN STRUCTURES AND METHODS OF FORMING THE STRUCTURES

Conductive Interconnects

Assemblies Which Include Wordlines Having a First Metal-Containing...

METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...

METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...

OHMIC CONTACTS FOR SEMICONDUCTOR STRUCTURES

TUNGSTEN STRUCTURES AND METHODS OF FORMING THE STRUCTURES

Assemblies Having Conductive Structures with Three or More Differen...

APPARATUS INCLUDING A DIELECTRIC MATERIAL IN A CENTRAL PORTION OF A...

SEMICONDUCTOR DEVICES COMPRISING THRESHOLD SWITCHING MATERIALS

Methods of Filling Openings with Conductive Material, and Assemblie...

Assemblies Having Conductive Structures with Three or More Differen...

Assemblies Which Include Wordlines Having a First Metal-Containing...

Assemblies Having Vertically-Extending Structures, and Methods of F...

SEMICONDUCTOR DEVICES AND ELECTRONIC SYSTEMS INCLUDING AN ETCH STOP...