Fabian Radulescu

Person

Chapel Hill, NC, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with isolation and/or protection structures
- Patent number 11,887,945
- Issue date Jan 30, 2024
- Wolfspeed, Inc.
- Lei Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field effect transistors with modified access regions
- Patent number 11,869,964
- Issue date Jan 9, 2024
- Wolfspeed, Inc.
- Kyoung-Keun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for pillar connection on frontside and passive device integ...
- Patent number 11,842,997
- Issue date Dec 12, 2023
- Wolfspeed, Inc.
- Terry Alcorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for pillar connection on frontside and passive device integ...
- Patent number 11,769,768
- Issue date Sep 26, 2023
- Wolfspeed, Inc.
- Terry Alcorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor having a backside wafer cavity for radio frequency (R...
- Patent number 11,735,538
- Issue date Aug 22, 2023
- Wolfspeed, Inc.
- Fabian Radulescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electronic circuits having moisture protection encapsulati...
- Patent number 11,682,634
- Issue date Jun 20, 2023
- Wolfspeed, Inc.
- Kyle Bothe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field effect transistor with enhanced reliability
- Patent number 11,658,234
- Issue date May 23, 2023
- Wolfspeed, Inc.
- Kyle Bothe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for pillar connection on frontside and passive device integ...
- Patent number 11,646,310
- Issue date May 9, 2023
- Wolfspeed, Inc.
- Terry Alcorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-to-die isolation structures for packaged transistor devices
- Patent number 11,621,322
- Issue date Apr 4, 2023
- Wolfspeed, Inc.
- Lei Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High electron mobility transistors and power amplifiers including s...
- Patent number 11,616,136
- Issue date Mar 28, 2023
- Wolfspeed, Inc.
- Kyle Bothe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die with improved ruggedness
- Patent number 11,587,842
- Issue date Feb 21, 2023
- Wolfspeed, Inc.
- Chris Hardiman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated doherty amplifier with added isolation between the carri...
- Patent number 11,533,025
- Issue date Dec 20, 2022
- Wolfspeed, Inc.
- Lei Zhao
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Field effect transistor with at least partially recessed field plate
- Patent number 11,502,178
- Issue date Nov 15, 2022
- Wolfspeed, Inc.
- Kyle Bothe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High electron mobility transistors having improved drain current dr...
- Patent number 11,355,600
- Issue date Jun 7, 2022
- Wolfspeed, Inc.
- Kyoung-Keun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stepped field plates with proximity to conduction channel and relat...
- Patent number 11,075,271
- Issue date Jul 27, 2021
- Cree, Inc.
- Evan Jones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High electron mobility transistors and power amplifiers including s...
- Patent number 10,971,612
- Issue date Apr 6, 2021
- Cree, Inc.
- Kyle Bothe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High electron mobility transistors having improved drain current dr...
- Patent number 10,937,873
- Issue date Mar 2, 2021
- Cree, Inc.
- Kyoung-Keun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High electron mobility transistors having improved contact spacing...
- Patent number 10,923,585
- Issue date Feb 16, 2021
- Cree, Inc.
- Kyle Bothe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die with improved ruggedness
- Patent number 10,886,189
- Issue date Jan 5, 2021
- Cree, Inc.
- Chris Hardiman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die with improved ruggedness
- Patent number 10,840,162
- Issue date Nov 17, 2020
- Cree, Inc.
- Chris Hardiman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electronic circuits having moisture protection encapsulati...
- Patent number 10,811,370
- Issue date Oct 20, 2020
- Cree, Inc.
- Kyle Bothe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die with improved ruggedness
- Patent number 10,332,817
- Issue date Jun 25, 2019
- Cree, Inc.
- Chris Hardiman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recessed field plate transistor structures
- Patent number 9,847,411
- Issue date Dec 19, 2017
- Cree, Inc.
- Saptharishi Sriram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cascode structures for GaN HEMTs
- Patent number 9,679,981
- Issue date Jun 13, 2017
- Cree, Inc.
- Saptharishi Sriram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with improved field plate
- Patent number 9,608,078
- Issue date Mar 28, 2017
- Cree, Inc.
- Helmut Hagleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level die attach metallization
- Patent number 9,536,783
- Issue date Jan 3, 2017
- Cree, Inc.
- Fabian Radulescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tunnel junction field effect transistors having self-aligned source...
- Patent number 9,356,129
- Issue date May 31, 2016
- Cree, Inc.
- Fabian Radulescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate contact for a semiconductor device and methods of fabrication...
- Patent number 9,343,543
- Issue date May 17, 2016
- Cree, Inc.
- Fabian Radulescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with self-aligned ohmic contacts
- Patent number 9,343,561
- Issue date May 17, 2016
- Cree, Inc.
- Fabian Radulescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using stress reduction barrier sub-layers in a semiconductor die
- Patent number 9,269,662
- Issue date Feb 23, 2016
- Cree, Inc.
- Zoltan Ring
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Topside Cooling for Semiconductor Device
- Publication number 20240429120
- Publication date Dec 26, 2024
- Wolfspeed, Inc.
- Michael Lee Schuette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE INTERPOSER, A DEVICE IMPLEMENTING A THERMALLY...
- Publication number 20240429122
- Publication date Dec 26, 2024
- Kyle BOTHE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP FIELD EFFECT TRANSISTOR LAYOUTS AND STRUCTURES
- Publication number 20240266348
- Publication date Aug 8, 2024
- Wolfspeed, Inc.
- Fabian Radulescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD EFFECT TRANSISTOR INCLUDING FIELD PLATES
- Publication number 20240162304
- Publication date May 16, 2024
- MACOM Technology Solutions Holdings, Inc.
- Jeremy Fisher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ELECTRON MOBILITY TRANSISTORS HAVING REDUCED DRAIN CURRENT DRI...
- Publication number 20240063300
- Publication date Feb 22, 2024
- Wolfspeed, Inc.
- Kyle Bothe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA-BASED BARRIER LAYER REMOVAL METHOD FOR INCREASING PEAK TRANS...
- Publication number 20230395670
- Publication date Dec 7, 2023
- Wolfspeed, Inc.
- Chris Hardiman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL PILLAR CONNECTION TOPOLOGIES FOR HETEROGENEOUS PACKAGING
- Publication number 20230075505
- Publication date Mar 9, 2023
- Wolfspeed, Inc.
- Fabian Radulescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ENCAPSULATION FOR HUMIDITY ROBUSTNESS AND RELATED FABRIC...
- Publication number 20220384366
- Publication date Dec 1, 2022
- Cree, Inc.
- Kyoung-Keun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ENCAPSULATION FOR HUMIDITY ROBUSTNESS AND HIGHLY ACCELER...
- Publication number 20220384290
- Publication date Dec 1, 2022
- Wolfspeed, Inc.
- Kyoung-Keun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD EFFECT TRANSISTOR WITH SELECTIVE MODIFIED ACCESS REGIONS
- Publication number 20220376098
- Publication date Nov 24, 2022
- Wolfspeed, Inc.
- Kyoung-Keun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD EFFECT TRANSISTORS WITH MODIFIED ACCESS REGIONS
- Publication number 20220376106
- Publication date Nov 24, 2022
- Wolfspeed, Inc.
- Kyoung-Keun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PILLAR CONNECTION ON FRONTSIDE AND PASSIVE DEVICE INTEG...
- Publication number 20220208758
- Publication date Jun 30, 2022
- Wolfspeed, Inc.
- Terry Alcorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD EFFECT TRANSISTOR WITH AT LEAST PARTIALLY RECESSED FIELD PLATE
- Publication number 20220130966
- Publication date Apr 28, 2022
- Wolfspeed, Inc.
- Kyle Bothe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD EFFECT TRANSISTOR WITH ENHANCED RELIABILITY
- Publication number 20220130985
- Publication date Apr 28, 2022
- Cree, Inc.
- Kyle Bothe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device With Isolation And/Or Protection Structures
- Publication number 20220102294
- Publication date Mar 31, 2022
- Cree, Inc.
- Lei Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE-TO-DIE ISOLATION STRUCTURES FOR PACKAGED TRANSISTOR DEVICES
- Publication number 20220037464
- Publication date Feb 3, 2022
- Cree, Inc.
- Lei Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Doherty Amplifier with Added Isolation Between the Carri...
- Publication number 20210399694
- Publication date Dec 23, 2021
- Cree, Inc.
- Lei Zhao
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHODS FOR PILLAR CONNECTION ON FRONTSIDE AND PASSIVE DEVICE INTEG...
- Publication number 20210375856
- Publication date Dec 2, 2021
- Cree, Inc.
- Terry Alcorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Group III-Nitride High-Electron Mobility Transistors Configured wit...
- Publication number 20210359118
- Publication date Nov 18, 2021
- Cree, Inc.
- Fabian Radulescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Having a Backside Wafer Cavity for Radio Frequency (R...
- Publication number 20210257320
- Publication date Aug 19, 2021
- Cree, Inc.
- Fabian Radulescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ELECTRON MOBILITY TRANSISTORS AND POWER AMPLIFIERS INCLUDING S...
- Publication number 20210175351
- Publication date Jun 10, 2021
- Cree, Inc.
- Kyle Bothe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ELECTRON MOBILITY TRANSISTORS HAVING IMPROVED DRAIN CURRENT DR...
- Publication number 20210134966
- Publication date May 6, 2021
- Cree, Inc.
- Kyoung-Keun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STEPPED FIELD PLATES WITH PROXIMITY TO CONDUCTION CHANNEL AND RELAT...
- Publication number 20210111254
- Publication date Apr 15, 2021
- Cree, Inc.
- Evan Jones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE WITH IMPROVED RUGGEDNESS
- Publication number 20210043530
- Publication date Feb 11, 2021
- Cree, Inc.
- Chris Hardiman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED ELECTRONIC CIRCUITS HAVING MOISTURE PROTECTION ENCAPSULATI...
- Publication number 20210028127
- Publication date Jan 28, 2021
- Cree, Inc.
- Kyle Bothe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ELECTRON MOBILITY TRANSISTORS AND POWER AMPLIFIERS INCLUDING S...
- Publication number 20200395475
- Publication date Dec 17, 2020
- Cree, Inc.
- Kyle Bothe
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
HIGH ELECTRON MOBILITY TRANSISTORS HAVING IMPROVED CONTACT SPACING...
- Publication number 20200395474
- Publication date Dec 17, 2020
- Cree, Inc.
- Kyle Bothe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ELECTRON MOBILITY TRANSISTORS HAVING IMPROVED DRAIN CURRENT DR...
- Publication number 20200219987
- Publication date Jul 9, 2020
- Cree, Inc.
- Kyoung-Keun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED ELECTRONIC CIRCUITS HAVING MOISTURE PROTECTION ENCAPSULATI...
- Publication number 20190326230
- Publication date Oct 24, 2019
- Cree, Inc.
- Kyle Bothe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE WITH IMPROVED RUGGEDNESS
- Publication number 20190259682
- Publication date Aug 22, 2019
- Cree, Inc.
- Chris Hardiman
- H01 - BASIC ELECTRIC ELEMENTS

Fabian Radulescu

Person

Patents Grantslast 30 patents

Semiconductor device with isolation and/or protection structures

Field effect transistors with modified access regions

Methods for pillar connection on frontside and passive device integ...

Methods for pillar connection on frontside and passive device integ...

Semiconductor having a backside wafer cavity for radio frequency (R...

Packaged electronic circuits having moisture protection encapsulati...

Field effect transistor with enhanced reliability

Methods for pillar connection on frontside and passive device integ...

Die-to-die isolation structures for packaged transistor devices

High electron mobility transistors and power amplifiers including s...

Semiconductor die with improved ruggedness

Integrated doherty amplifier with added isolation between the carri...

Field effect transistor with at least partially recessed field plate

High electron mobility transistors having improved drain current dr...

Stepped field plates with proximity to conduction channel and relat...

High electron mobility transistors and power amplifiers including s...

High electron mobility transistors having improved drain current dr...

High electron mobility transistors having improved contact spacing...

Semiconductor die with improved ruggedness

Semiconductor die with improved ruggedness

Packaged electronic circuits having moisture protection encapsulati...

Semiconductor die with improved ruggedness

Recessed field plate transistor structures

Cascode structures for GaN HEMTs

Semiconductor device with improved field plate

Wafer-level die attach metallization

Tunnel junction field effect transistors having self-aligned source...

Gate contact for a semiconductor device and methods of fabrication...

Semiconductor device with self-aligned ohmic contacts

Using stress reduction barrier sub-layers in a semiconductor die

Patents Applicationslast 30 patents

Topside Cooling for Semiconductor Device

THERMALLY CONDUCTIVE INTERPOSER, A DEVICE IMPLEMENTING A THERMALLY...

FLIP-CHIP FIELD EFFECT TRANSISTOR LAYOUTS AND STRUCTURES

FIELD EFFECT TRANSISTOR INCLUDING FIELD PLATES

HIGH ELECTRON MOBILITY TRANSISTORS HAVING REDUCED DRAIN CURRENT DRI...

PLASMA-BASED BARRIER LAYER REMOVAL METHOD FOR INCREASING PEAK TRANS...

METAL PILLAR CONNECTION TOPOLOGIES FOR HETEROGENEOUS PACKAGING

MULTILAYER ENCAPSULATION FOR HUMIDITY ROBUSTNESS AND RELATED FABRIC...

MULTILAYER ENCAPSULATION FOR HUMIDITY ROBUSTNESS AND HIGHLY ACCELER...

FIELD EFFECT TRANSISTOR WITH SELECTIVE MODIFIED ACCESS REGIONS

FIELD EFFECT TRANSISTORS WITH MODIFIED ACCESS REGIONS

METHODS FOR PILLAR CONNECTION ON FRONTSIDE AND PASSIVE DEVICE INTEG...

FIELD EFFECT TRANSISTOR WITH AT LEAST PARTIALLY RECESSED FIELD PLATE

FIELD EFFECT TRANSISTOR WITH ENHANCED RELIABILITY

Semiconductor Device With Isolation And/Or Protection Structures

DIE-TO-DIE ISOLATION STRUCTURES FOR PACKAGED TRANSISTOR DEVICES

Integrated Doherty Amplifier with Added Isolation Between the Carri...

METHODS FOR PILLAR CONNECTION ON FRONTSIDE AND PASSIVE DEVICE INTEG...

Group III-Nitride High-Electron Mobility Transistors Configured wit...

Semiconductor Having a Backside Wafer Cavity for Radio Frequency (R...

HIGH ELECTRON MOBILITY TRANSISTORS AND POWER AMPLIFIERS INCLUDING S...

HIGH ELECTRON MOBILITY TRANSISTORS HAVING IMPROVED DRAIN CURRENT DR...

STEPPED FIELD PLATES WITH PROXIMITY TO CONDUCTION CHANNEL AND RELAT...

SEMICONDUCTOR DIE WITH IMPROVED RUGGEDNESS

PACKAGED ELECTRONIC CIRCUITS HAVING MOISTURE PROTECTION ENCAPSULATI...

HIGH ELECTRON MOBILITY TRANSISTORS AND POWER AMPLIFIERS INCLUDING S...

HIGH ELECTRON MOBILITY TRANSISTORS HAVING IMPROVED CONTACT SPACING...

HIGH ELECTRON MOBILITY TRANSISTORS HAVING IMPROVED DRAIN CURRENT DR...

PACKAGED ELECTRONIC CIRCUITS HAVING MOISTURE PROTECTION ENCAPSULATI...

SEMICONDUCTOR DIE WITH IMPROVED RUGGEDNESS