Fan Zhang

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Reliable non-volatile memory device
- Patent number 10,475,891
- Issue date Nov 12, 2019
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Jin Qiu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control gate dummy for word line uniformity and method for producin...
- Patent number 10,381,360
- Issue date Aug 13, 2019
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Laiqiang Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated magnetic random access memory with logic device
- Patent number 10,121,964
- Issue date Nov 6, 2018
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Juan Boon Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded non-volatile memory (NVM) on fully depleted silicon-on-ins...
- Patent number 10,109,638
- Issue date Oct 23, 2018
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Ming Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits with high voltage devices and methods for produ...
- Patent number 10,032,772
- Issue date Jul 24, 2018
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Xinshu Cai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to form thicker erase gate poly superflash NVM
- Patent number 10,020,372
- Issue date Jul 10, 2018
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Khee Yong Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits having device contacts and methods for fabricat...
- Patent number 9,941,160
- Issue date Apr 10, 2018
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Wei Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing integrated circuit memory cells with less dedi...
- Patent number 9,929,165
- Issue date Mar 27, 2018
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Laiqiang Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits and methods for fabricating integrated circuits...
- Patent number 9,825,185
- Issue date Nov 21, 2017
- GLOBALFOUDNRIES SINGAPORE PTE. LTD.
- Pinghui Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits with non-volatile memory and methods of produci...
- Patent number 9,679,905
- Issue date Jun 13, 2017
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Laiqiang Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D high voltage charge pump
- Patent number 9,520,506
- Issue date Dec 13, 2016
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Laiqiang Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable interconnect integration scheme
- Patent number 9,490,165
- Issue date Nov 8, 2016
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Luying Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for fabricating integrated circuits having device contacts
- Patent number 9,443,761
- Issue date Sep 13, 2016
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Wei Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits having crack-stop structures and methods for fa...
- Patent number 9,305,886
- Issue date Apr 5, 2016
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Wei Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable contacts
- Patent number 9,263,322
- Issue date Feb 16, 2016
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Tian-Lin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit system employing alternating conductive layers
- Patent number 9,147,654
- Issue date Sep 29, 2015
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Haifeng Sheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable interconnect for semiconductor device
- Patent number 9,054,107
- Issue date Jun 9, 2015
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Fan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric posts in metal layers
- Patent number 8,957,523
- Issue date Feb 17, 2015
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Fan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable interconnect for semiconductor device
- Patent number 8,598,031
- Issue date Dec 3, 2013
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Fan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Poly profile engineering to modulate spacer induced stress for devi...
- Patent number 8,519,445
- Issue date Aug 27, 2013
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Vincent Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit system employing low-k dielectrics and method of...
- Patent number 8,358,007
- Issue date Jan 22, 2013
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Dong Kyun Sohn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit system employing back end of line via techniques
- Patent number 8,115,276
- Issue date Feb 14, 2012
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Shaoqing Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable interconnects
- Patent number 8,102,054
- Issue date Jan 24, 2012
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Bei Chao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Poly profile engineering to modulate spacer induced stress for devi...
- Patent number 7,993,997
- Issue date Aug 9, 2011
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Vincent Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grain boundary blocking for stress migration and electromigration i...
- Patent number 7,989,338
- Issue date Aug 2, 2011
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Fan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for corrosion prevention during planarization
- Patent number 7,947,604
- Issue date May 24, 2011
- Chartered Semiconductor Manufacturing, Ltd.
- Fan Zhang
- B24 - GRINDING POLISHING
Information Patent Grant
Reliable interconnects
- Patent number 7,803,704
- Issue date Sep 28, 2010
- Chartered Semiconductor Manufacturing, Ltd.
- Bei Chao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Combined copper plating method to improve gap fill
- Patent number 7,585,768
- Issue date Sep 8, 2009
- Chartered Semiconductor Manufacturing, Ltd.
- Xiaomei Bu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Entire encapsulation of Cu interconnects using self-aligned CuSiN film
- Patent number 7,524,755
- Issue date Apr 28, 2009
- Chartered Semiconductor Manufacturing, Ltd.
- Johnny Widodo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elevated bond-pad structure for high-density flip-clip packaging an...
- Patent number 7,323,406
- Issue date Jan 29, 2008
- Chartered Semiconductor Manufacturing Ltd.
- Victor Seng-Keong Lim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MEMORY CELLS WITH THREE-DIMENSIONAL GATE COUPLING AND METHODS OF FO...
- Publication number 20230345718
- Publication date Oct 26, 2023
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Wei MENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PAD STRUCTURES IN SEMICONDUCTOR DEVICES
- Publication number 20200091020
- Publication date Mar 19, 2020
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- WANBING YI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE NON-VOLATILE MEMORY DEVICE
- Publication number 20180102414
- Publication date Apr 12, 2018
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Jin Qiu LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing integrated circuit memory cells with less dedi...
- Publication number 20180090505
- Publication date Mar 29, 2018
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Laiqiang Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS WITH HIGH VOLTAGE DEVICES AND METHODS FOR PRODU...
- Publication number 20180082999
- Publication date Mar 22, 2018
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Xinshu Cai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED MAGNETIC RANDOM ACCESS MEMORY WITH LOGIC DEVICE
- Publication number 20170084820
- Publication date Mar 23, 2017
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Juan Boon TAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS HAVING DEVICE CONTACTS AND METHODS FOR FABRICAT...
- Publication number 20160035623
- Publication date Feb 4, 2016
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Wei Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS HAVING CRACK-STOP STRUCTURES AND METHODS FOR FA...
- Publication number 20150171025
- Publication date Jun 18, 2015
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Wei Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS WITH DUMMY CONTACTS AND METHODS FOR PRODUCING S...
- Publication number 20150171008
- Publication date Jun 18, 2015
- GLOBAL FOUNDRIES Singapore Ptd. Ltd.
- Laiqiang Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE CONTACTS
- Publication number 20150076669
- Publication date Mar 19, 2015
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Tian-Lin CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS HAVING DEVICE CONTACTS AND METHODS FOR FABRICAT...
- Publication number 20150028490
- Publication date Jan 29, 2015
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Wei SHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D HIGH VOLTAGE CHARGE PUMP
- Publication number 20150028407
- Publication date Jan 29, 2015
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Laiqiang LUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC POSTS IN METAL LAYERS
- Publication number 20140191407
- Publication date Jul 10, 2014
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Fan ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE INTERCONNECT FOR SEMICONDUCTOR DEVICE
- Publication number 20140084486
- Publication date Mar 27, 2014
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Fan ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE INTERCONNECT INTEGRATION SCHEME
- Publication number 20120168915
- Publication date Jul 5, 2012
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Luying DU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLY PROFILE ENGINEERING TO MODULATE SPACER INDUCED STRESS FOR DEVI...
- Publication number 20110266628
- Publication date Nov 3, 2011
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Vincent HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE INTERCONNECT FOR SEMICONDUCTOR DEVICE
- Publication number 20110074039
- Publication date Mar 31, 2011
- CHARTERED SEMICONDUCTOR MANUFACTURING, LTD.
- Fan ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE INTERCONNECTS
- Publication number 20100314774
- Publication date Dec 16, 2010
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Bei Chao ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT SYSTEM EMPLOYING LOW-K DIELECTRICS AND METHOD OF...
- Publication number 20100314763
- Publication date Dec 16, 2010
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Dong Kyun Sohn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE INTERCONNECTS
- Publication number 20100044869
- Publication date Feb 25, 2010
- CHARTERED SEMICONDUCTOR MANUFACTURING, LTD.
- Bei Chao ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT SYSTEM EMPLOYING ALTERNATING CONDUCTIVE LAYERS
- Publication number 20100001370
- Publication date Jan 7, 2010
- Chartered Semiconductor Manufacturing LTD.
- Haifeng Sheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Implantation for shallow trench isolation (STI) formation and for s...
- Publication number 20090315115
- Publication date Dec 24, 2009
- CHARTERED SEMICONDUCTOR MANUFACTURING, LTD.
- Beichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT SYSTEM EMPLOYING BACK END OF LINE VIA TECHNIQUES
- Publication number 20090294904
- Publication date Dec 3, 2009
- Chartered Semiconductor Manufacturing LTD.
- Shaoqing Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CORROSION PREVENTION DURING PLANARIZATION
- Publication number 20090191792
- Publication date Jul 30, 2009
- CHARTERED SEMICONDUCTOR MANUFACTURING, LTD.
- Fan ZHANG
- B24 - GRINDING POLISHING
Information Patent Application
POLY PROFILE ENGINEERING TO MODULATE SPACER INDUCED STRESS FOR DEVI...
- Publication number 20090085122
- Publication date Apr 2, 2009
- Vincent Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Combined copper plating method to improve gap fill
- Publication number 20070293039
- Publication date Dec 20, 2007
- CHARTERED SEMICONDUCTOR MANUFACTURING, LTD.
- Xiaomei Bu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Entire encapsulation of Cu interconnects using self-aligned CuSiN film
- Publication number 20070197023
- Publication date Aug 23, 2007
- CHARTERED SEMICONDUCTOR MANUFACTURING, LTD.
- Johnny Widodo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Grain boundary blocking for stress migration and electromigration i...
- Publication number 20060286797
- Publication date Dec 21, 2006
- Chartered Semiconductor Manufacturing Ltd.
- Fan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Elevated bond-pad structure for high-density flip-clip packaging an...
- Publication number 20060166402
- Publication date Jul 27, 2006
- Chartered Semiconductor Manufacturing Ltd.
- Victor Seng-Keong Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and method for fabricating a bond pad structure
- Publication number 20060071350
- Publication date Apr 6, 2006
- Zhang Fan
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Reliable non-volatile memory device

Control gate dummy for word line uniformity and method for producin...

Integrated magnetic random access memory with logic device

Embedded non-volatile memory (NVM) on fully depleted silicon-on-ins...

Integrated circuits with high voltage devices and methods for produ...

Method to form thicker erase gate poly superflash NVM

Integrated circuits having device contacts and methods for fabricat...

Method for producing integrated circuit memory cells with less dedi...

Integrated circuits and methods for fabricating integrated circuits...

Integrated circuits with non-volatile memory and methods of produci...

3D high voltage charge pump

Reliable interconnect integration scheme

Methods for fabricating integrated circuits having device contacts

Integrated circuits having crack-stop structures and methods for fa...

Reliable contacts

Integrated circuit system employing alternating conductive layers

Reliable interconnect for semiconductor device

Dielectric posts in metal layers

Reliable interconnect for semiconductor device

Poly profile engineering to modulate spacer induced stress for devi...

Integrated circuit system employing low-k dielectrics and method of...

Integrated circuit system employing back end of line via techniques

Reliable interconnects

Poly profile engineering to modulate spacer induced stress for devi...

Grain boundary blocking for stress migration and electromigration i...

Method for corrosion prevention during planarization

Reliable interconnects

Combined copper plating method to improve gap fill

Entire encapsulation of Cu interconnects using self-aligned CuSiN film

Elevated bond-pad structure for high-density flip-clip packaging an...

Patents Applicationslast 30 patents

MEMORY CELLS WITH THREE-DIMENSIONAL GATE COUPLING AND METHODS OF FO...

PAD STRUCTURES IN SEMICONDUCTOR DEVICES

RELIABLE NON-VOLATILE MEMORY DEVICE

Method for producing integrated circuit memory cells with less dedi...

INTEGRATED CIRCUITS WITH HIGH VOLTAGE DEVICES AND METHODS FOR PRODU...

INTEGRATED MAGNETIC RANDOM ACCESS MEMORY WITH LOGIC DEVICE

INTEGRATED CIRCUITS HAVING DEVICE CONTACTS AND METHODS FOR FABRICAT...

INTEGRATED CIRCUITS HAVING CRACK-STOP STRUCTURES AND METHODS FOR FA...

INTEGRATED CIRCUITS WITH DUMMY CONTACTS AND METHODS FOR PRODUCING S...

RELIABLE CONTACTS

INTEGRATED CIRCUITS HAVING DEVICE CONTACTS AND METHODS FOR FABRICAT...

3D HIGH VOLTAGE CHARGE PUMP

DIELECTRIC POSTS IN METAL LAYERS

RELIABLE INTERCONNECT FOR SEMICONDUCTOR DEVICE

RELIABLE INTERCONNECT INTEGRATION SCHEME

POLY PROFILE ENGINEERING TO MODULATE SPACER INDUCED STRESS FOR DEVI...

RELIABLE INTERCONNECT FOR SEMICONDUCTOR DEVICE

RELIABLE INTERCONNECTS

INTEGRATED CIRCUIT SYSTEM EMPLOYING LOW-K DIELECTRICS AND METHOD OF...

RELIABLE INTERCONNECTS

INTEGRATED CIRCUIT SYSTEM EMPLOYING ALTERNATING CONDUCTIVE LAYERS

Implantation for shallow trench isolation (STI) formation and for s...

INTEGRATED CIRCUIT SYSTEM EMPLOYING BACK END OF LINE VIA TECHNIQUES

METHOD FOR CORROSION PREVENTION DURING PLANARIZATION

POLY PROFILE ENGINEERING TO MODULATE SPACER INDUCED STRESS FOR DEVI...

Combined copper plating method to improve gap fill

Entire encapsulation of Cu interconnects using self-aligned CuSiN film

Grain boundary blocking for stress migration and electromigration i...

Elevated bond-pad structure for high-density flip-clip packaging an...

Structure and method for fabricating a bond pad structure