Fang-Lan Chu

Person

Taichung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit structure and manufacturing method thereof
- Patent number 11,600,618
- Issue date Mar 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device-manufacturing scheme for increasing the density of metal pat...
- Patent number 11,075,162
- Issue date Jul 27, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Yu Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test line letter for embedded non-volatile memory technology
- Patent number 11,069,419
- Issue date Jul 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jui-Tsung Lien
- G11 - INFORMATION STORAGE
Information Patent Grant
Device-manufacturing scheme for increasing the density of metal pat...
- Patent number 10,629,528
- Issue date Apr 21, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Yu Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device-manufacturing scheme for increasing the density of metal pat...
- Patent number 10,269,699
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ESD protection for 2.5D/3D integrated circuit systems
- Patent number 10,262,989
- Issue date Apr 16, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Hui Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test line letter for embedded non-volatile memory technology
- Patent number 10,163,522
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jui-Tsung Lien
- G11 - INFORMATION STORAGE
Information Patent Grant
Test line patterns in split-gate flash technology
- Patent number 9,983,257
- Issue date May 29, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoelectric converter
- Patent number 9,960,337
- Issue date May 1, 2018
- Industrial Technology Research Institute
- Chao-Jen Huang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Device-manufacturing scheme for increasing the density of metal pat...
- Patent number 9,893,010
- Issue date Feb 13, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Boundary scheme for embedded poly-SiON CMOS or NVM in HKMG CMOS tec...
- Patent number 9,425,206
- Issue date Aug 23, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device-manufacturing scheme for increasing the density of metal pat...
- Patent number 9,406,607
- Issue date Aug 2, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Yu Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual silicide formation method to embed split gate flash memory in...
- Patent number 9,276,010
- Issue date Mar 1, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ESD protection for 2.5D/3D integrated circuit systems
- Patent number 9,245,852
- Issue date Jan 26, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Hui Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit having a resistor and method of fo...
- Patent number 9,117,677
- Issue date Aug 25, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Yu Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Maximum power point tracking method and apparatus
- Patent number 9,065,336
- Issue date Jun 23, 2015
- Industrial Technology Research Institute
- Chao-Jen Huang
- G05 - CONTROLLING REGULATING
Information Patent Grant
Device-manufacturing scheme for increasing the density of metal pat...
- Patent number 8,569,129
- Issue date Oct 29, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Yu Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ESD power clamp for high-voltage applications
- Patent number 8,179,647
- Issue date May 15, 2012
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fang-Tsun Chu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Method for forming poly-silicon film
- Patent number 7,772,135
- Issue date Aug 10, 2010
- Industrial Technology Research Institute
- Fang-Tsun Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for electroplating metal wire
- Patent number 7,736,483
- Issue date Jun 15, 2010
- Industrial Technology Research Institute
- Chun-Yau Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for forming poly-silicon film
- Patent number 7,611,807
- Issue date Nov 3, 2009
- Industrial Technology Research Institute
- Hung-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for crystallizing amorphous silicon into polysilicon and mas...
- Patent number 7,579,123
- Issue date Aug 25, 2009
- Industrial Technology Research Institute
- Fang-Tsun Chu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pixel array
- Patent number 7,221,012
- Issue date May 22, 2007
- Industrial Technology Research Institute
- Fang-Tsun Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming thin-film transistor devices with electro-static...
- Patent number 7,180,090
- Issue date Feb 20, 2007
- Industrial Technology Research Institute
- Chen-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming thin-film transistor devices with electro-static...
- Patent number 6,989,298
- Issue date Jan 24, 2006
- Industrial Technology Research Institute
- Chen-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PHOTONIC PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20250155659
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- I OUYANG
- G02 - OPTICS
Information Patent Application
Wafer Bonding Method and Bonded Device Structure
- Publication number 20230299041
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Harry-Haklay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Bonding Method and Bonded Device Structure
- Publication number 20230299010
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Harry-Haklay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220302114
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-Hak-Lay CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device-Manufacturing Scheme for Increasing the Density of Metal Pat...
- Publication number 20200251416
- Publication date Aug 6, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Yu Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device-Manufacturing Scheme for Increasing the Density of Metal Pat...
- Publication number 20190252315
- Publication date Aug 15, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Yu Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST LINE LETTER FOR EMBEDDED NON-VOLATILE MEMORY TECHNOLOGY
- Publication number 20190019567
- Publication date Jan 17, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Jui-Tsung Lien
- G11 - INFORMATION STORAGE
Information Patent Application
Device-Manufacturing Scheme for Increasing the Density of Metal Pat...
- Publication number 20180151492
- Publication date May 31, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Yu Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOELECTRIC CONVERTER
- Publication number 20180047888
- Publication date Feb 15, 2018
- Industrial Technology Research Institute
- Chao-Jen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Test Line Patterns in Split-Gate Flash Technology
- Publication number 20170110202
- Publication date Apr 20, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Wei Cheng Wu
- G01 - MEASURING TESTING
Information Patent Application
Test Line Letter for Embedded Non-Volatile Memory Technology
- Publication number 20170110201
- Publication date Apr 20, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Jui-Tsung Lien
- G01 - MEASURING TESTING
Information Patent Application
Device-Manufacturing Scheme for Increasing the Density of Metal Pat...
- Publication number 20160329280
- Publication date Nov 10, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Yu Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOUNDARY SCHEME FOR EMBEDDED POLY-SiON CMOS OR NVM IN HKMG CMOS TEC...
- Publication number 20160181268
- Publication date Jun 23, 2016
- Taiwan Semiconductor Manufacturing Co., LTD
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ESD PROTECTION FOR 2.5D/3D INTEGRATED CIRCUIT SYSTEMS
- Publication number 20160093606
- Publication date Mar 31, 2016
- Taiwan Semiconductor Manufacturing Co., LTD
- Chia-Hui CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SILICIDE FORMATION METHOD TO EMBED SPLIT GATE FLASH MEMORY IN...
- Publication number 20150333082
- Publication date Nov 19, 2015
- Taiwan Semiconductor Manufacturing Co., LTD
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAXIMUM POWER POINT TRACKING METHOD AND APPARATUS
- Publication number 20150002127
- Publication date Jan 1, 2015
- Industrial Technology Research Institute
- Chao-Jen Huang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Device-Manufacturing Scheme for Increasing the Density of Metal Pat...
- Publication number 20140042557
- Publication date Feb 13, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Yu Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT HAVING A RESISTOR AND METHOD OF FO...
- Publication number 20130093052
- Publication date Apr 18, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Yu MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ESD PROTECTION FOR 2.5D/3D INTEGRATED CIRCUIT SYSTEMS
- Publication number 20130063843
- Publication date Mar 14, 2013
- Taiwan Semiconductor Manufacturing Co., LTD
- Chia-Hui CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device-Manufacturing Scheme for Increasing the Density of Metal Pat...
- Publication number 20120306023
- Publication date Dec 6, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Yu Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ESD POWER CLAMP FOR HIGH-VOLTAGE APPLICATIONS
- Publication number 20120081820
- Publication date Apr 5, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fang-Tsun Chu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
METHOD AND DEVICE FOR FORMING POLY-SILICON FILM
- Publication number 20100103401
- Publication date Apr 29, 2010
- Fang-Tsun Chu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MASK FOR SEQUENTIAL LATERAL SOLIDIFICATION LASER CRYSTALLIZATION
- Publication number 20090098471
- Publication date Apr 16, 2009
- Industrial Technology Research Institute
- Fang-Tsun Chu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of Semiconductor Thin Film Crystallization and Semiconductor...
- Publication number 20080233718
- Publication date Sep 25, 2008
- Jia-Xing Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and device for forming poly-silicon film
- Publication number 20080123200
- Publication date May 29, 2008
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Fang-Tsun Chu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR CRYSTALIZING AMORPHOUS SILICON LAYER AND MASK THEREFOR
- Publication number 20080045042
- Publication date Feb 21, 2008
- Industrial Technology Research Institute
- Fang-Tsun Chu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for forming poly-silicon film
- Publication number 20070269993
- Publication date Nov 22, 2007
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Fang-Tsun Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CRYSTALLIZING AMORPHOUS SILICON INTO POLYSILICON AND MAS...
- Publication number 20070196743
- Publication date Aug 23, 2007
- Industrial Technology Research Institute
- Fang-Tsun Chu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for forming poly-silicon thin-film device
- Publication number 20070190705
- Publication date Aug 16, 2007
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Fang-Tsun Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming poly-silicon film
- Publication number 20070141478
- Publication date Jun 21, 2007
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Hung-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS

Fang-Lan Chu

Person

Patents Grantslast 30 patents

Integrated circuit structure and manufacturing method thereof

Device-manufacturing scheme for increasing the density of metal pat...

Test line letter for embedded non-volatile memory technology

Device-manufacturing scheme for increasing the density of metal pat...

Device-manufacturing scheme for increasing the density of metal pat...

ESD protection for 2.5D/3D integrated circuit systems

Test line letter for embedded non-volatile memory technology

Test line patterns in split-gate flash technology

Thermoelectric converter

Device-manufacturing scheme for increasing the density of metal pat...

Boundary scheme for embedded poly-SiON CMOS or NVM in HKMG CMOS tec...

Device-manufacturing scheme for increasing the density of metal pat...

Dual silicide formation method to embed split gate flash memory in...

ESD protection for 2.5D/3D integrated circuit systems

Semiconductor integrated circuit having a resistor and method of fo...

Maximum power point tracking method and apparatus

Device-manufacturing scheme for increasing the density of metal pat...

ESD power clamp for high-voltage applications

Method for forming poly-silicon film

Method for electroplating metal wire

Method for forming poly-silicon film

Method for crystallizing amorphous silicon into polysilicon and mas...

Pixel array

Method of forming thin-film transistor devices with electro-static...

Method of forming thin-film transistor devices with electro-static...

Patents Applicationslast 30 patents

PHOTONIC PACKAGE AND METHOD FOR FORMING THE SAME

Wafer Bonding Method and Bonded Device Structure

Wafer Bonding Method and Bonded Device Structure

INTEGRATED CIRCUIT STRUCTURE AND MANUFACTURING METHOD THEREOF

Device-Manufacturing Scheme for Increasing the Density of Metal Pat...

Device-Manufacturing Scheme for Increasing the Density of Metal Pat...

TEST LINE LETTER FOR EMBEDDED NON-VOLATILE MEMORY TECHNOLOGY

Device-Manufacturing Scheme for Increasing the Density of Metal Pat...

THERMOELECTRIC CONVERTER

Test Line Patterns in Split-Gate Flash Technology

Test Line Letter for Embedded Non-Volatile Memory Technology

Device-Manufacturing Scheme for Increasing the Density of Metal Pat...

BOUNDARY SCHEME FOR EMBEDDED POLY-SiON CMOS OR NVM IN HKMG CMOS TEC...

ESD PROTECTION FOR 2.5D/3D INTEGRATED CIRCUIT SYSTEMS

DUAL SILICIDE FORMATION METHOD TO EMBED SPLIT GATE FLASH MEMORY IN...

MAXIMUM POWER POINT TRACKING METHOD AND APPARATUS

Device-Manufacturing Scheme for Increasing the Density of Metal Pat...

SEMICONDUCTOR INTEGRATED CIRCUIT HAVING A RESISTOR AND METHOD OF FO...

ESD PROTECTION FOR 2.5D/3D INTEGRATED CIRCUIT SYSTEMS

Device-Manufacturing Scheme for Increasing the Density of Metal Pat...

ESD POWER CLAMP FOR HIGH-VOLTAGE APPLICATIONS

METHOD AND DEVICE FOR FORMING POLY-SILICON FILM

MASK FOR SEQUENTIAL LATERAL SOLIDIFICATION LASER CRYSTALLIZATION

Method of Semiconductor Thin Film Crystallization and Semiconductor...

Method and device for forming poly-silicon film

METHOD FOR CRYSTALIZING AMORPHOUS SILICON LAYER AND MASK THEREFOR

Method for forming poly-silicon film

METHOD FOR CRYSTALLIZING AMORPHOUS SILICON INTO POLYSILICON AND MAS...

Method for forming poly-silicon thin-film device

Method for forming poly-silicon film