Farhang Yazdani

Person

Santa Clara, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
3D integrations and methods of making thereof
- Patent number 12,068,231
- Issue date Aug 20, 2024
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacking integrated circuits containing serializer and deserializer...
- Patent number 11,894,342
- Issue date Feb 6, 2024
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for making thereof
- Patent number 11,569,208
- Issue date Jan 31, 2023
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scalable semiconductor interposer integration
- Patent number 11,302,617
- Issue date Apr 12, 2022
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and a method of making thereof
- Patent number 10,964,676
- Issue date Mar 30, 2021
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacking integrated circuits containing serializer and deserializer...
- Patent number 10,847,499
- Issue date Nov 24, 2020
- BroadPak Corporation
- Farhang Yazdani
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Stacking integrated circuits containing serializer and deserializer...
- Patent number 10,522,516
- Issue date Dec 31, 2019
- BroadPak Corporation
- Farhang Yazdani
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Scalable semiconductor interposer integration
- Patent number 10,515,886
- Issue date Dec 24, 2019
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacking integrated circuits containing serializer and deserializer...
- Patent number 10,236,275
- Issue date Mar 19, 2019
- BroadPak Corporation
- Farhang Yazdani
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor structure and a method of making thereof
- Patent number 10,026,720
- Issue date Jul 17, 2018
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interposer integration
- Patent number 9,893,004
- Issue date Feb 13, 2018
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scalable semiconductor interposer integration
- Patent number 9,818,680
- Issue date Nov 14, 2017
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Massively parallel interconnect fabric for complex semiconductor de...
- Patent number 9,053,951
- Issue date Jun 9, 2015
- Majid Bemanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Massively parallel interconnect fabric for complex semiconductor de...
- Patent number 9,035,443
- Issue date May 19, 2015
- Majid Bemanian
- G11 - INFORMATION STORAGE
Information Patent Grant
Massively parallel interconnect fabric for complex semiconductor de...
- Patent number 8,390,035
- Issue date Mar 5, 2013
- Majid Bemanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacking integrated circuits containing serializer and deserializer...
- Patent number 8,014,166
- Issue date Sep 6, 2011
- Broadpak Corporation
- Farhang Yazdani
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS AND METHOD FOR MAKING A SECURED SUBSTRATE
- Publication number 20240355722
- Publication date Oct 24, 2024
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SYSTEM INTEGRATION
- Publication number 20240128238
- Publication date Apr 18, 2024
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D HETEROGENEOUS INTEGRATIONS AND METHODS OF MAKING THEREOF
- Publication number 20230041977
- Publication date Feb 9, 2023
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED SEMICONDUCTOR STRUCTURES
- Publication number 20230026177
- Publication date Jan 26, 2023
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SECURE SEMICONDUCTOR INTEGRATION AND METHOD FOR MAKING THEREOF
- Publication number 20220293575
- Publication date Sep 15, 2022
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTEGRATIONS AND METHODS OF MAKING THEREOF
- Publication number 20220189864
- Publication date Jun 16, 2022
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING THEREOF
- Publication number 20210242185
- Publication date Aug 5, 2021
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SECURE SEMICONDUCTOR INTEGRATION
- Publication number 20210175162
- Publication date Jun 10, 2021
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKING INTEGRATED CIRCUITS CONTAINING SERIALIZER AND DESERIALIZER...
- Publication number 20210035955
- Publication date Feb 4, 2021
- BroadPak Corporation
- Farhang YAZDANI
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
SCALABLE SEMICONDUCTOR INTERPOSER INTEGRATION
- Publication number 20200144170
- Publication date May 7, 2020
- BroadPak Corporation
- Farhang YAZDANI
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Stacking Integrated Circuits containing Serializer and Deserializer...
- Publication number 20200118980
- Publication date Apr 16, 2020
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacking Integrated Circuits containing Serializer and Deserializer...
- Publication number 20190221546
- Publication date Jul 18, 2019
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND A METHOD OF MAKING THEREOF
- Publication number 20180342489
- Publication date Nov 29, 2018
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCALABLE SEMICONDUCTOR INTERPOSER INTEGRATION
- Publication number 20180068938
- Publication date Mar 8, 2018
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND A METHOD OF MAKING THEREOF
- Publication number 20160372448
- Publication date Dec 22, 2016
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCALABLE SEMICONDUCTOR INTERPOSER INTEGRATION
- Publication number 20150287672
- Publication date Oct 8, 2015
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTERPOSER INTEGRATION
- Publication number 20150255434
- Publication date Sep 10, 2015
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Massively Parallel Interconnect Fabric for Complex Semiconductor De...
- Publication number 20120086050
- Publication date Apr 12, 2012
- Majid Bemanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Massively Parallel Interconnect Fabric for Complex Semiconductor De...
- Publication number 20120068229
- Publication date Mar 22, 2012
- Majid Bemanian
- G11 - INFORMATION STORAGE
Information Patent Application
Stacking Integrated Circuits containing Serializer and Deserializer...
- Publication number 20110278737
- Publication date Nov 17, 2011
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Massively Parallel Interconnect Fabric for Complex Semiconductor De...
- Publication number 20100283085
- Publication date Nov 11, 2010
- Majid Bemanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacking Integrated Circuits containing Serializer and Deserializer...
- Publication number 20100058580
- Publication date Mar 11, 2010
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS

Farhang Yazdani

Person

Patents Grantslast 30 patents

3D integrations and methods of making thereof

Stacking integrated circuits containing serializer and deserializer...

Semiconductor structure and method for making thereof

Scalable semiconductor interposer integration

Semiconductor structure and a method of making thereof

Stacking integrated circuits containing serializer and deserializer...

Stacking integrated circuits containing serializer and deserializer...

Scalable semiconductor interposer integration

Stacking integrated circuits containing serializer and deserializer...

Semiconductor structure and a method of making thereof

Semiconductor interposer integration

Scalable semiconductor interposer integration

Massively parallel interconnect fabric for complex semiconductor de...

Massively parallel interconnect fabric for complex semiconductor de...

Massively parallel interconnect fabric for complex semiconductor de...

Stacking integrated circuits containing serializer and deserializer...

Patents Applicationslast 30 patents

APPARATUS AND METHOD FOR MAKING A SECURED SUBSTRATE

3D SYSTEM INTEGRATION

3D HETEROGENEOUS INTEGRATIONS AND METHODS OF MAKING THEREOF

ENHANCED SEMICONDUCTOR STRUCTURES

SECURE SEMICONDUCTOR INTEGRATION AND METHOD FOR MAKING THEREOF

3D INTEGRATIONS AND METHODS OF MAKING THEREOF

SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING THEREOF

SECURE SEMICONDUCTOR INTEGRATION

STACKING INTEGRATED CIRCUITS CONTAINING SERIALIZER AND DESERIALIZER...

SCALABLE SEMICONDUCTOR INTERPOSER INTEGRATION

Stacking Integrated Circuits containing Serializer and Deserializer...

Stacking Integrated Circuits containing Serializer and Deserializer...

SEMICONDUCTOR STRUCTURE AND A METHOD OF MAKING THEREOF

SCALABLE SEMICONDUCTOR INTERPOSER INTEGRATION

SEMICONDUCTOR STRUCTURE AND A METHOD OF MAKING THEREOF

SCALABLE SEMICONDUCTOR INTERPOSER INTEGRATION

SEMICONDUCTOR INTERPOSER INTEGRATION

Massively Parallel Interconnect Fabric for Complex Semiconductor De...

Massively Parallel Interconnect Fabric for Complex Semiconductor De...

Stacking Integrated Circuits containing Serializer and Deserializer...

Massively Parallel Interconnect Fabric for Complex Semiconductor De...

Stacking Integrated Circuits containing Serializer and Deserializer...