Fei HU

Person

Dongguan, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Power semiconductor device, packaging structure, and electronic device
- Patent number 11,978,767
- Issue date May 7, 2024
- Huawei Technologies Co., Ltd.
- Zhaozheng Hou
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, POWER CONVERSIO...
- Publication number 20240347613
- Publication date Oct 17, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Kimimori HAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, POWER CONVERSIO...
- Publication number 20240321950
- Publication date Sep 26, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Kimimori HAMADA
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE AND INTEGRATED CIRCUIT
- Publication number 20240297214
- Publication date Sep 5, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Fei Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, POWER CONVERSIO...
- Publication number 20240290857
- Publication date Aug 29, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Kimimori HAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, POWER CONVERSION CIRCUI...
- Publication number 20240274657
- Publication date Aug 15, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Kimimori HAMADA
- B60 - VEHICLES IN GENERAL
Information Patent Application
Trench Gate Semiconductor Device, and Manufacturing Method Thereof
- Publication number 20240243181
- Publication date Jul 18, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Bo Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP AND ELECTRONIC DEVICE
- Publication number 20230299155
- Publication date Sep 21, 2023
- Huawei Digital Power Technologies Co., Ltd.
- Longgu Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEALING STRUCTURE FOR A MULTI-COMPARTMENT BOX BODY
- Publication number 20230204103
- Publication date Jun 29, 2023
- Fei HU
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
POWER SEMICONDUCTOR DEVICE, PACKAGING STRUCTURE, AND ELECTRONIC DEVICE
- Publication number 20220320271
- Publication date Oct 6, 2022
- Huawei Technologies Co., Ltd
- Zhaozheng HOU
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Power semiconductor device, packaging structure, and electronic device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, POWER CONVERSIO...

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, POWER CONVERSIO...

SEMICONDUCTOR DEVICE AND INTEGRATED CIRCUIT

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, POWER CONVERSIO...

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, POWER CONVERSION CIRCUI...

Trench Gate Semiconductor Device, and Manufacturing Method Thereof

CHIP AND ELECTRONIC DEVICE

SEALING STRUCTURE FOR A MULTI-COMPARTMENT BOX BODY

POWER SEMICONDUCTOR DEVICE, PACKAGING STRUCTURE, AND ELECTRONIC DEVICE