Fen Fen Jamin

Person

Wappingers Falls, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Double anneal with improved reliability for dual contact etch stop...
- Patent number 8,148,221
- Issue date Apr 3, 2012
- International Business Machines Corporation
- Khee Yong Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double anneal with improved reliability for dual contact etch stop...
- Patent number 7,615,433
- Issue date Nov 10, 2009
- Chartered Semiconductor Manufacturing, Ltd.
- Khee Yong Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planarization system and method using a carbonate containing fluid
- Patent number 7,214,623
- Issue date May 8, 2007
- International Business Machines Corporation
- Donald J. Delehanty
- B24 - GRINDING POLISHING
Information Patent Grant
Copper recess process with application to selective capping and ele...
- Patent number 7,064,064
- Issue date Jun 20, 2006
- International Business Machines Corporation
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of planarization
- Patent number 7,041,600
- Issue date May 9, 2006
- International Business Machines Corporation
- Omer Dokumaci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carbonation of pH controlled KOH solution for improved polishing of...
- Patent number 7,040,966
- Issue date May 9, 2006
- Applied Materials
- Joseph F. Salfelder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper recess process with application to selective capping and ele...
- Patent number 6,975,032
- Issue date Dec 13, 2005
- International Business Machines Corporation
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BiCMOS integration scheme with raised extrinsic base
- Patent number 6,780,695
- Issue date Aug 24, 2004
- International Business Machines Corporation
- Huajie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of formation of an oxynitride shallow trench isolation
- Patent number 6,764,922
- Issue date Jul 20, 2004
- International Business Machines Corporation
- Klaus D. Beyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oxynitride shallow trench isolation and method of formation
- Patent number 6,709,951
- Issue date Mar 23, 2004
- International Business Machines Corporation
- Klaus D. Beyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oxynitride shallow trench isolation and method of formation
- Patent number 6,498,383
- Issue date Dec 24, 2002
- International Business Machines Corporation
- Klaus D. Beyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical-mechanical polishing methods
- Patent number 6,368,969
- Issue date Apr 9, 2002
- International Business Machines Corporation
- Laertis Economikos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method
- Patent number 6,365,328
- Issue date Apr 2, 2002
- Infineon Technologies North America Corp.
- Hua Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical-mechanical polishing system having a bi-material wafer bac...
- Patent number 6,344,414
- Issue date Feb 5, 2002
- International Business Machines Corporation
- Kenneth Morgan Davis
- B24 - GRINDING POLISHING
Information Patent Grant
System for dispensing polishing liquid during chemical mechanical p...
- Patent number 6,264,789
- Issue date Jul 24, 2001
- Infineon Technologies Corp.
- Sumit Pandey
- B24 - GRINDING POLISHING
Information Patent Grant
System for dispensing polishing liquid during chemical mechanical p...
- Patent number 6,225,224
- Issue date May 1, 2001
- Infineon Technologies Norht America Corp.
- Sumit Pandey
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical-mechanical polishing system having a bi-material wafer bac...
- Patent number 6,171,513
- Issue date Jan 9, 2001
- International Business Machines Corporation
- Kenneth Morgan Davis
- B24 - GRINDING POLISHING
Information Patent Grant
Composition and method for reducing dishing in patterned metal duri...
- Patent number 6,149,830
- Issue date Nov 21, 2000
- Siemens Aktiengesellschaft
- Chienting Lin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
Double Anneal with Improved Reliability for Dual Contact Etch Stop...
- Publication number 20100041242
- Publication date Feb 18, 2010
- International Business Machines Corporation
- Khee Yong LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT SYSTEM HAVING STRAINED TRANSISTOR
- Publication number 20080142897
- Publication date Jun 19, 2008
- Chartered Semiconductor Manufacturing LTD.
- Young Way Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Double anneal with improved reliability for dual contact etch stop...
- Publication number 20070138564
- Publication date Jun 21, 2007
- CHARTERED SEMICONDUCTOR MFG, LTD
- Khee Yong Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A LOW THERMAL BUDGET (MOL) LINER, A SEMICONDUCTOR DEVICE COMPRISING...
- Publication number 20050221612
- Publication date Oct 6, 2005
- International Business Machines Corporation
- Laura Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper recess process with application to selective capping and ele...
- Publication number 20050158985
- Publication date Jul 21, 2005
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANARIZATION SYSTEM AND METHOD USING A CARBONATE CONTAINING FLUID
- Publication number 20050079709
- Publication date Apr 14, 2005
- International Business Machines Corporation
- Donald J. Delehanty
- B24 - GRINDING POLISHING
Information Patent Application
Carbonation of pH controlled KOH solution for improved polishing of...
- Publication number 20050042877
- Publication date Feb 24, 2005
- Joseph F. Salfelder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF PLANARIZATION
- Publication number 20040266195
- Publication date Dec 30, 2004
- International Business Machines Corporation
- Omer Dokumaci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper recess process with application to selective capping and ele...
- Publication number 20040113279
- Publication date Jun 17, 2004
- International Business Machines Corporation
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OXYNITRIDE SHALLOW TRENCH ISOLATION AND METHOD OF FORMATION
- Publication number 20040106267
- Publication date Jun 3, 2004
- International Business Machines Corporation
- Klaus D. Beyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Oxynitride shallow trench isolation and method of formation
- Publication number 20030015736
- Publication date Jan 23, 2003
- Klaus D. Beyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OXYNITRIDE SHALLOW TRENCH ISOLATION AND METHOD OF FORMATION
- Publication number 20020177270
- Publication date Nov 28, 2002
- International Business Machines Corporation
- Klaus D. Beyer
- H01 - BASIC ELECTRIC ELEMENTS

Fen Fen Jamin

Person

Patents Grantslast 30 patents

Double anneal with improved reliability for dual contact etch stop...

Double anneal with improved reliability for dual contact etch stop...

Planarization system and method using a carbonate containing fluid

Copper recess process with application to selective capping and ele...

Methods of planarization

Carbonation of pH controlled KOH solution for improved polishing of...

Copper recess process with application to selective capping and ele...

BiCMOS integration scheme with raised extrinsic base

Method of formation of an oxynitride shallow trench isolation

Oxynitride shallow trench isolation and method of formation

Oxynitride shallow trench isolation and method of formation

Chemical-mechanical polishing methods

Semiconductor structure and manufacturing method

Chemical-mechanical polishing system having a bi-material wafer bac...

System for dispensing polishing liquid during chemical mechanical p...

System for dispensing polishing liquid during chemical mechanical p...

Chemical-mechanical polishing system having a bi-material wafer bac...

Composition and method for reducing dishing in patterned metal duri...

Patents Applicationslast 30 patents

Double Anneal with Improved Reliability for Dual Contact Etch Stop...

INTEGRATED CIRCUIT SYSTEM HAVING STRAINED TRANSISTOR

Double anneal with improved reliability for dual contact etch stop...

A LOW THERMAL BUDGET (MOL) LINER, A SEMICONDUCTOR DEVICE COMPRISING...

Copper recess process with application to selective capping and ele...

PLANARIZATION SYSTEM AND METHOD USING A CARBONATE CONTAINING FLUID

Carbonation of pH controlled KOH solution for improved polishing of...

METHODS OF PLANARIZATION

Copper recess process with application to selective capping and ele...

OXYNITRIDE SHALLOW TRENCH ISOLATION AND METHOD OF FORMATION

Oxynitride shallow trench isolation and method of formation

OXYNITRIDE SHALLOW TRENCH ISOLATION AND METHOD OF FORMATION