Fen Yu

Person

Shanghai, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Method of forming a semiconductor device including vertical contact...
- Patent number 12,154,860
- Issue date Nov 26, 2024
- SanDisk Technologies, Inc.
- Zhongli Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with unbalanced die stackup
- Patent number 12,027,497
- Issue date Jul 2, 2024
- Western Digital Technologies, Inc.
- Haiyue Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate component layout and bonding method for increased package...
- Patent number 11,810,896
- Issue date Nov 7, 2023
- Western Digital Technologies, Inc.
- Jiandi Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including conductive bumps to improve EMI/RFI...
- Patent number 11,784,135
- Issue date Oct 10, 2023
- Western Digital Technologies, Inc.
- Jiandi Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having thermally conductive layers for...
- Patent number 11,488,883
- Issue date Nov 1, 2022
- Western Digital Technologies, Inc.
- Yazhou Zhang
- G11 - INFORMATION STORAGE
Information Patent Grant
Waterfall wire bonding
- Patent number 9,704,797
- Issue date Jul 11, 2017
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Zhong Lu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INSULATION LAYER FOR A SEMICONDUCTOR PACKAGE
- Publication number 20240413032
- Publication date Dec 12, 2024
- Western Digital Technologies, Inc.
- Shaopeng Dong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MEMORY DEVICE WITH OVERHANG SUPPORT STRUCTURE
- Publication number 20240397735
- Publication date Nov 28, 2024
- Western Digital Technologies, Inc.
- Shujun Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HAVING AN INCREASED METAL TRACE THICKNESS
- Publication number 20240332156
- Publication date Oct 3, 2024
- Western Digital Technologies, Inc.
- Rui Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device With Optimized Underfill Flow
- Publication number 20230299034
- Publication date Sep 21, 2023
- Western Digital Technologies, Inc.
- Yihao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device With Unbalanced Die Stackup
- Publication number 20230246000
- Publication date Aug 3, 2023
- Western Digital Technologies, Inc.
- Haiyue Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING VERTICAL CONTACT FINGERS
- Publication number 20220406724
- Publication date Dec 22, 2022
- Western Digital Technologies, Inc.
- Zhongli Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING CONDUCTIVE BUMPS TO IMPROVE EMI/RFI...
- Publication number 20220406726
- Publication date Dec 22, 2022
- Western Digital Technologies, Inc.
- Jiandi Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate Component Layout and Bonding Method for Increased Package...
- Publication number 20220375896
- Publication date Nov 24, 2022
- Western Digital Technologies, Inc.
- Jiandi DU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING THERMALLY CONDUCTIVE LAYERS FOR...
- Publication number 20220328374
- Publication date Oct 13, 2022
- Western Digital Technologies, Inc.
- Yazhou Zhang
- G11 - INFORMATION STORAGE
Information Patent Application
WATERFALL WIRE BONDING
- Publication number 20140183727
- Publication date Jul 3, 2014
- SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
- Zhong Lu
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Method of forming a semiconductor device including vertical contact...

Semiconductor device with unbalanced die stackup

Substrate component layout and bonding method for increased package...

Semiconductor device including conductive bumps to improve EMI/RFI...

Semiconductor device package having thermally conductive layers for...

Waterfall wire bonding

Patents Applicationslast 30 patents

INSULATION LAYER FOR A SEMICONDUCTOR PACKAGE

PACKAGED MEMORY DEVICE WITH OVERHANG SUPPORT STRUCTURE

SUBSTRATE HAVING AN INCREASED METAL TRACE THICKNESS

Semiconductor Device With Optimized Underfill Flow

Semiconductor Device With Unbalanced Die Stackup

SEMICONDUCTOR DEVICE INCLUDING VERTICAL CONTACT FINGERS

SEMICONDUCTOR DEVICE INCLUDING CONDUCTIVE BUMPS TO IMPROVE EMI/RFI...

Substrate Component Layout and Bonding Method for Increased Package...

SEMICONDUCTOR DEVICE PACKAGE HAVING THERMALLY CONDUCTIVE LAYERS FOR...

WATERFALL WIRE BONDING