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Feng Chia Hsu

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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    PACKAGE STRUCTURE WITH LID AND METHOD FOR FORMING THE SAME
    • Publication number 20240153840
    • Publication date May 9, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Shin-Puu JENG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240096731
    • Publication date Mar 21, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chin-Hua WANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
    • Publication number 20240088124
    • Publication date Mar 14, 2024
    • Taiwan Semiconductor Manufacturing company Ltd.
    • HSIANG-TAI LU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE STRUCTURE
    • Publication number 20240087903
    • Publication date Mar 14, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Feng-Cheng Hsu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20240014180
    • Publication date Jan 11, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chia-Kuei Hsu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MEMS STRUCTURE
    • Publication number 20240015446
    • Publication date Jan 11, 2024
    • Fortemedia, Inc.
    • Wen-Shan LIN
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    CHIP PACKAGE STRUCTURE HAVING MOLDING LAYER
    • Publication number 20240006367
    • Publication date Jan 4, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Shin-Puu JENG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    EUV PHOTOMASK AND MANUFACTURING METHOD OF THE SAME
    • Publication number 20230384662
    • Publication date Nov 30, 2023
    • Taiwan Semiconductor Manufacturing company Ltd.
    • FENG YUAN HSU
    • G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
  • Information Patent Application

    CHIP PACKAGE STRUCTURE
    • Publication number 20230378076
    • Publication date Nov 23, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Shin-Puu JENG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHIP PACKAGE STRUCTURE WITH CAVITY IN INTERPOSER
    • Publication number 20230369150
    • Publication date Nov 16, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Shin-Puu JENG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTI-CHIP PACKAGES AND METHODS OF FORMING THE SAME
    • Publication number 20230369287
    • Publication date Nov 16, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Shuo-Mao Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD MANUFACTURING THE SAME
    • Publication number 20230352446
    • Publication date Nov 2, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Feng-Cheng Hsu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Integrated Circuit Package and Method Forming Same
    • Publication number 20230352463
    • Publication date Nov 2, 2023
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Shin-Puu Jeng
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MEMS STRUCTURE
    • Publication number 20230339742
    • Publication date Oct 26, 2023
    • Fortemedia, Inc.
    • Jien-Ming CHEN
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    Reinforcing Package Using Reinforcing Patches
    • Publication number 20230335477
    • Publication date Oct 19, 2023
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Chia-Kuei Hsu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MICRO-ELECTRO-MECHANICAL SYSTEM STRUCTURE
    • Publication number 20230319450
    • Publication date Oct 5, 2023
    • Fortemedia, Inc.
    • Chih-Yuan CHEN
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    MEMS STRUCTURE
    • Publication number 20230319486
    • Publication date Oct 5, 2023
    • Fortemedia, Inc.
    • Chun-Kai MAO
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    MEMS STRUCTURE
    • Publication number 20230308809
    • Publication date Sep 28, 2023
    • Fortemedia, Inc.
    • Chih-Yuan CHEN
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    CHIP PACKAGE WITH REDISTRIBUTION STRUCTURE HAVING MULTIPLE CHIPS
    • Publication number 20230260890
    • Publication date Aug 17, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Shin-Puu JENG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MEMS MICROPHONE
    • Publication number 20230063234
    • Publication date Mar 2, 2023
    • Fortemedia, Inc.
    • Chih-Yuan CHEN
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    METHOD FOR FAULT DETECTION AND VEHICLE DISPLAY FAULT DETECTION SYSTEM
    • Publication number 20230049671
    • Publication date Feb 16, 2023
    • AU OPTRONICS CORPORATION
    • Yung-Lin CHENG
    • B60 - VEHICLES IN GENERAL
  • Information Patent Application

    MEMS MICROPHONE
    • Publication number 20220396469
    • Publication date Dec 15, 2022
    • Fortemedia, Inc.
    • Jien-Ming CHEN
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    Semiconductor Package with Dual Sides of Metal Routing
    • Publication number 20220375843
    • Publication date Nov 24, 2022
    • Taiwan Semiconductor Manufacturing Co., Ltd
    • Shin-Puu Jeng
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE ENCAPSULATED BY MOLDING MATERIAL ATTACHED TO R...
    • Publication number 20220367395
    • Publication date Nov 17, 2022
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Shin-Puu JENG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHIP PACKAGE STRUCTURE WITH INTEGRATED DEVICE INTEGRATED BENEATH TH...
    • Publication number 20220367411
    • Publication date Nov 17, 2022
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Feng-Cheng HSU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20220367419
    • Publication date Nov 17, 2022
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chia-Kuei Hsu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor Devices and Methods of Manufacture
    • Publication number 20220359410
    • Publication date Nov 10, 2022
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Shin-Puu Jeng
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHIP PACKAGE STRUCTURE WITH CAVITY IN INTERPOSER
    • Publication number 20220359320
    • Publication date Nov 10, 2022
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Shin-Puu JENG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Reinforcing Package Using Reinforcing Patches
    • Publication number 20220328392
    • Publication date Oct 13, 2022
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Chia-Kuei Hsu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20220302030
    • Publication date Sep 22, 2022
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Feng-Cheng Hsu
    • H01 - BASIC ELECTRIC ELEMENTS