Florian Ammer

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Ergoldsbach, DE

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method of attaching semiconductor dies to...
- Patent number 8,592,258
- Issue date Nov 26, 2013
- United Test and Assembly Center, Ltd.
- Denver Paul C. Castillo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF ATTACHING SEMICONDUCTOR DIES TO...
- Publication number 20120034738
- Publication date Feb 9, 2012
- QIMONDA AG
- Denver Paul C. CASTILLO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE
- Publication number 20110162204
- Publication date Jul 7, 2011
- QIMONDA AG
- Werner Reiss
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF ATTACHING SEMICONDUCTOR DIES TO...
- Publication number 20090194871
- Publication date Aug 6, 2009
- UTAC - United Test and Assembly Test Center, Ltd.
- Denver Paul C. Castillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER ON ORGANIC SOLDERABILITY PRESERVATIVE (OSP) INTERCONNECT
- Publication number 20090008796
- Publication date Jan 8, 2009
- United Test & Assembly Center Ltd.
- Kian Teng Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE
- Publication number 20080064232
- Publication date Mar 13, 2008
- QIMONDA AG
- Werner Reiss
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...