Florian G. Herrault

Person

Agoura Hills, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Through-wafer coaxial transition
- Patent number 12,218,067
- Issue date Feb 4, 2025
- HRL Laboratories, LLC
- Florian G. Herrault
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous integration of radio frequency transistor chiplets ha...
- Patent number 12,191,295
- Issue date Jan 7, 2025
- PseudolithIC, Inc.
- James F. Buckwalter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip integration into cavities of a host wafer using lateral dielec...
- Patent number 12,125,759
- Issue date Oct 22, 2024
- PseudolithIC, Inc.
- Florian Herrault
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Built in self-test of heterogeneous integrated radio frequency chip...
- Patent number 12,099,092
- Issue date Sep 24, 2024
- PseudolithIC, Inc.
- James Buckwalter
- G01 - MEASURING TESTING
Information Patent Grant
Singulation process for chiplets
- Patent number 11,972,970
- Issue date Apr 30, 2024
- HRL Laboratories, LLC
- Florian G. Herrault
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Built in self-test of heterogeneous integrated radio frequency chip...
- Patent number 11,940,495
- Issue date Mar 26, 2024
- PseudolithIC, Inc.
- James Buckwalter
- G01 - MEASURING TESTING
Information Patent Grant
Heterogeneous integration of radio frequency transistor chiplets ha...
- Patent number 11,810,876
- Issue date Nov 7, 2023
- PseudolithIC, Inc.
- James Buckwalter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic integrated module with metal embedded chips
- Patent number 11,769,843
- Issue date Sep 26, 2023
- HRL Laboratories, LLC
- Daniel Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for creating cavities in silicon carbide and other semicondu...
- Patent number 11,756,783
- Issue date Sep 12, 2023
- HRL Laboratories, LLC
- Eric Prophet
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip integration into cavities of a host wafer using lateral dielec...
- Patent number 11,756,848
- Issue date Sep 12, 2023
- PseudolithIC, Inc.
- Florian Herrault
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Built in self-test of heterogeneous integrated radio frequency chip...
- Patent number 11,733,297
- Issue date Aug 22, 2023
- PseudolithIC, Inc.
- James Buckwaiter
- G01 - MEASURING TESTING
Information Patent Grant
Wafer-level integrated micro-structured heat spreaders
- Patent number 11,721,605
- Issue date Aug 8, 2023
- HRL Laboratories, LLC
- Florian G. Herrault
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus to increase radar range
- Patent number 11,536,800
- Issue date Dec 27, 2022
- HRL Laboratories, LLC
- Florian G. Herrault
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid integrated circuit architecture
- Patent number 11,527,482
- Issue date Dec 13, 2022
- HRL Laboratories, LLC
- Florian G. Herrault
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-temperature-deposited self-biased magnetic composite films cont...
- Patent number 11,434,171
- Issue date Sep 6, 2022
- HRL Laboratories, LLC
- Xin N. Guan
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Magnetically anisotropic binder-free films containing discrete hexa...
- Patent number 11,295,882
- Issue date Apr 5, 2022
- HRL Laboratories, LLC
- Shanying Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatically driven assembly of nanoparticle materials into de...
- Patent number 11,219,919
- Issue date Jan 11, 2022
- HRL Laboratories, LLC
- Shanying Cui
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Method to protect die during metal-embedded chip assembly (MECA) pr...
- Patent number 11,158,520
- Issue date Oct 26, 2021
- HRL Laboratories, LLC
- Florian G. Herrault
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radar system with frequency conversion and corresponding method
- Patent number 11,029,387
- Issue date Jun 8, 2021
- GM Global Technology Operations LLC
- Florian G. Herrault
- G01 - MEASURING TESTING
Information Patent Grant
Hybrid integrated circuit architecture
- Patent number 10,998,273
- Issue date May 4, 2021
- HRL Laboratories, LLC
- Florian G. Herrault
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to design and uniformly co-fabricate small vias and large c...
- Patent number 10,957,537
- Issue date Mar 23, 2021
- HRL Laboratories, LLC
- Florian G. Herrault
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Impedance-matched through-wafer transition using integrated heat-sp...
- Patent number 10,950,562
- Issue date Mar 16, 2021
- HRL Laboratories, LLC
- Eric M. Prophet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for integrated shielded circulator
- Patent number 10,847,857
- Issue date Nov 24, 2020
- HRL Laboratories, LLC
- Jonathan J. Lynch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for making hydrothermally crystallized water-dispersible he...
- Patent number 10,829,386
- Issue date Nov 10, 2020
- HRL Laboratories, LLC
- Adam F. Gross
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Interposer with interconnects and methods of manufacturing the same
- Patent number 10,600,739
- Issue date Mar 24, 2020
- HRL Laboratories, LLC
- Florian G. Herrault
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Recursive metal embedded chip assembly
- Patent number 10,483,184
- Issue date Nov 19, 2019
- HRL Laboratories, LLC
- Florian G. Herrault
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated conductors
- Patent number 10,388,454
- Issue date Aug 20, 2019
- HRL Laboratories, LLC
- Florian G. Herrault
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated conductors
- Patent number 10,062,505
- Issue date Aug 28, 2018
- HRL Laboratories, LLC
- Florian G. Herrault
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of high-resolution patterns inside deep cavities and appl...
- Patent number 10,032,851
- Issue date Jul 24, 2018
- HRL Laboratories, LLC
- Florian G. Herrault
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recursive metal embedded chip assembly
- Patent number 10,026,672
- Issue date Jul 17, 2018
- HRL Laboratories, LLC
- Florian G. Herrault
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HETEROGENEOUS INTEGRATION OF RADIO FREQUENCY TRANSISTOR CHIPLETS HA...
- Publication number 20240413103
- Publication date Dec 12, 2024
- PseudolithIC, Inc.
- James BUCKWALTER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUILT IN SELF-TEST OF HETEROGENEOUS INTEGRATED RADIO FREQUENCY CHIP...
- Publication number 20240329136
- Publication date Oct 3, 2024
- PseudolithIC, Inc.
- James Buckwalter
- G01 - MEASURING TESTING
Information Patent Application
CHIP INTEGRATION INTO CAVITIES OF A HOST WAFER USING LATERAL DIELEC...
- Publication number 20240243026
- Publication date Jul 18, 2024
- PseudolithIC, Inc.
- Florian Herrault
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP INTEGRATION INTO CAVITIES OF A HOST WAFER USING LATERAL DIELEC...
- Publication number 20240243025
- Publication date Jul 18, 2024
- PseudolithIC, Inc.
- Florian Herrault
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
End-Point Detection for Backside Metal Thickness Control
- Publication number 20240203798
- Publication date Jun 20, 2024
- HRL LABORATORIES, LLC
- Florian G. HERRAULT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Isolation Between Embedded MECA Modules
- Publication number 20230122242
- Publication date Apr 20, 2023
- HRL LABORATORIES, LLC
- Florian Herrault
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETICALLY ANISOTROPIC BINDER-FREE FILMS CONTAINING DISCRETE HEXA...
- Publication number 20220351885
- Publication date Nov 3, 2022
- HRL LABORATORIES, LLC
- Shanying CUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL INTEGRATED MICRO-STRUCTURED HEAT SPREADERS
- Publication number 20220093484
- Publication date Mar 24, 2022
- HRL LABORATORIES, LLC
- Florian G. HERRAULT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID INTEGRATED CIRCUIT ARCHITECTURE
- Publication number 20210233857
- Publication date Jul 29, 2021
- HRL LABORATORIES, LLC
- Florian G. HERRAULT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS TO INCREASE RADAR RANGE
- Publication number 20210208240
- Publication date Jul 8, 2021
- HRL LABORATORIES, LLC
- Florian G. HERRAULT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO PROTECT DIE DURING METAL-EMBEDDED CHIP ASSEMBLY (MECA) PR...
- Publication number 20200294816
- Publication date Sep 17, 2020
- HRL LABORATORIES, LLC
- Florian G. HERRAULT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADAR SYSTEM WITH FREQUENCY CONVERSION AND CORRESPONDING METHOD
- Publication number 20200191902
- Publication date Jun 18, 2020
- GM GLOBAL TECHNOLOGY OPERATIONS LLC
- Florian G. Herrault
- G01 - MEASURING TESTING
Information Patent Application
Methods to Design and Uniformly Co-fabricate Small Vias and Large C...
- Publication number 20200152465
- Publication date May 14, 2020
- HRL LABORATORIES, LLC
- Florian G. HERRAULT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Integrated Shielded Circulator
- Publication number 20200006833
- Publication date Jan 2, 2020
- HRL LABORATORIES, LLC
- Jonathan J. LYNCH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WITH METALLIC INTERLOCKING STRUCTURE
- Publication number 20190237400
- Publication date Aug 1, 2019
- HRL LABORATORIES, LLC
- Florian G HERRAULT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Integrated Circuit Architecture
- Publication number 20190198449
- Publication date Jun 27, 2019
- HRL LABORATORIES, LLC
- Florian G. HERRAULT
- H01 - BASIC ELECTRIC ELEMENTS

Florian G. Herrault

Person

Patents Grantslast 30 patents

Through-wafer coaxial transition

Heterogeneous integration of radio frequency transistor chiplets ha...

Chip integration into cavities of a host wafer using lateral dielec...

Built in self-test of heterogeneous integrated radio frequency chip...

Singulation process for chiplets

Built in self-test of heterogeneous integrated radio frequency chip...

Heterogeneous integration of radio frequency transistor chiplets ha...

Photonic integrated module with metal embedded chips

Method for creating cavities in silicon carbide and other semicondu...

Chip integration into cavities of a host wafer using lateral dielec...

Built in self-test of heterogeneous integrated radio frequency chip...

Wafer-level integrated micro-structured heat spreaders

Method and apparatus to increase radar range

Hybrid integrated circuit architecture

Low-temperature-deposited self-biased magnetic composite films cont...

Magnetically anisotropic binder-free films containing discrete hexa...

Electrostatically driven assembly of nanoparticle materials into de...

Method to protect die during metal-embedded chip assembly (MECA) pr...

Radar system with frequency conversion and corresponding method

Hybrid integrated circuit architecture

Methods to design and uniformly co-fabricate small vias and large c...

Impedance-matched through-wafer transition using integrated heat-sp...

Method and apparatus for integrated shielded circulator

Methods for making hydrothermally crystallized water-dispersible he...

Interposer with interconnects and methods of manufacturing the same

Recursive metal embedded chip assembly

Laminated conductors

Laminated conductors

Formation of high-resolution patterns inside deep cavities and appl...

Recursive metal embedded chip assembly

Patents Applicationslast 30 patents

HETEROGENEOUS INTEGRATION OF RADIO FREQUENCY TRANSISTOR CHIPLETS HA...

BUILT IN SELF-TEST OF HETEROGENEOUS INTEGRATED RADIO FREQUENCY CHIP...

CHIP INTEGRATION INTO CAVITIES OF A HOST WAFER USING LATERAL DIELEC...

CHIP INTEGRATION INTO CAVITIES OF A HOST WAFER USING LATERAL DIELEC...

End-Point Detection for Backside Metal Thickness Control

Thermal Isolation Between Embedded MECA Modules

MAGNETICALLY ANISOTROPIC BINDER-FREE FILMS CONTAINING DISCRETE HEXA...

WAFER-LEVEL INTEGRATED MICRO-STRUCTURED HEAT SPREADERS

HYBRID INTEGRATED CIRCUIT ARCHITECTURE

METHOD AND APPARATUS TO INCREASE RADAR RANGE

METHOD TO PROTECT DIE DURING METAL-EMBEDDED CHIP ASSEMBLY (MECA) PR...

RADAR SYSTEM WITH FREQUENCY CONVERSION AND CORRESPONDING METHOD

Methods to Design and Uniformly Co-fabricate Small Vias and Large C...

Method and Apparatus for Integrated Shielded Circulator

INTEGRATED CIRCUIT WITH METALLIC INTERLOCKING STRUCTURE

Hybrid Integrated Circuit Architecture