Flynn P. Carson

Person

Redwood City, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Cell packaging techniques
- Patent number 12,107,283
- Issue date Oct 1, 2024
- Apple Inc.
- Angelo V. Marasco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible package architecture concept in fanout
- Patent number 12,074,077
- Issue date Aug 27, 2024
- Apple Inc.
- Karthik Shanmugam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level passive array packaging
- Patent number 11,395,408
- Issue date Jul 19, 2022
- Apple Inc.
- Scott D. Morrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate-less integrated components
- Patent number 10,991,659
- Issue date Apr 27, 2021
- Apple Inc.
- Flynn P. Carson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming EMI shielding layer with...
- Patent number 10,643,952
- Issue date May 5, 2020
- JCET Semiconductor (Shaoxing) Co., Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked printed circuit board packages
- Patent number 10,631,410
- Issue date Apr 21, 2020
- Apple Inc.
- Corey S. Provencher
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate-less integrated components
- Patent number 10,535,611
- Issue date Jan 14, 2020
- Apple Inc.
- Flynn P. Carson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical interconnects for self shielded system in package (SiP) mo...
- Patent number 10,522,475
- Issue date Dec 31, 2019
- Apple Inc.
- Meng Chi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical interconnects for self shielded system in package (SiP) mo...
- Patent number 10,115,677
- Issue date Oct 30, 2018
- Apple Inc.
- Meng Chi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self shielded system in package (SiP) modules
- Patent number 10,109,593
- Issue date Oct 23, 2018
- Apple Inc.
- Meng Chi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier ultra thin substrate
- Patent number 9,899,239
- Issue date Feb 20, 2018
- Apple Inc.
- Jun Chung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical interconnects for self shielded system in package (SiP) mo...
- Patent number 9,721,903
- Issue date Aug 1, 2017
- Apple Inc.
- Meng Chi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual molded stack TSV package
- Patent number 9,679,801
- Issue date Jun 13, 2017
- Apple Inc.
- Kwan-Yu Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integration of fanout wafer level packages
- Patent number 9,589,936
- Issue date Mar 7, 2017
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming EMI shielding layer with...
- Patent number 9,484,279
- Issue date Nov 1, 2016
- STATS ChipPAC Pte. Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming conductive ink layer as...
- Patent number 9,331,007
- Issue date May 3, 2016
- STATS ChipPAC, Ltd.
- Insang Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked integrated circuit package system
- Patent number 9,236,319
- Issue date Jan 12, 2016
- Stats Chippac Ltd.
- Jong-Woo Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with input/output expansion
- Patent number 8,723,302
- Issue date May 13, 2014
- Stats Chippac Ltd.
- Harry Chandra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having conductive vias in peripheral region co...
- Patent number 8,598,690
- Issue date Dec 3, 2013
- STATS ChipPAC, Ltd.
- Harry Chandra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system for package stacking and method o...
- Patent number 8,409,920
- Issue date Apr 2, 2013
- Stats Chippac Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with pad connection and method...
- Patent number 8,241,965
- Issue date Aug 14, 2012
- Stats Chippac Ltd.
- Henry Descalzo Bathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mountable integrated circuit package system with substrate having a...
- Patent number 8,129,832
- Issue date Mar 6, 2012
- Stats Chippac Ltd.
- Flynn Carson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of electrically connecting a shielding layer to ground throu...
- Patent number 8,110,441
- Issue date Feb 7, 2012
- STATS ChipPAC, Ltd.
- Harry Chandra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked integrated circuit package system and method for manufactur...
- Patent number 8,067,268
- Issue date Nov 29, 2011
- Stats Chippac Ltd.
- Flynn Carson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic ball grid array package with integral heatsink
- Patent number 8,030,756
- Issue date Oct 4, 2011
- ChipPAC, Inc.
- Taekeun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making semiconductor multipackage module including die a...
- Patent number 7,829,382
- Issue date Nov 9, 2010
- ChipPAC, Inc.
- Marcos Karnezos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked integrated circuit package system
- Patent number 7,750,454
- Issue date Jul 6, 2010
- Stats Chippac Ltd.
- Flynn Carson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with stacking module
- Patent number 7,741,154
- Issue date Jun 22, 2010
- Stats Chippac Ltd.
- Jong-Woo Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor multipackage module including die and inverted land g...
- Patent number 7,692,279
- Issue date Apr 6, 2010
- ChipPAC, Inc.
- Marcos Karnezos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked integrated circuit package system and method of manufacture...
- Patent number 7,687,315
- Issue date Mar 30, 2010
- Stats Chippac Ltd.
- Flynn Carson
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Molded Silicon on Passive Package
- Publication number 20230178458
- Publication date Jun 8, 2023
- Apple Inc.
- Kumar Nagarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM PACKAGING FOR MILLIMETER WAVE ANTENNAS
- Publication number 20230066814
- Publication date Mar 2, 2023
- Apple Inc.
- Sidharth S. Dalmia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flexible Package Architecture Concept in Fanout
- Publication number 20220157680
- Publication date May 19, 2022
- Apple Inc.
- Karthik Shanmugam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer-Level Passive Array Packaging
- Publication number 20220071013
- Publication date Mar 3, 2022
- Apple Inc.
- Scott D. Morrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CELL PACKAGING TECHNIQUES
- Publication number 20220013834
- Publication date Jan 13, 2022
- Apple Inc.
- Angelo V. Marasco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE-LESS INTEGRATED COMPONENTS
- Publication number 20200144142
- Publication date May 7, 2020
- Flynn P. Carson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL INTERCONNECTS FOR SELF SHIELDED SYSTEM IN PACKAGE (SiP) MO...
- Publication number 20190027445
- Publication date Jan 24, 2019
- Apple Inc.
- Meng Chi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED PRINTED CIRCUIT BOARD PACKAGES
- Publication number 20180092213
- Publication date Mar 29, 2018
- Apple Inc.
- Corey S. Provencher
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CARRIER ULTRA THIN SUBSTRATE
- Publication number 20180082858
- Publication date Mar 22, 2018
- Apple Inc.
- Jun Chung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL INTERCONNECTS FOR SELF SHIELDED SYSTEM IN PACKAGE (SiP) MO...
- Publication number 20170301631
- Publication date Oct 19, 2017
- Apple Inc.
- Meng Chi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL INTERCONNECTS FOR SELF SHIELDED SYSTEM IN PACKAGE (SIP) MO...
- Publication number 20170179039
- Publication date Jun 22, 2017
- Apple Inc.
- Meng Chi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE-LESS INTEGRATED COMPONENTS
- Publication number 20170148744
- Publication date May 25, 2017
- Apple Inc.
- Flynn P. Carson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER ULTRA THIN SUBSTRATE
- Publication number 20170135219
- Publication date May 11, 2017
- Apple Inc.
- Jun Chung Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELF SHIELDED SYSTEM IN PACKAGE (SiP) MODULES
- Publication number 20170025361
- Publication date Jan 26, 2017
- Apple Inc.
- Meng Chi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming EMI Shielding Layer with...
- Publication number 20170018507
- Publication date Jan 19, 2017
- STATS ChipPAC Pte Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL MOLDED STACK TSV PACKAGE
- Publication number 20160358889
- Publication date Dec 8, 2016
- Apple Inc.
- Kwan-Yu Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTEGRATION OF FANOUT WAFER LEVEL PACKAGES
- Publication number 20160148904
- Publication date May 26, 2016
- Apple Inc.
- Jun ZHAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Conductive Ink Layer as...
- Publication number 20140103509
- Publication date Apr 17, 2014
- STATS ChipPAC, Ltd.
- Insang Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Electrically Connecting a Shield...
- Publication number 20120119348
- Publication date May 17, 2012
- STATS ChipPAC, Ltd.
- Harry Chandra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM FOR PACKAGE STACKING AND METHOD O...
- Publication number 20110306168
- Publication date Dec 15, 2011
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming EMI Shielding Layer with...
- Publication number 20110298101
- Publication date Dec 8, 2011
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PAD CONNECTION AND METHOD...
- Publication number 20110079886
- Publication date Apr 7, 2011
- Henry Descalzo Bathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM AND METHOD FOR MANUFACTUR...
- Publication number 20100224979
- Publication date Sep 9, 2010
- Flynn Carson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INPUT/OUTPUT EXPANSION
- Publication number 20100148344
- Publication date Jun 17, 2010
- Harry Chandra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MAKING SEMICONDUCTOR MULTIPACKAGE MODULE INCLUDING DIE A...
- Publication number 20100136744
- Publication date Jun 3, 2010
- Marcos Karnezos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Electrically Connecting a Shield...
- Publication number 20100072582
- Publication date Mar 25, 2010
- STATS ChipPAC, Ltd.
- Harry Chandra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM
- Publication number 20090243073
- Publication date Oct 1, 2009
- Flynn Carson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM
- Publication number 20090243072
- Publication date Oct 1, 2009
- Jong-Woo Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH STACKING MODULE
- Publication number 20090243071
- Publication date Oct 1, 2009
- Jong-Woo Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTABLE INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SUBSTRATE HAVING A...
- Publication number 20090108428
- Publication date Apr 30, 2009
- Flynn Carson
- H01 - BASIC ELECTRIC ELEMENTS

Flynn P. Carson

Person

Patents Grantslast 30 patents

Cell packaging techniques

Flexible package architecture concept in fanout

Wafer-level passive array packaging

Substrate-less integrated components

Semiconductor device and method of forming EMI shielding layer with...

Stacked printed circuit board packages

Substrate-less integrated components

Vertical interconnects for self shielded system in package (SiP) mo...

Vertical interconnects for self shielded system in package (SiP) mo...

Self shielded system in package (SiP) modules

Carrier ultra thin substrate

Vertical interconnects for self shielded system in package (SiP) mo...

Dual molded stack TSV package

3D integration of fanout wafer level packages

Semiconductor device and method of forming EMI shielding layer with...

Semiconductor device and method of forming conductive ink layer as...

Stacked integrated circuit package system

Integrated circuit package system with input/output expansion

Semiconductor device having conductive vias in peripheral region co...

Integrated circuit package system for package stacking and method o...

Integrated circuit packaging system with pad connection and method...

Mountable integrated circuit package system with substrate having a...

Method of electrically connecting a shielding layer to ground throu...

Stacked integrated circuit package system and method for manufactur...

Plastic ball grid array package with integral heatsink

Method for making semiconductor multipackage module including die a...

Stacked integrated circuit package system

Integrated circuit package system with stacking module

Semiconductor multipackage module including die and inverted land g...

Stacked integrated circuit package system and method of manufacture...

Patents Applicationslast 30 patents

Molded Silicon on Passive Package

SYSTEM PACKAGING FOR MILLIMETER WAVE ANTENNAS

Flexible Package Architecture Concept in Fanout

Wafer-Level Passive Array Packaging

CELL PACKAGING TECHNIQUES

SUBSTRATE-LESS INTEGRATED COMPONENTS

VERTICAL INTERCONNECTS FOR SELF SHIELDED SYSTEM IN PACKAGE (SiP) MO...

STACKED PRINTED CIRCUIT BOARD PACKAGES

CARRIER ULTRA THIN SUBSTRATE

VERTICAL INTERCONNECTS FOR SELF SHIELDED SYSTEM IN PACKAGE (SiP) MO...

VERTICAL INTERCONNECTS FOR SELF SHIELDED SYSTEM IN PACKAGE (SIP) MO...

SUBSTRATE-LESS INTEGRATED COMPONENTS

CARRIER ULTRA THIN SUBSTRATE

SELF SHIELDED SYSTEM IN PACKAGE (SiP) MODULES

Semiconductor Device and Method of Forming EMI Shielding Layer with...

DUAL MOLDED STACK TSV PACKAGE

3D INTEGRATION OF FANOUT WAFER LEVEL PACKAGES

Semiconductor Device and Method of Forming Conductive Ink Layer as...

Semiconductor Device and Method of Electrically Connecting a Shield...

INTEGRATED CIRCUIT PACKAGE SYSTEM FOR PACKAGE STACKING AND METHOD O...

Semiconductor Device and Method of Forming EMI Shielding Layer with...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PAD CONNECTION AND METHOD...

STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM AND METHOD FOR MANUFACTUR...

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INPUT/OUTPUT EXPANSION

METHOD FOR MAKING SEMICONDUCTOR MULTIPACKAGE MODULE INCLUDING DIE A...

Semiconductor Device and Method of Electrically Connecting a Shield...

STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM

STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH STACKING MODULE

MOUNTABLE INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SUBSTRATE HAVING A...