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Francis E. Froebel
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Essex Junction, VT, US
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last 30 patents
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Patent Grant
Encapsulated semiconductor chip module and method of forming the same
Patent number
5,585,600
Issue date
Dec 17, 1996
International Business Machines Corporation
Francis E. Froebel
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Personalized area leadframe coining or half etching for reduced mec...
Patent number
5,576,246
Issue date
Nov 19, 1996
International Business Machines, Corporation
Harold W. Conru
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Personalized area leadframe coining or half etching for reduced mec...
Patent number
5,545,921
Issue date
Aug 13, 1996
International Business Machines, Corporation
Harold W. Conru
H01 - BASIC ELECTRIC ELEMENTS