Francis J. Carney

Person

Mesa, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Supports for thinned semiconductor substrates and related methods
- Patent number 12,132,005
- Issue date Oct 29, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multidie supports and related methods
- Patent number 12,132,008
- Issue date Oct 29, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate via structure and method of manufacture
- Patent number 12,119,294
- Issue date Oct 15, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die sidewall coatings and related methods
- Patent number 12,040,192
- Issue date Jul 16, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Curved semiconductor die systems and related methods
- Patent number 12,020,972
- Issue date Jun 25, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with die including cavities
- Patent number 11,908,699
- Issue date Feb 20, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backmetal removal methods
- Patent number 11,901,184
- Issue date Feb 13, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with die support structure for thin die
- Patent number 11,894,234
- Issue date Feb 6, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-planar semiconductor packaging systems and related methods
- Patent number 11,894,245
- Issue date Feb 6, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Supports for thinned semiconductor substrates and related methods
- Patent number 11,854,995
- Issue date Dec 26, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temporary die support structures and related methods
- Patent number 11,830,756
- Issue date Nov 28, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct bonded copper substrates fabricated using silver sintering
- Patent number 11,776,870
- Issue date Oct 3, 2023
- Semiconductor Components Industries, LLC
- Erik Nino Mercado Tolentino
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor device and method of forming micro interconnect struc...
- Patent number 11,710,691
- Issue date Jul 25, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thinned semiconductor package and related methods
- Patent number 11,646,267
- Issue date May 9, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate via structure and method of manufacture
- Patent number 11,616,008
- Issue date Mar 28, 2023
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with elastic coupler and related methods
- Patent number 11,569,140
- Issue date Jan 31, 2023
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer resin and compression mold chip scale package
- Patent number 11,508,679
- Issue date Nov 22, 2022
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structures and methods of manufacture
- Patent number 11,437,304
- Issue date Sep 6, 2022
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip module supports and related methods
- Patent number 11,437,291
- Issue date Sep 6, 2022
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multidie supports for reducing die warpage
- Patent number 11,430,746
- Issue date Aug 30, 2022
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with thin die and related methods
- Patent number 11,404,276
- Issue date Aug 2, 2022
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die sidewall coatings and related methods
- Patent number 11,404,277
- Issue date Aug 2, 2022
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package electrical contact structures and related met...
- Patent number 11,393,692
- Issue date Jul 19, 2022
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package electrical contacts and related methods
- Patent number 11,367,619
- Issue date Jun 21, 2022
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon-on-insulator die support structures and related methods
- Patent number 11,361,970
- Issue date Jun 14, 2022
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backmetal removal methods
- Patent number 11,348,796
- Issue date May 31, 2022
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with die including cavities and related methods
- Patent number 11,342,189
- Issue date May 24, 2022
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation in a semiconductor device
- Patent number 11,257,759
- Issue date Feb 22, 2022
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming modular 3D semiconductor...
- Patent number 11,211,359
- Issue date Dec 28, 2021
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with an intermetallic layer
- Patent number 11,049,833
- Issue date Jun 29, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIE SIDEWALL COATINGS AND RELATED METHODS
- Publication number 20240332025
- Publication date Oct 3, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURVED SEMICONDUCTOR DIE SYSTEMS AND RELATED METHODS
- Publication number 20240297065
- Publication date Sep 5, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SUBSTRATE VIA STRUCTURE AND METHOD OF MANUFACTURE
- Publication number 20240297106
- Publication date Sep 5, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH DIE INCLUDING CAVITIES AND RELATED METHODS
- Publication number 20240203744
- Publication date Jun 20, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-STACKING MECHANICAL STRENGTH ENHANCEMENT OF POWER DEVICE STRUCT...
- Publication number 20240186285
- Publication date Jun 6, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yusheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-PLANAR SEMICONDUCTOR PACKAGING SYSTEMS AND RELATED METHODS
- Publication number 20240145266
- Publication date May 2, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
SUPPORTS FOR THINNED SEMICONDUCTOR SUBSTRATES AND RELATED METHODS
- Publication number 20240079343
- Publication date Mar 7, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDED COPPER SUBSTRATES FABRICATED USING SILVER SINTERING
- Publication number 20240006266
- Publication date Jan 4, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Erik Nino Mercado TOLENTINO
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20230307343
- Publication date Sep 28, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THINNED SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20230238327
- Publication date Jul 27, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yusheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ELECTRICAL CONTACT STRUCTURES AND RELATED MET...
- Publication number 20220384204
- Publication date Dec 1, 2022
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURES AND METHODS OF MANUFACTURE
- Publication number 20220375833
- Publication date Nov 24, 2022
- Semiconductor Components Industries, LLC
- Yusheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICHIP MODULE SUPPORTS AND RELATED METHODS
- Publication number 20220367305
- Publication date Nov 17, 2022
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE SIDEWALL COATINGS AND RELATED METHODS
- Publication number 20220351977
- Publication date Nov 3, 2022
- Semiconductor Components Industries, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH THIN DIE AND RELATED METHODS
- Publication number 20220351978
- Publication date Nov 3, 2022
- Semiconductor Components Industries, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIDIE SUPPORTS AND RELATED METHODS
- Publication number 20220352095
- Publication date Nov 3, 2022
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON-ON-INSULATOR DIE SUPPORT STRUCTURES AND RELATED METHODS
- Publication number 20220301876
- Publication date Sep 22, 2022
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ELECTRICAL CONTACTS AND RELATED METHODS
- Publication number 20220270884
- Publication date Aug 25, 2022
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH DIE INCLUDING CAVITIES AND RELATED METHODS
- Publication number 20220246434
- Publication date Aug 4, 2022
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKMETAL REMOVAL METHODS
- Publication number 20220238342
- Publication date Jul 28, 2022
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPORARY DIE SUPPORT STRUCTURES AND RELATED METHODS
- Publication number 20210343568
- Publication date Nov 4, 2021
- Semiconductor Components Industries, LLC
- Francis J. CARNEY
- B32 - LAYERED PRODUCTS
Information Patent Application
NON-PLANAR SEMICONDUCTOR PACKAGING SYSTEMS AND RELATED METHODS
- Publication number 20210343555
- Publication date Nov 4, 2021
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
SEMICONDUCTOR PACKAGES WITH PASSIVATING MATERIAL ON DIE SIDEWALLS A...
- Publication number 20210343615
- Publication date Nov 4, 2021
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORTS FOR THINNED SEMICONDUCTOR SUBSTRATES AND RELATED METHODS
- Publication number 20210343655
- Publication date Nov 4, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIDIE SUPPORTS AND RELATED METHODS
- Publication number 20210343657
- Publication date Nov 4, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER CONTACT ABLATION FOR SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20210343540
- Publication date Nov 4, 2021
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURVED SEMICONDUCTOR DIE SYSTEMS AND RELATED METHODS
- Publication number 20210343574
- Publication date Nov 4, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICHIP MODULE SUPPORTS AND RELATED METHODS
- Publication number 20210343612
- Publication date Nov 4, 2021
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
- Publication number 20210327843
- Publication date Oct 21, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDED COPPER SUBSTRATES FABRICATED USING SILVER SINTERING
- Publication number 20210225730
- Publication date Jul 22, 2021
- Semiconductor Components Industries, LLC
- Erik Nino Mercado TOLENTINO
- B22 - CASTING POWDER METALLURGY

Francis J. Carney

Person

Patents Grantslast 30 patents

Supports for thinned semiconductor substrates and related methods

Multidie supports and related methods

Through-substrate via structure and method of manufacture

Die sidewall coatings and related methods

Curved semiconductor die systems and related methods

Semiconductor packages with die including cavities

Backmetal removal methods

Semiconductor packages with die support structure for thin die

Non-planar semiconductor packaging systems and related methods

Supports for thinned semiconductor substrates and related methods

Temporary die support structures and related methods

Direct bonded copper substrates fabricated using silver sintering

Semiconductor device and method of forming micro interconnect struc...

Thinned semiconductor package and related methods

Through-substrate via structure and method of manufacture

Semiconductor package with elastic coupler and related methods

Polymer resin and compression mold chip scale package

Substrate structures and methods of manufacture

Multichip module supports and related methods

Multidie supports for reducing die warpage

Semiconductor packages with thin die and related methods

Die sidewall coatings and related methods

Semiconductor package electrical contact structures and related met...

Semiconductor package electrical contacts and related methods

Silicon-on-insulator die support structures and related methods

Backmetal removal methods

Semiconductor packages with die including cavities and related methods

Isolation in a semiconductor device

Semiconductor device and method of forming modular 3D semiconductor...

Semiconductor packages with an intermetallic layer

Patents Applicationslast 30 patents

DIE SIDEWALL COATINGS AND RELATED METHODS

CURVED SEMICONDUCTOR DIE SYSTEMS AND RELATED METHODS

THROUGH-SUBSTRATE VIA STRUCTURE AND METHOD OF MANUFACTURE

SEMICONDUCTOR PACKAGES WITH DIE INCLUDING CAVITIES AND RELATED METHODS

PRE-STACKING MECHANICAL STRENGTH ENHANCEMENT OF POWER DEVICE STRUCT...

NON-PLANAR SEMICONDUCTOR PACKAGING SYSTEMS AND RELATED METHODS

SUPPORTS FOR THINNED SEMICONDUCTOR SUBSTRATES AND RELATED METHODS

DIRECT BONDED COPPER SUBSTRATES FABRICATED USING SILVER SINTERING

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

THINNED SEMICONDUCTOR PACKAGE AND RELATED METHODS

SEMICONDUCTOR PACKAGE ELECTRICAL CONTACT STRUCTURES AND RELATED MET...

SUBSTRATE STRUCTURES AND METHODS OF MANUFACTURE

MULTICHIP MODULE SUPPORTS AND RELATED METHODS

DIE SIDEWALL COATINGS AND RELATED METHODS

SEMICONDUCTOR PACKAGES WITH THIN DIE AND RELATED METHODS

MULTIDIE SUPPORTS AND RELATED METHODS

SILICON-ON-INSULATOR DIE SUPPORT STRUCTURES AND RELATED METHODS

SEMICONDUCTOR PACKAGE ELECTRICAL CONTACTS AND RELATED METHODS

SEMICONDUCTOR PACKAGES WITH DIE INCLUDING CAVITIES AND RELATED METHODS

BACKMETAL REMOVAL METHODS

TEMPORARY DIE SUPPORT STRUCTURES AND RELATED METHODS

NON-PLANAR SEMICONDUCTOR PACKAGING SYSTEMS AND RELATED METHODS

SEMICONDUCTOR PACKAGES WITH PASSIVATING MATERIAL ON DIE SIDEWALLS A...

SUPPORTS FOR THINNED SEMICONDUCTOR SUBSTRATES AND RELATED METHODS

MULTIDIE SUPPORTS AND RELATED METHODS

LASER CONTACT ABLATION FOR SEMICONDUCTOR PACKAGES AND RELATED METHODS

CURVED SEMICONDUCTOR DIE SYSTEMS AND RELATED METHODS

MULTICHIP MODULE SUPPORTS AND RELATED METHODS

SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER

DIRECT BONDED COPPER SUBSTRATES FABRICATED USING SILVER SINTERING