Francis Roger White

Person

Essex, VT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Trench decoupling capacitor formed by RIE lag of through silicon vi...
- Patent number 8,298,906
- Issue date Oct 30, 2012
- International Business Machines Corporation
- Kerry Bernstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench capacitor for SOI CMOS devices for soft error immunity
- Patent number 8,133,772
- Issue date Mar 13, 2012
- International Business Machines Corporation
- John E. Barth, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SOI body contact using E-DRAM technology
- Patent number 8,053,303
- Issue date Nov 8, 2011
- International Business Machines Corporation
- John E. Barth, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SOI body contact using E-DRAM technology
- Patent number 7,989,893
- Issue date Aug 2, 2011
- International Business Machines Corporation
- John E. Barth, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench capacitor for SOI CMOS devices for soft error immunity
- Patent number 7,989,865
- Issue date Aug 2, 2011
- International Business Machines Corporation
- John Edward Barth, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench capacitor and method of making same
- Patent number 7,812,388
- Issue date Oct 12, 2010
- International Business Machines Corporation
- Timothy Wayne Kemerer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench capacitor and method of making same
- Patent number 7,694,262
- Issue date Apr 6, 2010
- International Business Machines Corporation
- Timothy Wayne Kemerer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual layer etch stop barrier
- Patent number 6,680,259
- Issue date Jan 20, 2004
- International Business Machines Corporation
- Chung Hon Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual layer etch stop barrier
- Patent number 6,548,418
- Issue date Apr 15, 2003
- International Business Machines Corporation
- Chung Hon Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual layer etch stop barrier
- Patent number 6,420,777
- Issue date Jul 16, 2002
- International Business Machines Corporation
- Chung Hon Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buried butted contact and method for fabricating
- Patent number 6,335,272
- Issue date Jan 1, 2002
- International Business Machines Corporation
- Archibald Allen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional SRAM trench structure and fabrication method ther...
- Patent number 6,174,763
- Issue date Jan 16, 2001
- International Business Machines Corporation
- Kenneth Edward Beilstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buried butted contact and method for fabricating
- Patent number 6,153,934
- Issue date Nov 28, 2000
- International Business Machines Corporation
- Archibald Allen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FET device containing a conducting sidewall spacer for local interc...
- Patent number 6,140,171
- Issue date Oct 31, 2000
- International Business Machines Corporation
- Archibald John Allen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hot-electron programmable latch for integrated circuit fuse applica...
- Patent number 6,038,168
- Issue date Mar 14, 2000
- International Business Machines Corporation
- Archibald J. Allen
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor structure incorporating thin film transistors, and me...
- Patent number 6,022,766
- Issue date Feb 8, 2000
- International Business Machines, Inc.
- Bomy Able Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure incorporating thin film transistors with un...
- Patent number 5,675,185
- Issue date Oct 7, 1997
- International Business Machines Corporation
- Bomy Able Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional SRAM trench structure and fabrication method ther...
- Patent number 5,670,803
- Issue date Sep 23, 1997
- International Business Machines Corporation
- Kenneth Edward Beilstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional multichip package methods of fabrication
- Patent number 5,270,261
- Issue date Dec 14, 1993
- International Business Machines Corporation
- Claude L. Bertin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional multichip packages and methods of fabrication
- Patent number 5,202,754
- Issue date Apr 13, 1993
- International Business Machines Corporation
- Claude L. Bertin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for positioning a mask within a concave semiconductor struc...
- Patent number 5,096,849
- Issue date Mar 17, 1992
- International Business Machines Corporation
- Kenneth E. Beilstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of self-aligning a trench isolation structure to an implante...
- Patent number 4,799,990
- Issue date Jan 24, 1989
- IBM Corporation
- Michael L. Kerbaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of making dual well CMOS semiconductor structure with align...
- Patent number 4,558,508
- Issue date Dec 17, 1985
- International Business Machines Corporation
- Wayne I. Kinney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating semiconductor devices utilizing a protectiv...
- Patent number 4,527,325
- Issue date Jul 9, 1985
- International Business Machines Corporation
- Henry J. Geipel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for making polycide structures
- Patent number 4,470,189
- Issue date Sep 11, 1984
- International Business Machines Corporation
- Stanley Roberts
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DEEP TRENCH CAPACITOR FOR SOI CMOS DEVICES FOR SOFT ERROR IMMUNITY
- Publication number 20110177660
- Publication date Jul 21, 2011
- International Business Machines Corporation
- John E. Barth, JR.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOI BODY CONTACT USING E-DRAM TECHNOLOGY
- Publication number 20110177659
- Publication date Jul 21, 2011
- International Business Machines Corporation
- John E. Barth, JR.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH DECOUPLING CAPACITOR FORMED BY RIE LAG OF THROUGH SILICON VI...
- Publication number 20110027962
- Publication date Feb 3, 2011
- International Business Machines Corporation
- Kerry Bernstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH CAPACITOR FOR SOI CMOS DEVICES FOR SOFT ERROR IMMUNITY
- Publication number 20100052026
- Publication date Mar 4, 2010
- International Business Machines Corporation
- John Edward Barth, JR.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOI BODY CONTACT USING E-DRAM TECHNOLOGY
- Publication number 20100052053
- Publication date Mar 4, 2010
- International Business Machines Corporation
- John E. Barth, JR.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH CAPACITOR AND METHOD OF MAKING SAME
- Publication number 20090100388
- Publication date Apr 16, 2009
- Timothy Wayne Kemerer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH CAPACITOR AND METHOD OF MAKING SAME
- Publication number 20080315274
- Publication date Dec 25, 2008
- Timothy Wayne Kemerer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR CONNECTING GROUND/POWER NETWORKS TO PREVEN...
- Publication number 20050242439
- Publication date Nov 3, 2005
- International Business Machines Corporation
- Kenneth L. DeVries
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual layer etch stop barrier
- Publication number 20030207586
- Publication date Nov 6, 2003
- International Business Machines Corporation
- Chung Hon Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon-on-insulator SRAM cells with increased stability and yield
- Publication number 20030058675
- Publication date Mar 27, 2003
- International Business Machines Corporation
- Anthony Gus Aipperspach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual layer etch stop barrier
- Publication number 20020145179
- Publication date Oct 10, 2002
- International Business Machines Corporation
- Chung Hon Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL LAYER ETCH STOP BARRIER
- Publication number 20010013638
- Publication date Aug 16, 2001
- CHUNG HON LAM
- H01 - BASIC ELECTRIC ELEMENTS

Francis Roger White

Person

Patents Grantslast 30 patents

Trench decoupling capacitor formed by RIE lag of through silicon vi...

Deep trench capacitor for SOI CMOS devices for soft error immunity

SOI body contact using E-DRAM technology

SOI body contact using E-DRAM technology

Deep trench capacitor for SOI CMOS devices for soft error immunity

Deep trench capacitor and method of making same

Deep trench capacitor and method of making same

Dual layer etch stop barrier

Dual layer etch stop barrier

Dual layer etch stop barrier

Buried butted contact and method for fabricating

Three-dimensional SRAM trench structure and fabrication method ther...

Buried butted contact and method for fabricating

FET device containing a conducting sidewall spacer for local interc...

Hot-electron programmable latch for integrated circuit fuse applica...

Semiconductor structure incorporating thin film transistors, and me...

Semiconductor structure incorporating thin film transistors with un...

Three-dimensional SRAM trench structure and fabrication method ther...

Three dimensional multichip package methods of fabrication

Three-dimensional multichip packages and methods of fabrication

Process for positioning a mask within a concave semiconductor struc...

Method of self-aligning a trench isolation structure to an implante...

Process of making dual well CMOS semiconductor structure with align...

Process for fabricating semiconductor devices utilizing a protectiv...

Process for making polycide structures

Patents Applicationslast 30 patents

DEEP TRENCH CAPACITOR FOR SOI CMOS DEVICES FOR SOFT ERROR IMMUNITY

SOI BODY CONTACT USING E-DRAM TECHNOLOGY

TRENCH DECOUPLING CAPACITOR FORMED BY RIE LAG OF THROUGH SILICON VI...

DEEP TRENCH CAPACITOR FOR SOI CMOS DEVICES FOR SOFT ERROR IMMUNITY

SOI BODY CONTACT USING E-DRAM TECHNOLOGY

DEEP TRENCH CAPACITOR AND METHOD OF MAKING SAME

DEEP TRENCH CAPACITOR AND METHOD OF MAKING SAME

METHOD AND STRUCTURE FOR CONNECTING GROUND/POWER NETWORKS TO PREVEN...

Dual layer etch stop barrier

Silicon-on-insulator SRAM cells with increased stability and yield

Dual layer etch stop barrier

DUAL LAYER ETCH STOP BARRIER