Francisco Javier Santos Rodriguez

Person

Villach, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Chip package, method of forming a chip package and method of formin...
- Patent number 12,033,972
- Issue date Jul 9, 2024
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device having a barrier region
- Patent number 12,034,066
- Issue date Jul 9, 2024
- Infineon Technologies AG
- Antonio Vellei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device having frame structu...
- Patent number 11,990,520
- Issue date May 21, 2024
- Infineon Technologies AG
- Andre Brockmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for processing a wide band gap semiconductor wafer using a...
- Patent number 11,887,894
- Issue date Jan 30, 2024
- Infineon Technologies AG
- Francisco Javier Santos Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device and semiconductor wafer
- Patent number 11,881,406
- Issue date Jan 23, 2024
- Infineon Technologies AG
- Francisco Javier Santos Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a porous portion, wafer composite and met...
- Patent number 11,881,397
- Issue date Jan 23, 2024
- Infineon Technologies AG
- Iris Moder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rogowski coil integrated in glass substrate
- Patent number 11,856,711
- Issue date Dec 26, 2023
- Infineon Technologies Austria AG
- Alexander Breymesser
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for forming a semiconductor device
- Patent number 11,742,215
- Issue date Aug 29, 2023
- Infineon Technologies AG
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of re-using a silicon carbide substrate
- Patent number 11,735,642
- Issue date Aug 22, 2023
- Infineon Technologies AG
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with one or more support structures
- Patent number 11,626,371
- Issue date Apr 11, 2023
- Infineon Technologies AG
- Francisco Javier Santos Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IGBT with dV/dt controllability
- Patent number 11,581,428
- Issue date Feb 14, 2023
- Infineon Technologies AG
- Alexander Philippou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier, laminate and method of manufacturing semiconductor devices
- Patent number 11,576,259
- Issue date Feb 7, 2023
- Infineon Technologies AG
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a semiconductor wafer, semiconductor composit...
- Patent number 11,515,264
- Issue date Nov 29, 2022
- Infineon Technologies AG
- Francisco Javier Santos Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical power semiconductor device, semiconductor wafer or bare-di...
- Patent number 11,502,190
- Issue date Nov 15, 2022
- Infineon Technologies Austria AG
- Andre Brockmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a porous portion, wafer composite and met...
- Patent number 11,476,111
- Issue date Oct 18, 2022
- Infineon Technologies AG
- Iris Moder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device and semiconductor wafer
- Patent number 11,417,528
- Issue date Aug 16, 2022
- Infineon Technologies AG
- Francisco Javier Santos Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package devices and method for forming semiconductor...
- Patent number 11,393,784
- Issue date Jul 19, 2022
- Infineon Technologies AG
- Roland Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide devices, semiconductor devices and methods for form...
- Patent number 11,342,433
- Issue date May 24, 2022
- Infineon Technologies AG
- Ralf Siemieniec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor device comprising a paste la...
- Patent number 11,329,021
- Issue date May 10, 2022
- Infineon Technologies AG
- Francisco Javier Santos Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device and method of processing a power semicon...
- Patent number 11,251,266
- Issue date Feb 15, 2022
- Infineon Technologies AG
- Philip Christoph Brandt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafers and semiconductor devices with barrier layer a...
- Patent number 11,239,384
- Issue date Feb 1, 2022
- INFINEON TECHNOLOGIESAG
- Francisco Javier Santos Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing a semiconductor de...
- Patent number 11,211,459
- Issue date Dec 28, 2021
- Infineon Technologies AG
- Andre Brockmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass piece and methods of manufacturing glass pieces and semicondu...
- Patent number 11,148,943
- Issue date Oct 19, 2021
- Infineon Technologies AG
- Alexander Breymesser
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Apparatus and method for chemical vapor deposition process for semi...
- Patent number 11,149,351
- Issue date Oct 19, 2021
- Infineon Technologies AG
- Matthias Kuenle
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method of manufacturing a semiconductor de...
- Patent number 11,139,375
- Issue date Oct 5, 2021
- Infineon Technologies AG
- Carsten Schaeffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for processing a wide band gap semiconductor wafer, methods...
- Patent number 11,107,732
- Issue date Aug 31, 2021
- Infineon Technologies AG
- Francisco Javier Santos Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an edge termination region comprising a...
- Patent number 11,094,779
- Issue date Aug 17, 2021
- Infineon Technologies AG
- Philip Christoph Brandt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a substrate assembly and wafer composite stru...
- Patent number 11,081,382
- Issue date Aug 3, 2021
- Infineon Technologies AG
- Francisco Javier Santos Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for splitting semiconductor wafers
- Patent number 11,081,393
- Issue date Aug 3, 2021
- Infineon Technologies AG
- Christian Beyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a monocrystalline substrate and micromechanic...
- Patent number 11,046,577
- Issue date Jun 29, 2021
- Infineon Technologies AG
- Andre Brockmeier
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SILICON CARBIDE DEVICE
- Publication number 20250006814
- Publication date Jan 2, 2025
- INFINEON TECHNOLOGIES AG
- Wolfgang LEHNERT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE COMPRISING A HIGH-K GATE DIELECTRIC MULTILAYER...
- Publication number 20240405092
- Publication date Dec 5, 2024
- INFINEON TECHNOLOGIES AG
- Armin TILKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A POROUS PORTION, WAFER COMPOSITE AND MET...
- Publication number 20240153759
- Publication date May 9, 2024
- INFINEON TECHNOLOGIES AG
- Iris MODER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Forming a Semiconductor Device Having a Second Semicond...
- Publication number 20230395394
- Publication date Dec 7, 2023
- INFINEON TECHNOLOGIES AG
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Semiconductor Devices in a Layer of Epitaxial Si...
- Publication number 20230361196
- Publication date Nov 9, 2023
- Infineon Techmologies AG
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20230317456
- Publication date Oct 5, 2023
- INFINEON TECHNOLOGIES AG
- Moriz Jelinek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATED GATE BIPOLAR TRANSISTOR
- Publication number 20230290828
- Publication date Sep 14, 2023
- Infineon Technologies Austria AG
- Matteo Dainese
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Device Having a Barrier Region
- Publication number 20230207673
- Publication date Jun 29, 2023
- INFINEON TECHNOLOGIES AG
- Antonio Vellei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230154978
- Publication date May 18, 2023
- INFINEON TECHNOLOGIES AG
- Carsten SCHAEFFER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING ION IMPLAN...
- Publication number 20230125859
- Publication date Apr 27, 2023
- INFINEON TECHNOLOGIES AG
- Daniel Schlögl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING AND REUSE OF SEMICONDUCTOR SUBSTRATES
- Publication number 20230127556
- Publication date Apr 27, 2023
- INFINEON TECHNOLOGIES AG
- Bernhard Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SPLITTING SEMICONDUCTOR WAFERS
- Publication number 20230005794
- Publication date Jan 5, 2023
- INFINEON TECHNOLOGIES AG
- Christian Beyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR WAFER
- Publication number 20220367191
- Publication date Nov 17, 2022
- INFINEON TECHNOLOGIES AG
- Francisco Javier SANTOS RODRIGUEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A POROUS PORTION, WAFER COMPOSITE AND MET...
- Publication number 20220359194
- Publication date Nov 10, 2022
- INFINEON TECHNOLOGIES AG
- Iris MODER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Processing a Semiconductor Wafer and Semiconductor Compo...
- Publication number 20220359428
- Publication date Nov 10, 2022
- Francisco Javier Santos Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR DEVICES USING A GLASS STRUCTURE AT...
- Publication number 20220293558
- Publication date Sep 15, 2022
- INFINEON TECHNOLOGIES AG
- Roland Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon Carbide Devices, Semiconductor Devices and Methods for Form...
- Publication number 20220246745
- Publication date Aug 4, 2022
- Ralf Siemieniec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH ONE OR MORE SUPPORT STRUCTURES
- Publication number 20220208691
- Publication date Jun 30, 2022
- INFINEON TECHNOLOGIES AG
- Francisco Javier SANTOS RODRIGUEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Rogowski Coil Integrated in Glass Substrate
- Publication number 20220132677
- Publication date Apr 28, 2022
- Alexander Breymesser
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE HAVING FRAME STRUCTU...
- Publication number 20220085174
- Publication date Mar 17, 2022
- Andre Brockmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Forming a Semiconductor Device
- Publication number 20220037165
- Publication date Feb 3, 2022
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Processing a Wide Band Gap Semiconductor Wafer Using a...
- Publication number 20210351077
- Publication date Nov 11, 2021
- Francisco Javier Santos Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Re-using a Silicon Carbide Substrate
- Publication number 20210265484
- Publication date Aug 26, 2021
- INFINEON TECHNOLOGIES AG
- Hans-Joachim SCHULZE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Splitting Semiconductor Wafers
- Publication number 20210175123
- Publication date Jun 10, 2021
- INFINEON TECHNOLOGIES AG
- Christian Beyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vertical Power Semiconductor Device, Semiconductor Wafer or Bare-Di...
- Publication number 20210167195
- Publication date Jun 3, 2021
- Infineon Technologies Austria AG
- Andre Brockmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...
- Publication number 20210082861
- Publication date Mar 18, 2021
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Processing a Power Semiconductor Device
- Publication number 20210050436
- Publication date Feb 18, 2021
- Antonio Vellei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IGBT with dV/dt Controllability
- Publication number 20210043759
- Publication date Feb 11, 2021
- INFINEON TECHNOLOGIES AG
- Alexander Philippou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Processing a Substrate Assembly and Wafer Composite Stru...
- Publication number 20200402832
- Publication date Dec 24, 2020
- Francisco Javier Santos Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GENERATING A MEMS DEVICE WITH GLASS COVER AND MEMS DEVICE
- Publication number 20200385264
- Publication date Dec 10, 2020
- INFINEON TECHNOLOGIES AG
- Andre BROCKMEIER
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Francisco Javier Santos Rodriguez

Person

Patents Grantslast 30 patents

Chip package, method of forming a chip package and method of formin...

Power semiconductor device having a barrier region

Method of manufacturing a semiconductor device having frame structu...

Methods for processing a wide band gap semiconductor wafer using a...

Method of manufacturing a semiconductor device and semiconductor wafer

Semiconductor device with a porous portion, wafer composite and met...

Rogowski coil integrated in glass substrate

Methods for forming a semiconductor device

Methods of re-using a silicon carbide substrate

Semiconductor structure with one or more support structures

IGBT with dV/dt controllability

Carrier, laminate and method of manufacturing semiconductor devices

Method for processing a semiconductor wafer, semiconductor composit...

Vertical power semiconductor device, semiconductor wafer or bare-di...

Semiconductor device with a porous portion, wafer composite and met...

Method of manufacturing a semiconductor device and semiconductor wafer

Semiconductor package devices and method for forming semiconductor...

Silicon carbide devices, semiconductor devices and methods for form...

Method for fabricating a semiconductor device comprising a paste la...

Power semiconductor device and method of processing a power semicon...

Semiconductor wafers and semiconductor devices with barrier layer a...

Semiconductor device and method of manufacturing a semiconductor de...

Glass piece and methods of manufacturing glass pieces and semicondu...

Apparatus and method for chemical vapor deposition process for semi...

Semiconductor device and method of manufacturing a semiconductor de...

Methods for processing a wide band gap semiconductor wafer, methods...

Semiconductor device having an edge termination region comprising a...

Method for processing a substrate assembly and wafer composite stru...

Method for splitting semiconductor wafers

Method for processing a monocrystalline substrate and micromechanic...

Patents Applicationslast 30 patents

SILICON CARBIDE DEVICE

SEMICONDUCTOR DEVICE COMPRISING A HIGH-K GATE DIELECTRIC MULTILAYER...

SEMICONDUCTOR DEVICE WITH A POROUS PORTION, WAFER COMPOSITE AND MET...

Methods for Forming a Semiconductor Device Having a Second Semicond...

Methods of Forming Semiconductor Devices in a Layer of Epitaxial Si...

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

INSULATED GATE BIPOLAR TRANSISTOR

Power Semiconductor Device Having a Barrier Region

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING ION IMPLAN...

MANUFACTURING AND REUSE OF SEMICONDUCTOR SUBSTRATES

METHOD FOR SPLITTING SEMICONDUCTOR WAFERS

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR WAFER

SEMICONDUCTOR DEVICE WITH A POROUS PORTION, WAFER COMPOSITE AND MET...

Method for Processing a Semiconductor Wafer and Semiconductor Compo...

METHOD FOR FORMING SEMICONDUCTOR DEVICES USING A GLASS STRUCTURE AT...

Silicon Carbide Devices, Semiconductor Devices and Methods for Form...

SEMICONDUCTOR STRUCTURE WITH ONE OR MORE SUPPORT STRUCTURES

Rogowski Coil Integrated in Glass Substrate

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE HAVING FRAME STRUCTU...

Methods for Forming a Semiconductor Device

Methods for Processing a Wide Band Gap Semiconductor Wafer Using a...

Methods of Re-using a Silicon Carbide Substrate

Method for Splitting Semiconductor Wafers

Vertical Power Semiconductor Device, Semiconductor Wafer or Bare-Di...

CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...

Method of Processing a Power Semiconductor Device

IGBT with dV/dt Controllability

Method for Processing a Substrate Assembly and Wafer Composite Stru...

GENERATING A MEMS DEVICE WITH GLASS COVER AND MEMS DEVICE