Frank Baiocchi

Person

Allentown, PA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices with a sloped surface
- Patent number 11,195,915
- Issue date Dec 7, 2021
- Texas Instruments Incorporated
- Haian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power unit with an integrated pull-down transistor
- Patent number 10,826,487
- Issue date Nov 3, 2020
- Texas Instruments Incorporated
- Haian Lin
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Source down power FET with integrated temperature sensor
- Patent number 10,812,064
- Issue date Oct 20, 2020
- Texas Instruments Incorporated
- Haian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching field plate power MOSFET
- Patent number 10,804,263
- Issue date Oct 13, 2020
- Texas Instruments Incorporated
- Haian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power MOSFET with a deep source contact
- Patent number 10,746,890
- Issue date Aug 18, 2020
- Texas Instruments Incorporated
- Furen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power MOSFET with metal filled deep source contact
- Patent number 10,707,344
- Issue date Jul 7, 2020
- Texas Instruments Incorporated
- Furen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source down power FET with integrated temperature sensor
- Patent number 10,581,426
- Issue date Mar 3, 2020
- Texas Instruments Incorporated
- Haian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated transistor and protection diode and fabrication method
- Patent number 10,529,705
- Issue date Jan 7, 2020
- Texas Instruments Incorporated
- Haian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated transistor and protection diode and fabrication method
- Patent number 10,529,706
- Issue date Jan 7, 2020
- Texas Instruments Incorporated
- Haian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated transistor and protection diode and fabrication method
- Patent number 10,319,712
- Issue date Jun 11, 2019
- Texas Instruments Incorporated
- Haian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power MOSFET with a deep source contact
- Patent number 10,068,977
- Issue date Sep 4, 2018
- Texas Instruments Incorporated
- Furen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power MOSFET with metal filled deep source contact
- Patent number 9,853,144
- Issue date Dec 26, 2017
- Texas Instruments Incorporated
- Furen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithically integrated transistors for a buck converter using so...
- Patent number 9,646,965
- Issue date May 9, 2017
- Texas Instruments Incorporated
- Jun Wang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Moisture barrier for a wire bond
- Patent number 9,136,245
- Issue date Sep 15, 2015
- Avago Technologies General IP (Singapore) Pte. Ltd.
- John M. DeLucca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Moisture barrier for a wire bond
- Patent number 8,766,436
- Issue date Jul 1, 2014
- LSI Corporation
- John M. DeLucca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Allotropic or morphologic change in silicon induced by electromagne...
- Patent number 8,610,215
- Issue date Dec 17, 2013
- Agere Systems LLC
- Frank A. Baiocchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric etching
- Patent number 8,318,606
- Issue date Nov 27, 2012
- LSI Corporation
- Frank Baiocchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Soldering method and related device for improved resistance to brit...
- Patent number 8,242,378
- Issue date Aug 14, 2012
- Agere Systems Inc.
- Ahmed Amin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Aluminum bond pads with enhanced wire bond stability
- Patent number 8,101,871
- Issue date Jan 24, 2012
- LSI Corporation
- Frank A. Baiocchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Material removing processes in device formation and the devices for...
- Patent number 7,972,873
- Issue date Jul 5, 2011
- Agere Systems Inc.
- Frank A. Baiocchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of making electronic entities
- Patent number 7,724,359
- Issue date May 25, 2010
- Agere Systems Inc.
- Ahmed Nur Amin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Calibration standard for transmission electron microscopy
- Patent number 7,291,849
- Issue date Nov 6, 2007
- Agere Systems Inc.
- Frank A. Baiocchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-oxide-semiconductor device with enhanced source electrode
- Patent number 7,126,193
- Issue date Oct 24, 2006
- Ciclon Semiconductor Device Corp.
- Frank A. Baiocchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced substrate contact for a semiconductor device
- Patent number 7,041,561
- Issue date May 9, 2006
- Agere Systems Inc.
- Frank A. Baiocchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making enhanced substrate contact for a semiconductor de...
- Patent number 6,987,052
- Issue date Jan 17, 2006
- Agere Systems Inc.
- Frank A. Baiocchi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES WITH A SLOPED SURFACE
- Publication number 20200328275
- Publication date Oct 15, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Haian LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOURCE DOWN POWER FET WITH INTEGRATED TEMPERATURE SENSOR
- Publication number 20200295748
- Publication date Sep 17, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Haian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Transistor and Protection Diode and Fabrication Method
- Publication number 20190259745
- Publication date Aug 22, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Haian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Transistor and Protection Diode and Fabrication Method
- Publication number 20190229110
- Publication date Jul 25, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Haian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER UNIT WITH AN INTEGRATED PULL-DOWN TRANSISTOR
- Publication number 20190173464
- Publication date Jun 6, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Haian Lin
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
POWER MOSFET WITH A DEEP SOURCE CONTACT
- Publication number 20190004201
- Publication date Jan 3, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Furen LIN
- G01 - MEASURING TESTING
Information Patent Application
Power MOSFET with a Deep Source Contact
- Publication number 20180204917
- Publication date Jul 19, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Furen LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED TRANSISTOR AND PROTECTION DIODE AND FABRICATION METHOD
- Publication number 20180130789
- Publication date May 10, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Haian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Switching Field Plate Power MOSFET
- Publication number 20180090490
- Publication date Mar 29, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Haian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MOSFET WITH METAL FILLED DEEP SOURCE CONTACT
- Publication number 20180076320
- Publication date Mar 15, 2018
- TEXAS INSTRUMENTS INCORPORATED
- FUREN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MOSFET WITH METAL FILLED DEEP SOURCE CONTACT
- Publication number 20170207335
- Publication date Jul 20, 2017
- TEXAS INSTRUMENTS INCORPORATED
- FUREN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHICALLY INTEGRATED TRANSISTORS FOR A BUCK CONVERTER USING SO...
- Publication number 20150214222
- Publication date Jul 30, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Jun WANG
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
MOISTURE BARRIER FOR A WIRE BOND
- Publication number 20140349475
- Publication date Nov 27, 2014
- LSI Corporation
- John M. DeLucca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERING METHOD AND RELATED DEVICE FOR IMPROVED RESISTANCE TO BRIT...
- Publication number 20120280023
- Publication date Nov 8, 2012
- LSI Corporation
- Ahmed Amin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOISTURE BARRIER FOR A WIRE BOND
- Publication number 20120223432
- Publication date Sep 6, 2012
- LSI Corporation
- JOHN M. DELUCCA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALLOTROPIC CHANGES IN SI AND USE IN FABRICATING MATERIALS FOR SOLAR...
- Publication number 20120204941
- Publication date Aug 16, 2012
- James T. Cargo
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ALUMINUM BOND PADS WITH ENHANCED WIRE BOND STABILITY
- Publication number 20120111927
- Publication date May 10, 2012
- LSI Corporation
- Frank A. Baiocchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFICATION OF LOGIC BY MORPHOLOGICAL MANIPULATION OF A SEMICONDUC...
- Publication number 20120033479
- Publication date Feb 9, 2012
- LSI Corporation
- John M. DeLucca
- G11 - INFORMATION STORAGE
Information Patent Application
ALLOTROPIC OR MORPHOLOGIC CHANGE IN SILICON INDUCED BY ELECTROMAGNE...
- Publication number 20110163419
- Publication date Jul 7, 2011
- Agere Systems Inc.
- Frank A. Baiocchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dielectric Etching
- Publication number 20110053378
- Publication date Mar 3, 2011
- LSI CORPORATION
- Frank Baiocchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INHIBITION OF COPPER DISSOLUTION FOR LEAD-FREE SOLDERING
- Publication number 20100319967
- Publication date Dec 23, 2010
- Agere Systems Inc.
- Ahmed Amin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ALUMINUM BOND PADS WITH ENHANCED WIRE BOND STABILITY
- Publication number 20100300741
- Publication date Dec 2, 2010
- LSI Corporation
- Frank A. Baiocchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Soldering Method and Related Device for Improved Resistance to Brit...
- Publication number 20100243300
- Publication date Sep 30, 2010
- Ahmed Amin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Material removing processes in device formation and the devices for...
- Publication number 20100102398
- Publication date Apr 29, 2010
- Frank A. Baiocchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of making electronic entities
- Publication number 20090298286
- Publication date Dec 3, 2009
- Ahmed Nur Amin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of fabricating an electronic device
- Publication number 20090029490
- Publication date Jan 29, 2009
- Frank A. Baiocchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-OXIDE-SEMICONDUCTOR DEVICE WITH ENHANCED SOURCE ELECTRODE
- Publication number 20070007593
- Publication date Jan 11, 2007
- CICLON SEMICONDUCTOR DEVICE CORP.
- Frank A. Baiocchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Enhanced substrate contact for a semiconductor device
- Publication number 20050221563
- Publication date Oct 6, 2005
- Frank A. Baiocchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Enhanced substrate contact for a semiconductor device
- Publication number 20050093097
- Publication date May 5, 2005
- Frank A. Baiocchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal-oxide-semiconductor device with enhanced source electrode
- Publication number 20050077552
- Publication date Apr 14, 2005
- Frank A. Baiocchi
- H01 - BASIC ELECTRIC ELEMENTS

Frank Baiocchi

Person

Patents Grantslast 30 patents

Semiconductor devices with a sloped surface

Power unit with an integrated pull-down transistor

Source down power FET with integrated temperature sensor

Switching field plate power MOSFET

Power MOSFET with a deep source contact

Power MOSFET with metal filled deep source contact

Source down power FET with integrated temperature sensor

Integrated transistor and protection diode and fabrication method

Integrated transistor and protection diode and fabrication method

Integrated transistor and protection diode and fabrication method

Power MOSFET with a deep source contact

Power MOSFET with metal filled deep source contact

Monolithically integrated transistors for a buck converter using so...

Moisture barrier for a wire bond

Moisture barrier for a wire bond

Allotropic or morphologic change in silicon induced by electromagne...

Dielectric etching

Soldering method and related device for improved resistance to brit...

Aluminum bond pads with enhanced wire bond stability

Material removing processes in device formation and the devices for...

Method of making electronic entities

Calibration standard for transmission electron microscopy

Metal-oxide-semiconductor device with enhanced source electrode

Enhanced substrate contact for a semiconductor device

Method for making enhanced substrate contact for a semiconductor de...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES WITH A SLOPED SURFACE

SOURCE DOWN POWER FET WITH INTEGRATED TEMPERATURE SENSOR

Integrated Transistor and Protection Diode and Fabrication Method

Integrated Transistor and Protection Diode and Fabrication Method

POWER UNIT WITH AN INTEGRATED PULL-DOWN TRANSISTOR

POWER MOSFET WITH A DEEP SOURCE CONTACT

Power MOSFET with a Deep Source Contact

INTEGRATED TRANSISTOR AND PROTECTION DIODE AND FABRICATION METHOD

Switching Field Plate Power MOSFET

POWER MOSFET WITH METAL FILLED DEEP SOURCE CONTACT

POWER MOSFET WITH METAL FILLED DEEP SOURCE CONTACT

MONOLITHICALLY INTEGRATED TRANSISTORS FOR A BUCK CONVERTER USING SO...

MOISTURE BARRIER FOR A WIRE BOND

SOLDERING METHOD AND RELATED DEVICE FOR IMPROVED RESISTANCE TO BRIT...

MOISTURE BARRIER FOR A WIRE BOND

ALLOTROPIC CHANGES IN SI AND USE IN FABRICATING MATERIALS FOR SOLAR...

ALUMINUM BOND PADS WITH ENHANCED WIRE BOND STABILITY

MODIFICATION OF LOGIC BY MORPHOLOGICAL MANIPULATION OF A SEMICONDUC...

ALLOTROPIC OR MORPHOLOGIC CHANGE IN SILICON INDUCED BY ELECTROMAGNE...

Dielectric Etching

INHIBITION OF COPPER DISSOLUTION FOR LEAD-FREE SOLDERING

ALUMINUM BOND PADS WITH ENHANCED WIRE BOND STABILITY

Soldering Method and Related Device for Improved Resistance to Brit...

Material removing processes in device formation and the devices for...

Method of making electronic entities

Method of fabricating an electronic device

METAL-OXIDE-SEMICONDUCTOR DEVICE WITH ENHANCED SOURCE ELECTRODE

Enhanced substrate contact for a semiconductor device

Enhanced substrate contact for a semiconductor device

Metal-oxide-semiconductor device with enhanced source electrode