Frank E. Mantz

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Hawthorne, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Post in ring interconnect using for 3-D stacking
- Patent number 6,573,460
- Issue date Jun 3, 2003
- DPAC Technologies Corp.
- Glen E. Roeters
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Retaining ring interconnect used for 3-D stacking
- Patent number 6,573,461
- Issue date Jun 3, 2003
- DPAC Technologies Corp.
- Glen E. Roeters
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Thermal ring used in 3-D stacking
- Publication number 20030085455
- Publication date May 8, 2003
- Glen E. Roeters
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POST IN RING INTERCONNECT USING FOR 3-D STACKING
- Publication number 20030051906
- Publication date Mar 20, 2003
- Glen E. Roeters
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RETAINING RING INTERCONNECT USED FOR 3-D STACKING
- Publication number 20030051907
- Publication date Mar 20, 2003
- Glen E. Roeters
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Retaining ring interconnect used for 3-D stacking
- Publication number 20030051903
- Publication date Mar 20, 2003
- Dense-Pac Microsystems, Inc. a California corporation
- Glen E. Roeters
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Post in ring interconnect using 3-D stacking
- Publication number 20030051911
- Publication date Mar 20, 2003
- Glen E. Roeters
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
I/O interface structure
- Publication number 20030002267
- Publication date Jan 2, 2003
- Frank E. Mantz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Slice interconnect structure
- Publication number 20020190367
- Publication date Dec 19, 2002
- Frank E. Mantz
- H01 - BASIC ELECTRIC ELEMENTS