Frank Hille

Person

Muenchen, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Chip package, method of forming a chip package and method of formin...
- Patent number 12,033,972
- Issue date Jul 9, 2024
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device load terminal
- Patent number 11,315,892
- Issue date Apr 26, 2022
- Infineon Technologies AG
- Roman Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an electrical contact and method of forming a chi...
- Patent number 10,978,418
- Issue date Apr 13, 2021
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide semiconductor device having a metal adhesion and ba...
- Patent number 10,777,506
- Issue date Sep 15, 2020
- Infineon Technologies AG
- Frank Hille
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage termination structure of a power semiconductor device
- Patent number 10,636,900
- Issue date Apr 28, 2020
- Infineon Technologies Austria AG
- Viktoryia Uhnevionak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallization and its use in, in particular, an IGBT or a diode
- Patent number 10,535,743
- Issue date Jan 14, 2020
- Infineon Technologies AG
- Frank Hille
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a metal adhesion and barrier structure...
- Patent number 10,475,743
- Issue date Nov 12, 2019
- Infineon Technologies AG
- Frank Hille
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming a chip package with a metal cont...
- Patent number 10,461,056
- Issue date Oct 29, 2019
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices by using epitaxy and...
- Patent number 10,276,656
- Issue date Apr 30, 2019
- Infineon Technologies AG
- Frank Hille
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device load terminal
- Patent number 10,079,217
- Issue date Sep 18, 2018
- Infineon Technologies AG
- Roman Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor to metal transition for semiconductor devices
- Patent number 9,685,504
- Issue date Jun 20, 2017
- Infineon Technologies AG
- Andreas Haertl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a reduced free-charge carrier lifetime semi...
- Patent number 9,543,405
- Issue date Jan 10, 2017
- Infineon Technologies AG
- Holger Ruething
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor to metal transition
- Patent number 9,443,971
- Issue date Sep 13, 2016
- Infineon Technologies AG
- Andreas Haertl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor diode and method of manufacturing a semiconductor diode
- Patent number 9,385,181
- Issue date Jul 5, 2016
- Infineon Technologies AG
- Hans Peter Felsl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component
- Patent number 9,312,334
- Issue date Apr 12, 2016
- Infineon Technologies Austria AG
- Holger Ruething
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component
- Patent number 8,860,133
- Issue date Oct 14, 2014
- Infineon Technologies Austria AG
- Holger Ruething
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor having a graded pn junction
- Patent number 8,741,750
- Issue date Jun 3, 2014
- Infineon Technologies Austria AG
- Frank Hille
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabrication method
- Patent number 8,367,532
- Issue date Feb 5, 2013
- Infineon Technologies AG
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component
- Patent number 8,344,415
- Issue date Jan 1, 2013
- Infineon Technologies Austria AG
- Holger Ruething
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallization and its use in, in particular, an IGBT or a diode
- Patent number 8,314,019
- Issue date Nov 20, 2012
- Infineon Technologies AG
- Frank Hille
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabrication method
- Patent number 8,252,671
- Issue date Aug 28, 2012
- Infineon Technologies Austria AG
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallization and its use in, in particular, an IGBT or a diode
- Patent number 8,008,712
- Issue date Aug 30, 2011
- Infineon Technologies AG
- Frank Hille
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabrication method
- Patent number 8,003,502
- Issue date Aug 23, 2011
- Infineon Technologies Austria AG
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced free-charge carrier lifetime device
- Patent number 7,932,583
- Issue date Apr 26, 2011
- Infineon Technologies Austria AG
- Holger Ruething
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a free wheeling diode
- Patent number 7,880,200
- Issue date Feb 1, 2011
- Infineon Technologies Austria AG
- Frank Hille
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device
- Patent number 7,768,093
- Issue date Aug 3, 2010
- Infineon Technologies Austria AG
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component and method
- Patent number 7,709,887
- Issue date May 4, 2010
- Infineon Technologies Austria AG
- Frank Hille
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing an integrated circuit having semiconductor zon...
- Patent number 7,645,690
- Issue date Jan 12, 2010
- Infineon Technologies Austria AG
- Markus Zundel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reverse conducting IGBT with vertical carrier lifetime adjustment
- Patent number 7,557,386
- Issue date Jul 7, 2009
- Infineon Technologies Austria AG
- Holger Ruething
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device
- Patent number 7,541,660
- Issue date Jun 2, 2009
- Infineon Technologies Austria AG
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Power Semiconductor Device and Method of Producing a Power Semicond...
- Publication number 20240213343
- Publication date Jun 27, 2024
- INFINEON TECHNOLOGIES AG
- Roland Dietmüller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having a Field Termination Structure and a Cha...
- Publication number 20240194778
- Publication date Jun 13, 2024
- Michael Hell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...
- Publication number 20210082861
- Publication date Mar 18, 2021
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon Carbide Semiconductor Device Having a Metal Adhesion and Ba...
- Publication number 20200013722
- Publication date Jan 9, 2020
- Frank Hille
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE WITH A METAL CONT...
- Publication number 20200013749
- Publication date Jan 9, 2020
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Voltage Termination Structure of a Power Semiconductor Device
- Publication number 20190109230
- Publication date Apr 11, 2019
- Infineon Technologies Austria AG
- Viktoryia Uhnevionak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE LOAD TERMINAL
- Publication number 20180366428
- Publication date Dec 20, 2018
- INFINEON TECHNOLOGIES AG
- Roman ROTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing Semiconductor Devices by Using Epitaxy and...
- Publication number 20180226471
- Publication date Aug 9, 2018
- INFINEON TECHNOLOGIES AG
- Frank Hille
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metallization and Its Use In, In Particular, an IGBT or a Diode
- Publication number 20180047815
- Publication date Feb 15, 2018
- INFINEON TECHNOLOGIES AG
- Frank Hille
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...
- Publication number 20170338169
- Publication date Nov 23, 2017
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having a Metal Adhesion and Barrier Structure...
- Publication number 20170271268
- Publication date Sep 21, 2017
- INFINEON TECHNOLOGIES AG
- Frank Hille
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE LOAD TERMINAL
- Publication number 20170221842
- Publication date Aug 3, 2017
- INFINEON TECHNOLOGIES AG
- Roman ROTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor to Metal Transition for Semiconductor Devices
- Publication number 20160372539
- Publication date Dec 22, 2016
- INFINEON TECHNOLOGIES AG
- Andreas Haertl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor to Metal Transition
- Publication number 20160141406
- Publication date May 19, 2016
- INFINEON TECHNOLOGIES AG
- Andreas Haertl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Diode and Method of Manufacturing a Semiconductor Diode
- Publication number 20150206983
- Publication date Jul 23, 2015
- INFINEON TECHNOLOGIES AG
- Hans Peter Felsl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT
- Publication number 20150008480
- Publication date Jan 8, 2015
- Infineon Technologies Austria AG
- Holger Ruething
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Reduced Free-Charge Carrier Lifetime Semi...
- Publication number 20140213022
- Publication date Jul 31, 2014
- Holger Ruething
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT
- Publication number 20130113087
- Publication date May 9, 2013
- Infineon Technologies Austria AG
- Holger Ruething
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metallization and Its Use In, In Particular, an IGBT or a Diode
- Publication number 20130037954
- Publication date Feb 14, 2013
- INFINEON TECHNOLOGIES AG
- Frank Hille
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD
- Publication number 20120315747
- Publication date Dec 13, 2012
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metallization and Its Use In, In Particular, an IGBT or a Diode
- Publication number 20110300707
- Publication date Dec 8, 2011
- Infineon Technologies AG
- Frank Hille
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD
- Publication number 20110275202
- Publication date Nov 10, 2011
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vertical IGBT Device
- Publication number 20100117117
- Publication date May 13, 2010
- INFINEON TECHNOLOGIES AG
- Holger Ruething
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR HAVING A GRADED PN JUNCTION
- Publication number 20100087053
- Publication date Apr 8, 2010
- Infineon Technologies Austria AG
- Frank Hille
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reduced Free-Charge Carrier Lifetime Device
- Publication number 20090283799
- Publication date Nov 19, 2009
- INFINEON TECHNOLOGIES AG
- Holger Ruething
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Device
- Publication number 20090206440
- Publication date Aug 20, 2009
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and Fabrication method
- Publication number 20090186462
- Publication date Jul 23, 2009
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20090085103
- Publication date Apr 2, 2009
- Infineon Technologies Austria AG
- Frank Hille
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT
- Publication number 20080135871
- Publication date Jun 12, 2008
- INFINEON TECHNOLOGIES AUSTRIA AG
- Holger Ruething
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING AN INTEGRATED CIRCUIT HAVING SEMICONDUCTOR ZON...
- Publication number 20080044988
- Publication date Feb 21, 2008
- Infineon Technologies Austria AG
- Markus Zundel
- H01 - BASIC ELECTRIC ELEMENTS

Frank Hille

Person

Patents Grantslast 30 patents

Chip package, method of forming a chip package and method of formin...

Power semiconductor device load terminal

Method of forming an electrical contact and method of forming a chi...

Silicon carbide semiconductor device having a metal adhesion and ba...

High voltage termination structure of a power semiconductor device

Metallization and its use in, in particular, an IGBT or a diode

Semiconductor device having a metal adhesion and barrier structure...

Chip package and method of forming a chip package with a metal cont...

Method of manufacturing semiconductor devices by using epitaxy and...

Power semiconductor device load terminal

Semiconductor to metal transition for semiconductor devices

Method of manufacturing a reduced free-charge carrier lifetime semi...

Semiconductor to metal transition

Semiconductor diode and method of manufacturing a semiconductor diode

Semiconductor component

Semiconductor component

Method for fabricating a semiconductor having a graded pn junction

Semiconductor device and fabrication method

Semiconductor component

Metallization and its use in, in particular, an IGBT or a diode

Semiconductor device and fabrication method

Metallization and its use in, in particular, an IGBT or a diode

Semiconductor device and fabrication method

Reduced free-charge carrier lifetime device

Semiconductor device including a free wheeling diode

Power semiconductor device

Semiconductor component and method

Method for producing an integrated circuit having semiconductor zon...

Reverse conducting IGBT with vertical carrier lifetime adjustment

Power semiconductor device

Patents Applicationslast 30 patents

Power Semiconductor Device and Method of Producing a Power Semicond...

Semiconductor Device Having a Field Termination Structure and a Cha...

CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...

Silicon Carbide Semiconductor Device Having a Metal Adhesion and Ba...

CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE WITH A METAL CONT...

High Voltage Termination Structure of a Power Semiconductor Device

POWER SEMICONDUCTOR DEVICE LOAD TERMINAL

Method of Manufacturing Semiconductor Devices by Using Epitaxy and...

Metallization and Its Use In, In Particular, an IGBT or a Diode

CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...

Semiconductor Device Having a Metal Adhesion and Barrier Structure...

POWER SEMICONDUCTOR DEVICE LOAD TERMINAL

Semiconductor to Metal Transition for Semiconductor Devices

Semiconductor to Metal Transition

Semiconductor Diode and Method of Manufacturing a Semiconductor Diode

SEMICONDUCTOR COMPONENT

Method of Manufacturing a Reduced Free-Charge Carrier Lifetime Semi...

SEMICONDUCTOR COMPONENT

Metallization and Its Use In, In Particular, an IGBT or a Diode

SEMICONDUCTOR DEVICE AND FABRICATION METHOD

Metallization and Its Use In, In Particular, an IGBT or a Diode

SEMICONDUCTOR DEVICE AND FABRICATION METHOD

Vertical IGBT Device

METHOD FOR FABRICATING A SEMICONDUCTOR HAVING A GRADED PN JUNCTION

Reduced Free-Charge Carrier Lifetime Device

Power Semiconductor Device

Semiconductor device and Fabrication method

SEMICONDUCTOR DEVICE AND METHOD

SEMICONDUCTOR COMPONENT

METHOD FOR PRODUCING AN INTEGRATED CIRCUIT HAVING SEMICONDUCTOR ZON...