Frank J. Juskey

Person

Coral Spring, FL, US

People

Patents Grantslast 30 patents

Information Patent Grant
Laser defined pads for flip chip on leadframe package fabrication m...
- Patent number 6,593,545
- Issue date Jul 15, 2003
- Amkor Technology, Inc.
- Jonathon Gerrit Greenwood
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser defined pads for flip chip on leadframe package
- Patent number 6,577,012
- Issue date Jun 10, 2003
- Amkor Technology, Inc.
- Jonathon Gerrit Greenwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip integrated circuit and passive chip component package fab...
- Patent number 6,546,620
- Issue date Apr 15, 2003
- Amkor Technology, Inc.
- Frank Juskey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for molding semiconductor package having a ceramic substrate
- Patent number 6,534,338
- Issue date Mar 18, 2003
- Amkor Technology, Inc.
- Ronald J. Schoonejongen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board with integral heat sink for semiconductor pac...
- Patent number 6,507,102
- Issue date Jan 14, 2003
- Amkor Technology, Inc.
- Frank J. Juskey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for attaching multiple metal components to int...
- Patent number 6,417,576
- Issue date Jul 9, 2002
- Amkor Technology, Inc.
- Ron Ellenberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package having flip chip integrated circuit and passive...
- Patent number 6,356,453
- Issue date Mar 12, 2002
- Amkor Technology, Inc.
- Frank Juskey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Making semiconductor packages with stacked dies and reinforced wire...
- Patent number 6,340,846
- Issue date Jan 22, 2002
- Amkor Technology, Inc.
- Anthony J. LoBianco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-cost printed circuit board with integral heat sink for semicond...
- Patent number 6,337,228
- Issue date Jan 8, 2002
- Amkor Technology, Inc.
- Frank J. Juskey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly
- Patent number 6,137,690
- Issue date Oct 24, 2000
- Motorola
- Robert Thomas Carson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selective call receiver having a display module with integrated cir...
- Patent number 6,069,679
- Issue date May 30, 2000
- Motorola, Inc.
- Scott Joslin
- G02 - OPTICS
Information Patent Grant
Method for marking functional integrated circuit chips with underfi...
- Patent number 5,918,363
- Issue date Jul 6, 1999
- Motorola, Inc.
- Reed Allen George
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating flex circuits and product thereby
- Patent number 5,800,723
- Issue date Sep 1, 1998
- Motorola, Inc.
- Frank J. Juskey
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for plating a substrate to eliminate the use of a solder mask
- Patent number 5,716,760
- Issue date Feb 10, 1998
- Motorola, Inc.
- Frank Juskey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing high density multi-layer integrated circuit ca...
- Patent number 5,679,498
- Issue date Oct 21, 1997
- Motorola, Inc.
- Jonathon G. Greenwood
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method and structure for attaching a circuit module to a circuit board
- Patent number 5,598,967
- Issue date Feb 4, 1997
- Motorola, Inc.
- Jonathon G. Greenwood
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of selectively releasing plastic molding material from a sur...
- Patent number 5,542,171
- Issue date Aug 6, 1996
- Motorola, Inc.
- Frank J. Juskey
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Leadless integrated circuit package
- Patent number 5,535,101
- Issue date Jul 9, 1996
- Motorola, Inc.
- Barry M. Miles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive adhesive
- Patent number 5,463,190
- Issue date Oct 31, 1995
- Motorola, Inc.
- Robert T. Carson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond pad arrangement having improved pad density
- Patent number 5,444,303
- Issue date Aug 22, 1995
- Motorola, Inc.
- Jonathon Greenwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light erasable multichip module
- Patent number 5,438,216
- Issue date Aug 1, 1995
- Motorola, Inc.
- Frank J. Juskey
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated circuit package having a face-to-face IC chip arrangement
- Patent number 5,438,224
- Issue date Aug 1, 1995
- Motorola, Inc.
- Marc V. Papageorge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally conductive integrated circuit package with radio frequenc...
- Patent number 5,371,404
- Issue date Dec 6, 1994
- Motorola, Inc.
- Frank J. Juskey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anchoring method for flow formed integrated circuit covers
- Patent number 5,336,931
- Issue date Aug 9, 1994
- Motorola, Inc.
- Frank J. Juskey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for use in forming pre-positioned solder bumps...
- Patent number 5,323,947
- Issue date Jun 28, 1994
- Motorola, Inc.
- Frank Juskey
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Encapsulated electronic package
- Patent number 5,313,365
- Issue date May 17, 1994
- Motorola, Inc.
- Robert W. Pennisi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Subliming solder flux composition
- Patent number 5,296,046
- Issue date Mar 22, 1994
- Motorola, Inc.
- Frank J. Juskey
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Moisture relief for chip carrier
- Patent number 5,296,738
- Issue date Mar 22, 1994
- Motorola, Inc.
- Bruce J. Freyman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a three-dimensional printed circuit assembly
- Patent number 5,264,061
- Issue date Nov 23, 1993
- Motorola, Inc.
- Frank J. Juskey
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Non-hardening solvent removable hydrophobic conformal coatings
- Patent number 5,232,758
- Issue date Aug 3, 1993
- Motorola, Inc.
- Frank J. Juskey
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
Printed circuit board with integral heat sink for semiconductor pac...
- Publication number 20020043402
- Publication date Apr 18, 2002
- Frank J. Juskey
- H01 - BASIC ELECTRIC ELEMENTS

Frank J. Juskey

Person

Patents Grantslast 30 patents

Laser defined pads for flip chip on leadframe package fabrication m...

Laser defined pads for flip chip on leadframe package

Flip chip integrated circuit and passive chip component package fab...

Method for molding semiconductor package having a ceramic substrate

Printed circuit board with integral heat sink for semiconductor pac...

Method and apparatus for attaching multiple metal components to int...

Electronic package having flip chip integrated circuit and passive...

Making semiconductor packages with stacked dies and reinforced wire...

Low-cost printed circuit board with integral heat sink for semicond...

Electronic assembly

Selective call receiver having a display module with integrated cir...

Method for marking functional integrated circuit chips with underfi...

Process for fabricating flex circuits and product thereby

Method for plating a substrate to eliminate the use of a solder mask

Method for producing high density multi-layer integrated circuit ca...

Method and structure for attaching a circuit module to a circuit board

Method of selectively releasing plastic molding material from a sur...

Leadless integrated circuit package

Electrically conductive adhesive

Wire bond pad arrangement having improved pad density

Light erasable multichip module

Integrated circuit package having a face-to-face IC chip arrangement

Thermally conductive integrated circuit package with radio frequenc...

Anchoring method for flow formed integrated circuit covers

Method and apparatus for use in forming pre-positioned solder bumps...

Encapsulated electronic package

Subliming solder flux composition

Moisture relief for chip carrier

Method of forming a three-dimensional printed circuit assembly

Non-hardening solvent removable hydrophobic conformal coatings

Patents Applicationslast 30 patents

Printed circuit board with integral heat sink for semiconductor pac...