Frank Kuo

Person

Kaoshiung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating stack die package
- Patent number 10,546,840
- Issue date Jan 28, 2020
- Vishay SIliconix, LLC
- Kyle Terrill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual lead frame semiconductor package and method of manufacture
- Patent number 10,229,893
- Issue date Mar 12, 2019
- Vishay-Siliconix
- Frank Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack die package
- Patent number 9,966,330
- Issue date May 8, 2018
- Vishay Siliconix
- Kyle Terrill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual lead frame semiconductor package and method of manufacture
- Patent number 9,595,503
- Issue date Mar 14, 2017
- Vishay Siliconix
- Frank Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating stack die package
- Patent number 9,589,929
- Issue date Mar 7, 2017
- Vishay Siliconix
- Kyle Terrill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual lead frame semiconductor package and method of manufacture
- Patent number 9,184,152
- Issue date Nov 10, 2015
- Vishay Siliconix
- Frank Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Complete power management system implemented in a single surface mo...
- Patent number 9,093,359
- Issue date Jul 28, 2015
- Vishay Siliconix
- King Owyang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Complete power management system implemented in a single surface mo...
- Patent number 8,928,138
- Issue date Jan 6, 2015
- Vishay Siliconix
- King Owyang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Encapsulation techniques for leadless semiconductor packages
- Patent number 8,928,157
- Issue date Jan 6, 2015
- Vishay Siliconix
- Frank Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual lead frame semiconductor package and method of manufacture
- Patent number 8,822,273
- Issue date Sep 2, 2014
- Vishay Siliconix
- Frank Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including die and L-shaped lead and method o...
- Patent number 8,586,419
- Issue date Nov 19, 2013
- Vishay Siliconix
- Serge Jaunay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Complete power management system implemented in a single surface mo...
- Patent number 8,471,381
- Issue date Jun 25, 2013
- Vishay Siliconix
- King Owyang
- G05 - CONTROLLING REGULATING
Information Patent Grant
Encapsulation method for leadless semiconductor packages
- Patent number 7,501,086
- Issue date Mar 10, 2009
- Vishay-Siliconix
- Frank Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including die interposed between cup-shaped l...
- Patent number 7,394,150
- Issue date Jul 1, 2008
- Siliconix Incorporated
- Mohammed Kasem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor package including die interpose...
- Patent number 7,238,551
- Issue date Jul 3, 2007
- Siliconix Incorporated
- Mohammed Kasem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulation method and leadframe for leadless semiconductor packages
- Patent number 6,856,006
- Issue date Feb 15, 2005
- Siliconix Taiwan LTD
- Frank Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe having slots in a die pad
- Patent number 6,744,119
- Issue date Jun 1, 2004
- Siliconix (Taiwan) Ltd.
- Frank Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor package and method for making the same
- Patent number 6,465,276
- Issue date Oct 15, 2002
- Siliconx (Taiwan) Ltd.
- Frank Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device
- Patent number 6,414,362
- Issue date Jul 2, 2002
- Siliconx (Taiwan) Ltd.
- Frank Kuo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Dual Lead Frame Semiconductor Package and Method of Manufacture
- Publication number 20170271304
- Publication date Sep 21, 2017
- Frank Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING STACK DIE PACKAGE
- Publication number 20170162403
- Publication date Jun 8, 2017
- VISHAY-SILICONIX
- Kyle TERRILL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLETE POWER MANAGEMENT SYSTEM IMPLEMENTED IN A SINGLE SURFACE MO...
- Publication number 20150331438
- Publication date Nov 19, 2015
- VISHAY-SILICONIX
- King Owyang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Dual Lead Frame Semiconductor Package and Method of Manufacture
- Publication number 20140370661
- Publication date Dec 18, 2014
- SILICONIX ELECTRONIC CO., LTD.
- Frank Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual Lead Frame Semiconductor Package and Method of Manufacture
- Publication number 20140332939
- Publication date Nov 13, 2014
- SILICONIX ELECTRONIC CO., LTD.
- Frank Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING STACK DIE PACKAGE
- Publication number 20140273344
- Publication date Sep 18, 2014
- VISHAY-SILICONIX
- Kyle TERRILL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK DIE PACKAGE
- Publication number 20140264804
- Publication date Sep 18, 2014
- VISHAY-SILICONIX
- Kyle TERRILL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual Lead Frame Semiconductor Package and Method of Manufacture
- Publication number 20120112331
- Publication date May 10, 2012
- SILICONIX ELECTRONIC CO., LTD.
- Frank Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages Including Die and L-Shaped Lead and Method o...
- Publication number 20110175217
- Publication date Jul 21, 2011
- VISHAY-SILICONIX
- Serge Jaunay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLETE POWER MANAGEMENT SYSTEM IMPLEMENTED IN A SINGLE SURFACE MO...
- Publication number 20100219519
- Publication date Sep 2, 2010
- King Owyang
- G05 - CONTROLLING REGULATING
Information Patent Application
Leadless Semiconductor Packages
- Publication number 20090174055
- Publication date Jul 9, 2009
- VISHAY-SILICONIX
- Frank Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Complete power management system implemented in a single surface mo...
- Publication number 20070063341
- Publication date Mar 22, 2007
- King Owyang
- G05 - CONTROLLING REGULATING
Information Patent Application
Complete power management system implemented in a single surface mo...
- Publication number 20070063340
- Publication date Mar 22, 2007
- King Owyang
- G05 - CONTROLLING REGULATING
Information Patent Application
Semiconductor package including die interposed between cup-shaped l...
- Publication number 20060108671
- Publication date May 25, 2006
- Siliconix Incorporated
- Mohammed Kasem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of fabricating semiconductor package including die interpose...
- Publication number 20060110856
- Publication date May 25, 2006
- Mohammed Kasem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Encapsulation method and leadframe for leadless semiconductor packages
- Publication number 20040169316
- Publication date Sep 2, 2004
- Siliconix Taiwan Ltd.
- Frank Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Encapsulation method and leadframe for leadless semiconductor packages
- Publication number 20030183910
- Publication date Oct 2, 2003
- Siliconix Taiwan Ltd.
- Frank Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe having slots in a die pad
- Publication number 20020056894
- Publication date May 16, 2002
- Frank Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power semiconductor device
- Publication number 20010052641
- Publication date Dec 20, 2001
- Frank Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power semiconductor package and method for making the same
- Publication number 20010044167
- Publication date Nov 22, 2001
- Frank Kuo
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Method for fabricating stack die package

Dual lead frame semiconductor package and method of manufacture

Stack die package

Dual lead frame semiconductor package and method of manufacture

Method for fabricating stack die package

Dual lead frame semiconductor package and method of manufacture

Complete power management system implemented in a single surface mo...

Complete power management system implemented in a single surface mo...

Encapsulation techniques for leadless semiconductor packages

Dual lead frame semiconductor package and method of manufacture

Semiconductor packages including die and L-shaped lead and method o...

Complete power management system implemented in a single surface mo...

Encapsulation method for leadless semiconductor packages

Semiconductor package including die interposed between cup-shaped l...

Method of fabricating semiconductor package including die interpose...

Encapsulation method and leadframe for leadless semiconductor packages

Leadframe having slots in a die pad

Power semiconductor package and method for making the same

Power semiconductor device

Patents Applicationslast 30 patents

Dual Lead Frame Semiconductor Package and Method of Manufacture

METHOD FOR FABRICATING STACK DIE PACKAGE

COMPLETE POWER MANAGEMENT SYSTEM IMPLEMENTED IN A SINGLE SURFACE MO...

Dual Lead Frame Semiconductor Package and Method of Manufacture

Dual Lead Frame Semiconductor Package and Method of Manufacture

METHOD FOR FABRICATING STACK DIE PACKAGE

STACK DIE PACKAGE

Dual Lead Frame Semiconductor Package and Method of Manufacture

Semiconductor Packages Including Die and L-Shaped Lead and Method o...

COMPLETE POWER MANAGEMENT SYSTEM IMPLEMENTED IN A SINGLE SURFACE MO...

Leadless Semiconductor Packages

Complete power management system implemented in a single surface mo...

Complete power management system implemented in a single surface mo...

Semiconductor package including die interposed between cup-shaped l...

Method of fabricating semiconductor package including die interpose...

Encapsulation method and leadframe for leadless semiconductor packages

Encapsulation method and leadframe for leadless semiconductor packages

Leadframe having slots in a die pad

Power semiconductor device

Power semiconductor package and method for making the same