Frank L. Hall

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Underfilled semiconductor die assemblies and methods of forming the...
- Patent number 8,093,730
- Issue date Jan 10, 2012
- Micron Technology, Inc.
- Frank L. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming molded standoff structures on integrated circuit...
- Patent number 7,993,977
- Issue date Aug 9, 2011
- Micron Technology, Inc.
- Frank Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit package having electrically discon...
- Patent number 7,851,907
- Issue date Dec 14, 2010
- Micron Technology, Inc.
- Frank L. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for molding a semiconductor die package with enhanced the...
- Patent number 7,642,643
- Issue date Jan 5, 2010
- Micron Technology, Inc.
- Frank L. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic imaging units and methods of manufacturing microele...
- Patent number 7,498,606
- Issue date Mar 3, 2009
- Micron Technology, Inc.
- Bret K. Street
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package
- Patent number 7,485,971
- Issue date Feb 3, 2009
- Micron Technology, Inc.
- Jason L. Fuller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit package having electrically discon...
- Patent number 7,468,559
- Issue date Dec 23, 2008
- Micron Technology, Inc.
- Frank L. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing microelectronic imaging units with discret...
- Patent number 7,416,913
- Issue date Aug 26, 2008
- Micron Technology, Inc.
- Frank L. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic imaging units and methods of manufacturing microele...
- Patent number 7,417,294
- Issue date Aug 26, 2008
- Micron Technology, Inc.
- Frank L. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic imaging units and methods of manufacturing microele...
- Patent number 7,364,934
- Issue date Apr 29, 2008
- Micron Technology, Inc.
- Bret K. Street
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit package having electrically discon...
- Patent number 7,342,319
- Issue date Mar 11, 2008
- Micron Technology, Inc.
- Frank L. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit package having electrically discon...
- Patent number 7,276,802
- Issue date Oct 2, 2007
- Micron Technology, Inc.
- Frank L. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit package having electrically discon...
- Patent number 7,268,067
- Issue date Sep 11, 2007
- Micron Technology, Inc.
- Frank L. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating underfilled, encapsulated semiconductor die...
- Patent number 7,262,074
- Issue date Aug 28, 2007
- Micron Technology, Inc.
- Frank L. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfilled, encapsulated semiconductor die assemblies and methods...
- Patent number 7,116,000
- Issue date Oct 3, 2006
- Micron Technology, Inc.
- Frank L. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package
- Patent number 7,084,515
- Issue date Aug 1, 2006
- Micron, Technology Inc.
- Jason L. Fuller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for underfilling and encapsulating semiconductor device ass...
- Patent number 6,987,058
- Issue date Jan 17, 2006
- Micron Technology, Inc.
- Frank L. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package
- Patent number 6,969,914
- Issue date Nov 29, 2005
- Micron Technology, Inc.
- Jason L. Fuller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for molding a semiconductor die package with enhanced therm...
- Patent number 6,835,592
- Issue date Dec 28, 2004
- Micron Technology, Inc.
- Frank L. Hall
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING MOLDED STANDOFF STRUCTURES ON INTEGRATED CIRCUIT...
- Publication number 20090011544
- Publication date Jan 8, 2009
- Frank Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGE HAVING ELECTRICALLY DISCON...
- Publication number 20080142950
- Publication date Jun 19, 2008
- Micron Technology, Inc.
- Frank L. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic imaging units and methods of manufacturing microele...
- Publication number 20070117249
- Publication date May 24, 2007
- Frank L. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Underfilled semiconductor die assemblies and methods of forming the...
- Publication number 20070040264
- Publication date Feb 22, 2007
- Frank L. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for preparing ball grid array substrates via use of a laser
- Publication number 20060249492
- Publication date Nov 9, 2006
- Frank L. Hall
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods for preparing ball grid array substrates via use of a laser
- Publication number 20060249495
- Publication date Nov 9, 2006
- Frank L. Hall
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods for preparing ball grid array substrates via use of a laser
- Publication number 20060249493
- Publication date Nov 9, 2006
- Frank L. Hall
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods for preparing ball grid array substrates via use of a laser
- Publication number 20060249494
- Publication date Nov 9, 2006
- Frank L. Hall
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGE HAVING ELECTRICALLY DISCON...
- Publication number 20060237845
- Publication date Oct 26, 2006
- Micron Technology, Inc.
- Frank L. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGE HAVING ELECTRICALLY DISCON...
- Publication number 20060237844
- Publication date Oct 26, 2006
- Micron Technology, Inc.
- Frank L. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic imaging units and methods of manufacturing microele...
- Publication number 20060216850
- Publication date Sep 28, 2006
- Bret K. Street
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for preparing ball grid array substrates via use of a laser
- Publication number 20060163573
- Publication date Jul 27, 2006
- Frank L. Hall
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for preparing ball grid array substrates via use of a laser
- Publication number 20060113291
- Publication date Jun 1, 2006
- Frank L. Hall
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Microelectronic imaging units and methods of manufacturing microele...
- Publication number 20060035402
- Publication date Feb 16, 2006
- Bret K. Street
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic imaging units and methods of manufacturing microele...
- Publication number 20060014313
- Publication date Jan 19, 2006
- Frank L. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device package
- Publication number 20060006553
- Publication date Jan 12, 2006
- Micron Technology, Inc.
- Jason L. Fuller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device package
- Publication number 20050287706
- Publication date Dec 29, 2005
- Micron Technology, Inc.
- Jason L. Fuller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus for molding a semiconductor die package with enhanced the...
- Publication number 20050280143
- Publication date Dec 22, 2005
- Frank L. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic system including a semiconductor device with at least on...
- Publication number 20050263906
- Publication date Dec 1, 2005
- Frank L. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device assemblies including an encapsulant located ov...
- Publication number 20050253241
- Publication date Nov 17, 2005
- Frank L. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for preparing ball grid array substrates via use of a laser
- Publication number 20050170658
- Publication date Aug 4, 2005
- Frank L. Hall
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic device package
- Publication number 20050023572
- Publication date Feb 3, 2005
- Micron Technology, Inc.
- Jason L. Fuller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor integrated circuit package having electrically discon...
- Publication number 20050026327
- Publication date Feb 3, 2005
- Micron Technology, Inc.
- Frank L. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for molding a semiconductor die package with e...
- Publication number 20040217389
- Publication date Nov 4, 2004
- Frank L. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bare die semiconductor dice underfilled and encapsulated with a sin...
- Publication number 20040184226
- Publication date Sep 23, 2004
- Frank L. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for preparing ball grid array substrates via use of a laser
- Publication number 20040170915
- Publication date Sep 2, 2004
- Frank L. Hall
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods for preparing ball grid array substrates via use of a laser
- Publication number 20040169024
- Publication date Sep 2, 2004
- Frank L. Hall
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Underfilled, encapsulated semiconductor die assemblies and methods...
- Publication number 20040164413
- Publication date Aug 26, 2004
- Frank L. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for preparing ball grid array substrates via use of a laser
- Publication number 20040104206
- Publication date Jun 3, 2004
- Frank L. Hall
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic device package
- Publication number 20040041279
- Publication date Mar 4, 2004
- Jason L. Fuller
- H01 - BASIC ELECTRIC ELEMENTS

Frank L. Hall

Person

Patents Grantslast 30 patents

Underfilled semiconductor die assemblies and methods of forming the...

Method of forming molded standoff structures on integrated circuit...

Semiconductor integrated circuit package having electrically discon...

Apparatus for molding a semiconductor die package with enhanced the...

Microelectronic imaging units and methods of manufacturing microele...

Electronic device package

Semiconductor integrated circuit package having electrically discon...

Methods of manufacturing microelectronic imaging units with discret...

Microelectronic imaging units and methods of manufacturing microele...

Microelectronic imaging units and methods of manufacturing microele...

Semiconductor integrated circuit package having electrically discon...

Semiconductor integrated circuit package having electrically discon...

Semiconductor integrated circuit package having electrically discon...

Methods of fabricating underfilled, encapsulated semiconductor die...

Underfilled, encapsulated semiconductor die assemblies and methods...

Electronic device package

Methods for underfilling and encapsulating semiconductor device ass...

Electronic device package

Methods for molding a semiconductor die package with enhanced therm...

Patents Applicationslast 30 patents

METHOD OF FORMING MOLDED STANDOFF STRUCTURES ON INTEGRATED CIRCUIT...

SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGE HAVING ELECTRICALLY DISCON...

Microelectronic imaging units and methods of manufacturing microele...

Underfilled semiconductor die assemblies and methods of forming the...

Methods for preparing ball grid array substrates via use of a laser

Methods for preparing ball grid array substrates via use of a laser

Methods for preparing ball grid array substrates via use of a laser

Methods for preparing ball grid array substrates via use of a laser

SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGE HAVING ELECTRICALLY DISCON...

SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGE HAVING ELECTRICALLY DISCON...

Microelectronic imaging units and methods of manufacturing microele...

Method for preparing ball grid array substrates via use of a laser

Method for preparing ball grid array substrates via use of a laser

Microelectronic imaging units and methods of manufacturing microele...

Microelectronic imaging units and methods of manufacturing microele...

Electronic device package

Electronic device package

Apparatus for molding a semiconductor die package with enhanced the...

Electronic system including a semiconductor device with at least on...

Semiconductor device assemblies including an encapsulant located ov...

Methods for preparing ball grid array substrates via use of a laser

Electronic device package

Semiconductor integrated circuit package having electrically discon...

Apparatus and method for molding a semiconductor die package with e...

Bare die semiconductor dice underfilled and encapsulated with a sin...

Methods for preparing ball grid array substrates via use of a laser

Methods for preparing ball grid array substrates via use of a laser

Underfilled, encapsulated semiconductor die assemblies and methods...

Methods for preparing ball grid array substrates via use of a laser

Electronic device package