Frank L. Pompeo

Person

Redding, CT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Coolant-cooled heat sink(s) with associated ultra-violet light asse...
- Patent number 12,005,148
- Issue date Jun 11, 2024
- International Business Machines Corporation
- Hongqing Zhang
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
High power device fault localization via die surface contouring
- Patent number 11,940,271
- Issue date Mar 26, 2024
- International Business Machines Corporation
- David J. Lewison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fixture facilitating heat sink fabrication
- Patent number 11,404,287
- Issue date Aug 2, 2022
- International Business Machines Corporation
- Phillip D. Isaacs
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Coolant-cooled heat sinks with internal thermally-conductive fins j...
- Patent number 11,156,409
- Issue date Oct 26, 2021
- International Business Machines Corporation
- Hongqing Zhang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Fixture facilitating heat sink fabrication
- Patent number 10,978,313
- Issue date Apr 13, 2021
- International Business Machines Corporation
- Phillip D. Isaacs
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Fabricating coolant-cooled heat sinks with internal thermally-condu...
- Patent number 10,842,043
- Issue date Nov 17, 2020
- International Business Machines Corporation
- Hongqing Zhang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Method and apparatus for strain relieving surface mount attached co...
- Patent number 10,750,615
- Issue date Aug 18, 2020
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for strain relieving surface mount attached co...
- Patent number 10,368,441
- Issue date Jul 30, 2019
- International Business Machines Corporation
- Michael A. Gaynes
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for strain relieving surface mount attached co...
- Patent number 9,974,179
- Issue date May 15, 2018
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for strain relieving surface mount attached co...
- Patent number 9,627,784
- Issue date Apr 18, 2017
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reworkable underfills for ceramic MCM C4 protection
- Patent number 8,492,199
- Issue date Jul 23, 2013
- International Business Machines Corporation
- Jeffrey T. Coffin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder interconnection array with optimal mechanical integrity
- Patent number 7,900,809
- Issue date Mar 8, 2011
- International Business Machines Corporation
- Glenn G. Daves
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for removing interconnects to separate two parts of a wor...
- Patent number 7,882,623
- Issue date Feb 8, 2011
- International Business Machines Corporation
- Mukta G. Farooq
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure for implementing secure multichip modules for encryption...
- Patent number 7,806,341
- Issue date Oct 5, 2010
- International Business Machines Corporation
- Mukta G. Farooq
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for providing optoelectronic communication wit...
- Patent number 7,544,527
- Issue date Jun 9, 2009
- International Business Machines Corporation
- Alan F. Benner
- G02 - OPTICS
Information Patent Grant
Method and structure for implementing secure multichip modules for...
- Patent number 7,472,836
- Issue date Jan 6, 2009
- International Business Machines Corporation
- Mukta G. Farooq
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Ball grid array rework using a continuous belt furnace
- Patent number 7,452,215
- Issue date Nov 18, 2008
- International Business Machines Corporation
- Mukta G. Farooq
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder interconnection array with optimal mechanical integrity
- Patent number 7,445,141
- Issue date Nov 4, 2008
- International Business Machines Corporation
- Glenn G. Daves
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ball grid array rework using a continuous belt furnace
- Patent number 7,299,530
- Issue date Nov 27, 2007
- International Business Machines Corporation
- Mukta G. Farooq
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and structure for implementing secure multichip modules for...
- Patent number 7,281,667
- Issue date Oct 16, 2007
- International Business Machines Corporation
- Mukta G. Farooq
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor module with improved interposer structure and method...
- Patent number 7,245,022
- Issue date Jul 17, 2007
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for providing optoelectronic communication wit...
- Patent number 7,128,472
- Issue date Oct 31, 2006
- International Business Machines Corporation
- Alan F. Benner
- G02 - OPTICS
Information Patent Grant
Method and apparatus for providing optoelectronic communication wit...
- Patent number 7,084,496
- Issue date Aug 1, 2006
- International Business Machines Corporation
- Alan F. Benner
- G02 - OPTICS
Information Patent Grant
Fluidic cooling systems and methods for electronic components
- Patent number 7,079,393
- Issue date Jul 18, 2006
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress resistant land grid array (LGA) module and method of forming...
- Patent number 6,964,885
- Issue date Nov 15, 2005
- International Business Machines Corporation
- Patrick Anthony Coico
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stress resistant land grid array (LGA) module and method of forming...
- Patent number 6,703,560
- Issue date Mar 9, 2004
- International Business Machines Corporation
- Patrick Anthony Coico
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Temporary attach article and method for temporary attach of devices...
- Patent number 6,518,674
- Issue date Feb 11, 2003
- International Business Machines Corporation
- Mario J. Interrante
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal paste preforms as a heat transfer media between a chip and...
- Patent number 6,444,496
- Issue date Sep 3, 2002
- International Business Machines Corporation
- David L. Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for direct attachment of a chip to a cooling member
- Patent number 6,413,353
- Issue date Jul 2, 2002
- International Business Machines Corporation
- Frank Louis Pompeo
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Temporary attach article and method for temporary attach of devices...
- Patent number 6,303,400
- Issue date Oct 16, 2001
- International Business Machines Corporation
- Mario J. Interrante
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COOLANT-COOLED HEAT SINK(S) WITH ASSOCIATED ULTRA-VIOLET LIGHT ASSE...
- Publication number 20220347327
- Publication date Nov 3, 2022
- International Business Machines Corporation
- Hongqing ZHANG
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
HIGH POWER DEVICE FAULT LOCALIZATION VIA DIE SURFACE CONTOURING
- Publication number 20220155049
- Publication date May 19, 2022
- International Business Machines Corporation
- David J. Lewison
- G01 - MEASURING TESTING
Information Patent Application
COOLANT-COOLED HEAT SINKS WITH INTERNAL THERMALLY-CONDUCTIVE FINS J...
- Publication number 20210222956
- Publication date Jul 22, 2021
- International Business Machines Corporation
- Hongqing ZHANG
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
FIXTURE FACILITATING HEAT SINK FABRICATION
- Publication number 20210111037
- Publication date Apr 15, 2021
- International Business Machines Corporation
- Phillip D. ISAACS
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
METHOD AND APPARATUS FOR STRAIN RELIEVING SURFACE MOUNT ATTACHED CO...
- Publication number 20190281702
- Publication date Sep 12, 2019
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIXTURE FACILITATING HEAT SINK FABRICATION
- Publication number 20190259632
- Publication date Aug 22, 2019
- International Business Machines Corporation
- Phillip D. ISAACS
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
METHOD AND APPARATUS FOR STRAIN RELIEVING SURFACE MOUNT ATTACHED CO...
- Publication number 20180213645
- Publication date Jul 26, 2018
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR STRAIN RELIEVING SURFACE MOUNT ATTACHED CO...
- Publication number 20170196089
- Publication date Jul 6, 2017
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL REWORKABLE UNDERFILLS FOR CERAMIC MCM C4 PROTECTION
- Publication number 20120021567
- Publication date Jan 26, 2012
- International Business Machines Corporation
- Jeffrey T. Coffin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR IMPLEMENTING SECURE MULTICHIP MODULES FOR ENCRYPTION...
- Publication number 20090145973
- Publication date Jun 11, 2009
- International Business Machines Corporation
- Mukta G. Farooq
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BALL GRID ARRAY REWORK USING A CONTINUOUS BELT FURNACE
- Publication number 20080271312
- Publication date Nov 6, 2008
- International Business Machines Corporation
- Mukta G. Farooq
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER INTERCONNECTION ARRAY WITH OPTIMAL MECHANICAL INTEGRITY
- Publication number 20080261350
- Publication date Oct 23, 2008
- International Business Machines Corporation
- Glenn G. Daves
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
NON-HERMETIC ENCAPSULANT REMOVAL FOR MODULE REWORK
- Publication number 20080076690
- Publication date Mar 27, 2008
- International Business Machines Corporation
- Patrick A. Coico
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD AND STRUCTURE FOR IMPLEMENTING SECURE MULTICHIP MODULES FOR...
- Publication number 20080000988
- Publication date Jan 3, 2008
- International Business Machines Corporation
- Mukta G. Farooq
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
NOVEL REWORKABLE UNDERFILLS FOR CERAMIC MCM C4 PROTECTION
- Publication number 20070290378
- Publication date Dec 20, 2007
- International Business Machines Corporation
- Jeffrey T. Coffin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL GRID ARRAY REWORK USING A CONTINUOUS BELT FURNACE
- Publication number 20070271775
- Publication date Nov 29, 2007
- Mukta G. Farooq
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR FORMING THE SAME
- Publication number 20070252288
- Publication date Nov 1, 2007
- MUKTA G. FAROOQ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR IMPLEMENTING SECURE MULTICHIP MODULES FOR...
- Publication number 20060231633
- Publication date Oct 19, 2006
- International Business Machines Corporation
- Mukta G. Farooq
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD AND APPARATUS FOR PROVIDING OPTOELECTRONIC COMMUNICATION WIT...
- Publication number 20060182397
- Publication date Aug 17, 2006
- International Business Machines Corporation
- Alan F. Benner
- G02 - OPTICS
Information Patent Application
FLUIDIC COOLING SYSTEMS AND METHODS FOR ELECTRONIC COMPONENTS
- Publication number 20060104031
- Publication date May 18, 2006
- International Business Machines Corporation
- Evan George Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER INTERCONNECTION ARRAY WITH OPTIMAL MECHANICAL INTEGRITY
- Publication number 20060060636
- Publication date Mar 23, 2006
- International Business Machines Corporation
- Glenn G. Daves
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for providing optoelectronic communication wit...
- Publication number 20050156310
- Publication date Jul 21, 2005
- International Business Machines Corporation
- Alan F. Benner
- G02 - OPTICS
Information Patent Application
Semiconductor module and method for forming the same
- Publication number 20050110160
- Publication date May 26, 2005
- International Business Machines Corporation
- Mukta G. Faroog
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball grid array rework using a continuous belt furnace
- Publication number 20050071993
- Publication date Apr 7, 2005
- Mukta G. Farooq
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NON-HERMETIC ENCAPSULANT REMOVAL FOR MODULE REWORK
- Publication number 20050066995
- Publication date Mar 31, 2005
- International Business Machines Corporation
- Patrick A. Coico
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Method and apparatus for providing optoelectronic communication wit...
- Publication number 20050025434
- Publication date Feb 3, 2005
- International Business Machines Corporation
- Alan F. Benner
- G02 - OPTICS
Information Patent Application
Stress resistant land grid array (LGA) module and method of forming...
- Publication number 20040141296
- Publication date Jul 22, 2004
- Patrick Anthony Coico
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stress resistant land grid array (LGA) module and method of forming...
- Publication number 20020050398
- Publication date May 2, 2002
- Patrick Anthony Coico
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DIRECT ATTACHMENT OF A CHIP TO A COOLING MEMBER
- Publication number 20010040006
- Publication date Nov 15, 2001
- FRANK LOUIS POMPEO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Temporary attach article and method for temporary attach of devices...
- Publication number 20010008778
- Publication date Jul 19, 2001
- International Business Machines Corporation
- Mario J. Interrante
- H01 - BASIC ELECTRIC ELEMENTS

Frank L. Pompeo

Person

Patents Grantslast 30 patents

Coolant-cooled heat sink(s) with associated ultra-violet light asse...

High power device fault localization via die surface contouring

Fixture facilitating heat sink fabrication

Coolant-cooled heat sinks with internal thermally-conductive fins j...

Fixture facilitating heat sink fabrication

Fabricating coolant-cooled heat sinks with internal thermally-condu...

Method and apparatus for strain relieving surface mount attached co...

Method and apparatus for strain relieving surface mount attached co...

Method and apparatus for strain relieving surface mount attached co...

Method and apparatus for strain relieving surface mount attached co...

Reworkable underfills for ceramic MCM C4 protection

Solder interconnection array with optimal mechanical integrity

Apparatus for removing interconnects to separate two parts of a wor...

Structure for implementing secure multichip modules for encryption...

Method and apparatus for providing optoelectronic communication wit...

Method and structure for implementing secure multichip modules for...

Ball grid array rework using a continuous belt furnace

Solder interconnection array with optimal mechanical integrity

Ball grid array rework using a continuous belt furnace

Method and structure for implementing secure multichip modules for...

Semiconductor module with improved interposer structure and method...

Method and apparatus for providing optoelectronic communication wit...

Method and apparatus for providing optoelectronic communication wit...

Fluidic cooling systems and methods for electronic components

Stress resistant land grid array (LGA) module and method of forming...

Stress resistant land grid array (LGA) module and method of forming...

Temporary attach article and method for temporary attach of devices...

Thermal paste preforms as a heat transfer media between a chip and...

Method for direct attachment of a chip to a cooling member

Temporary attach article and method for temporary attach of devices...

Patents Applicationslast 30 patents

COOLANT-COOLED HEAT SINK(S) WITH ASSOCIATED ULTRA-VIOLET LIGHT ASSE...

HIGH POWER DEVICE FAULT LOCALIZATION VIA DIE SURFACE CONTOURING

COOLANT-COOLED HEAT SINKS WITH INTERNAL THERMALLY-CONDUCTIVE FINS J...

FIXTURE FACILITATING HEAT SINK FABRICATION

METHOD AND APPARATUS FOR STRAIN RELIEVING SURFACE MOUNT ATTACHED CO...

FIXTURE FACILITATING HEAT SINK FABRICATION

METHOD AND APPARATUS FOR STRAIN RELIEVING SURFACE MOUNT ATTACHED CO...

METHOD AND APPARATUS FOR STRAIN RELIEVING SURFACE MOUNT ATTACHED CO...

NOVEL REWORKABLE UNDERFILLS FOR CERAMIC MCM C4 PROTECTION

STRUCTURE FOR IMPLEMENTING SECURE MULTICHIP MODULES FOR ENCRYPTION...

BALL GRID ARRAY REWORK USING A CONTINUOUS BELT FURNACE

SOLDER INTERCONNECTION ARRAY WITH OPTIMAL MECHANICAL INTEGRITY

NON-HERMETIC ENCAPSULANT REMOVAL FOR MODULE REWORK

METHOD AND STRUCTURE FOR IMPLEMENTING SECURE MULTICHIP MODULES FOR...

NOVEL REWORKABLE UNDERFILLS FOR CERAMIC MCM C4 PROTECTION

BALL GRID ARRAY REWORK USING A CONTINUOUS BELT FURNACE

SEMICONDUCTOR MODULE AND METHOD FOR FORMING THE SAME

METHOD AND STRUCTURE FOR IMPLEMENTING SECURE MULTICHIP MODULES FOR...

METHOD AND APPARATUS FOR PROVIDING OPTOELECTRONIC COMMUNICATION WIT...

FLUIDIC COOLING SYSTEMS AND METHODS FOR ELECTRONIC COMPONENTS

SOLDER INTERCONNECTION ARRAY WITH OPTIMAL MECHANICAL INTEGRITY

Method and apparatus for providing optoelectronic communication wit...

Semiconductor module and method for forming the same

Ball grid array rework using a continuous belt furnace

NON-HERMETIC ENCAPSULANT REMOVAL FOR MODULE REWORK

Method and apparatus for providing optoelectronic communication wit...

Stress resistant land grid array (LGA) module and method of forming...

Stress resistant land grid array (LGA) module and method of forming...

METHOD FOR DIRECT ATTACHMENT OF A CHIP TO A COOLING MEMBER

Temporary attach article and method for temporary attach of devices...