Frank Osterwald

Person

Kiel, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor module with a first substrate, a second substrate and...
- Patent number 12,125,817
- Issue date Oct 22, 2024
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintering tool and method for sintering an electronic subassembly
- Patent number 11,400,514
- Issue date Aug 2, 2022
- Danfoss Silicon Power GmbH
- Frank Osterwald
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Power module
- Patent number 10,832,995
- Issue date Nov 10, 2020
- Danfoss Silicon Power GmbH
- Ronald Eisele
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintering tool and method for sintering an electronic subassembly
- Patent number 10,814,396
- Issue date Oct 27, 2020
- Danfoss Silicon Power GmbH
- Frank Osterwald
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Sintering tool for the lower die of a sintering device
- Patent number 10,818,633
- Issue date Oct 27, 2020
- Danfoss Silicon Power GmbH
- Frank Osterwald
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for manufacturing semiconductor chips
- Patent number 10,607,962
- Issue date Mar 31, 2020
- Danfoss Silicon Power GmbH
- Frank Osterwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintering device
- Patent number 10,483,229
- Issue date Nov 19, 2019
- Danfoss Silicon Power GmbH
- Frank Osterwald
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for cohesively connecting a first component of a power semic...
- Patent number 10,438,924
- Issue date Oct 8, 2019
- Danfoss Silicon Power GmbH
- Martin Becker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power module
- Patent number 10,403,566
- Issue date Sep 3, 2019
- Danfoss Silicon Power GmbH
- Ronald Eisele
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module
- Patent number 10,381,283
- Issue date Aug 13, 2019
- Danfoss Silicon Power GmbH
- Frank Osterwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic sandwich structure with two parts joined together by mea...
- Patent number 10,332,858
- Issue date Jun 25, 2019
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling trough, cooler and power module assembly
- Patent number 10,306,800
- Issue date May 28, 2019
- Danfoss Silicon Power GmbH
- Franke Wulf-Toke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor contact structure and method for the production...
- Patent number 10,079,219
- Issue date Sep 18, 2018
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for creating a connection between metallic moulded bodies an...
- Patent number 9,786,627
- Issue date Oct 10, 2017
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor chip with a metallic moulded body for contactin...
- Patent number 9,613,929
- Issue date Apr 4, 2017
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor chip with a metallic moulded body for contactin...
- Patent number 9,318,421
- Issue date Apr 19, 2016
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MODULE WITH A FIRST SUBSTRATE, A SECOND SUBSTRATE AND...
- Publication number 20220302073
- Publication date Sep 22, 2022
- DANFOSS SILICON POWER GMBH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE COMPRISING A SEMICONDUCTOR AND COMPRISING A SH...
- Publication number 20220302072
- Publication date Sep 22, 2022
- DANFOSS SILICON POWER GMBH
- André Bastos Abibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTERING TOOL AND METHOD FOR SINTERING AN ELECTRONIC SUBASSEMBLY
- Publication number 20210016353
- Publication date Jan 21, 2021
- DANFOSS SILICON POWER GMBH
- Frank Osterwald
- B22 - CASTING POWDER METALLURGY
Information Patent Application
POWER MODULE
- Publication number 20190341341
- Publication date Nov 7, 2019
- DANFOSS SILICON POWER GMBH
- Ronald EISELE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SANDWICH STRUCTURE WITH TWO PARTS JOINED TOGETHER BY MEA...
- Publication number 20180331065
- Publication date Nov 15, 2018
- DANFOSS SILICON POWER GMBH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A CIRCUIT CARRIER
- Publication number 20180301354
- Publication date Oct 18, 2018
- DANFOSS SILICON POWER GMBH
- Frank Osterwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR CHIPS
- Publication number 20180240776
- Publication date Aug 23, 2018
- DANFOSS SILICON POWER GMBH
- Frank Osterwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE
- Publication number 20180218957
- Publication date Aug 2, 2018
- DANFOSS SILICON POWER GMBH
- Frank Osterwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20170365541
- Publication date Dec 21, 2017
- DANFOSS SILICON POWER GMBH
- Ronald EISELE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE WITH SHORT-CIRCUIT FAILURE MODE
- Publication number 20170338193
- Publication date Nov 23, 2017
- DANFOSS SILICON POWER GMBH
- Josef Lutz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING TROUGH, COOLER AND POWER MODULE ASSEMBLY
- Publication number 20170332515
- Publication date Nov 16, 2017
- DANFOSS SILICON POWER GMBH
- Franke Wulf-Toke
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
POWER SEMICONDUCTOR CONTACT STRUCTURE AND METHOD FOR THE PRODUCTION...
- Publication number 20170317049
- Publication date Nov 2, 2017
- DANFOSS SILICON POWER GMBH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR COHESIVELY CONNECTING A FIRST COMPONENT OF A POWER SEMIC...
- Publication number 20170317051
- Publication date Nov 2, 2017
- DANFOSS SILICON POWER GMBH
- Martin Becker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SINTERING DEVICE
- Publication number 20170229418
- Publication date Aug 10, 2017
- DANFOSS SILICON POWER GMBH
- Frank Osterwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTERING TOOL FOR THE LOWER DIE OF A SINTERING DEVICE
- Publication number 20170221852
- Publication date Aug 3, 2017
- DANFOSS SILICON POWER GMBH
- Frank Osterwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTERING TOOL AND METHOD FOR SINTERING AN ELECTRONIC SUBASSEMBLY
- Publication number 20170216920
- Publication date Aug 3, 2017
- DANFOSS SILICON POWER GMBH
- Frank Osterwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR CHIP WITH A METALLIC MOULDED BODY FOR CONTACTIN...
- Publication number 20160225738
- Publication date Aug 4, 2016
- DANFOSS SILICON POWER GMBH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CREATING A CONNECTION BETWEEN METALLIC MOULDED BODIES AN...
- Publication number 20140230989
- Publication date Aug 21, 2014
- DANFOSS SILICON POWER GMBH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR CHIP WITH A METALLIC MOULDED BODY FOR CONTACTIN...
- Publication number 20140225247
- Publication date Aug 14, 2014
- DANFOSS SILICON POWER GMBH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLOW DISTRIBUTOR
- Publication number 20130032230
- Publication date Feb 7, 2013
- Danfoss Silicon Power GmbH
- Klaus Olesen
- H01 - BASIC ELECTRIC ELEMENTS

Frank Osterwald

Person

Patents Grantslast 30 patents

Semiconductor module with a first substrate, a second substrate and...

Sintering tool and method for sintering an electronic subassembly

Power module

Sintering tool and method for sintering an electronic subassembly

Sintering tool for the lower die of a sintering device

Method for manufacturing semiconductor chips

Sintering device

Method for cohesively connecting a first component of a power semic...

Power module

Power semiconductor module

Electronic sandwich structure with two parts joined together by mea...

Cooling trough, cooler and power module assembly

Power semiconductor contact structure and method for the production...

Method for creating a connection between metallic moulded bodies an...

Power semiconductor chip with a metallic moulded body for contactin...

Power semiconductor chip with a metallic moulded body for contactin...

Patents Applicationslast 30 patents

SEMICONDUCTOR MODULE WITH A FIRST SUBSTRATE, A SECOND SUBSTRATE AND...

SEMICONDUCTOR MODULE COMPRISING A SEMICONDUCTOR AND COMPRISING A SH...

SINTERING TOOL AND METHOD FOR SINTERING AN ELECTRONIC SUBASSEMBLY

POWER MODULE

ELECTRONIC SANDWICH STRUCTURE WITH TWO PARTS JOINED TOGETHER BY MEA...

METHOD FOR MANUFACTURING A CIRCUIT CARRIER

METHOD FOR MANUFACTURING SEMICONDUCTOR CHIPS

POWER SEMICONDUCTOR MODULE

POWER MODULE

POWER SEMICONDUCTOR MODULE WITH SHORT-CIRCUIT FAILURE MODE

COOLING TROUGH, COOLER AND POWER MODULE ASSEMBLY

POWER SEMICONDUCTOR CONTACT STRUCTURE AND METHOD FOR THE PRODUCTION...

METHOD FOR COHESIVELY CONNECTING A FIRST COMPONENT OF A POWER SEMIC...

SINTERING DEVICE

SINTERING TOOL FOR THE LOWER DIE OF A SINTERING DEVICE

SINTERING TOOL AND METHOD FOR SINTERING AN ELECTRONIC SUBASSEMBLY

POWER SEMICONDUCTOR CHIP WITH A METALLIC MOULDED BODY FOR CONTACTIN...

METHOD FOR CREATING A CONNECTION BETWEEN METALLIC MOULDED BODIES AN...

POWER SEMICONDUCTOR CHIP WITH A METALLIC MOULDED BODY FOR CONTACTIN...

FLOW DISTRIBUTOR