Frank S. Geefay

Person

Cupertino, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Bonded wafer structure and method of fabrication
- Patent number 8,102,044
- Issue date Jan 24, 2012
- Avago Technologies Wireless IP (Singapore) Pte. Ltd.
- Richard C. Ruby
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Attachment system incorporating a recess in a structure
- Patent number 7,554,177
- Issue date Jun 30, 2009
- Avago Technologies Wireless IP (Singapore) Pte. Ltd.
- Frank S. Geefay
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level packaging of optoelectronic devices
- Patent number 7,422,929
- Issue date Sep 9, 2008
- Avago Technologies Fiber IP Pte Ltd.
- Kendra J. Gallup
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for placing metal contacts underneath FBAR resonators
- Patent number 7,161,283
- Issue date Jan 9, 2007
- Avago Technologies Wireless IP (Singapore) Pte. Ltd.
- Frank S. Geefay
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Wafer-level package with silicon gasket
- Patent number 6,979,597
- Issue date Dec 27, 2005
- Agilent Technologies, Inc.
- Frank S Geefay
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level packaging of optoelectronic devices
- Patent number 6,953,990
- Issue date Oct 11, 2005
- Agilent Technologies, Inc.
- Kendra J. Gallup
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for sealing a semiconductor device and apparatus embodying t...
- Patent number 6,919,222
- Issue date Jul 19, 2005
- Agilent Technologies, Inc.
- Frank S. Geefay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sloped via contacts
- Patent number 6,903,012
- Issue date Jun 7, 2005
- Agilent Technologies, Inc.
- Frank S Geefay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for sealing a semiconductor device and apparatus embodying t...
- Patent number 6,836,013
- Issue date Dec 28, 2004
- Agilent Technologies, Inc.
- Frank S. Geefay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package with silicon gasket
- Patent number 6,787,897
- Issue date Sep 7, 2004
- Agilent Technologies, Inc.
- Frank S Geefay
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Die singulation using deep silicon etching
- Patent number 6,777,267
- Issue date Aug 17, 2004
- Agilent Technologies, Inc.
- Richard C. Ruby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film deposition to enhance sealing yield of microcap wafer-level pa...
- Patent number 6,777,263
- Issue date Aug 17, 2004
- Agilent Technologies, Inc.
- Qing Gan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and apparatus for hermeticity determination and leak detecti...
- Patent number 6,763,702
- Issue date Jul 20, 2004
- Agilent Technologies, Inc.
- Allen Chien
- G01 - MEASURING TESTING
Information Patent Grant
Process for fabricating a top side pitted diode device
- Patent number 6,555,440
- Issue date Apr 29, 2003
- Agilent Technologies, Inc.
- Frank Sigming Geefay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microcap wafer-level package
- Patent number 6,429,511
- Issue date Aug 6, 2002
- Agilent Technologies, Inc.
- Richard C. Ruby
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microcap wafer-level package
- Patent number 6,376,280
- Issue date Apr 23, 2002
- Agilent Technologies, Inc.
- Richard C. Ruby
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microcap wafer-level package
- Patent number 6,265,246
- Issue date Jul 24, 2001
- Agilent Technologies, Inc.
- Richard C. Ruby
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microcap wafer-level package with vias
- Patent number 6,228,675
- Issue date May 8, 2001
- Agilent Technologies, Inc.
- Richard C. Ruby
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
BONDED WAFER STRUCTURE AND METHOD OF FABRICATION
- Publication number 20100096745
- Publication date Apr 22, 2010
- Avago Technologies Wireless IP (Singapore) Pte. Ltd.
- Richard Ruby
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PHOTOSTRUCTURABLE GLASS MICROELECTROMECHANICAL (MEMs) DEVICES AND M...
- Publication number 20080283944
- Publication date Nov 20, 2008
- Frank S. Geefay
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Attachment system
- Publication number 20070075402
- Publication date Apr 5, 2007
- Frank S. Geefay
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Protective structures and methods of fabricating protective structu...
- Publication number 20070020807
- Publication date Jan 25, 2007
- Frank S. Geefay
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for making contact through via contact to an offset contacto...
- Publication number 20070004079
- Publication date Jan 4, 2007
- Frank S. Geefay
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHOD FOR PLACING METAL CONTACTS UNDERNEATH FBAR RESONATORS
- Publication number 20070001544
- Publication date Jan 4, 2007
- Frank S. Geefay
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Semiconductor package and fabrication method
- Publication number 20060099733
- Publication date May 11, 2006
- Frank S. Geefay
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Wafer-level packaging of optoelectronic devices
- Publication number 20050142692
- Publication date Jun 30, 2005
- Kendra J. Gallup
- G02 - OPTICS
Information Patent Application
Wafer-level packaging of optoelectronic devices
- Publication number 20050062122
- Publication date Mar 24, 2005
- Kendra J. Gallup
- G02 - OPTICS
Information Patent Application
Sloped via contacts
- Publication number 20040198040
- Publication date Oct 7, 2004
- Frank S. Geefay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR HERMETICITY DETERMINATION AND LEAK DETECTI...
- Publication number 20040118187
- Publication date Jun 24, 2004
- Allen Chien
- G01 - MEASURING TESTING
Information Patent Application
Die singulation using deep silicon etching
- Publication number 20040087059
- Publication date May 6, 2004
- Richard C. Ruby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for sealing a semiconductor device and apparatus embodying t...
- Publication number 20040077126
- Publication date Apr 22, 2004
- Frank S. Geefay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for sealing a semiconductor device and apparatus embodying t...
- Publication number 20040077127
- Publication date Apr 22, 2004
- Frank S. Geefay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer-level package with silicon gasket
- Publication number 20040029360
- Publication date Feb 12, 2004
- Frank S. Geefay
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Wafer-level package with silicon gasket
- Publication number 20030116825
- Publication date Jun 26, 2003
- Frank S. Geefay
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Sloped via contacts
- Publication number 20030119308
- Publication date Jun 26, 2003
- Frank S. Geefay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microcap wafer-level package
- Publication number 20020017713
- Publication date Feb 14, 2002
- Richard C. Ruby
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Frank S. Geefay

Person

Patents Grantslast 30 patents

Bonded wafer structure and method of fabrication

Attachment system incorporating a recess in a structure

Wafer-level packaging of optoelectronic devices

Method for placing metal contacts underneath FBAR resonators

Wafer-level package with silicon gasket

Wafer-level packaging of optoelectronic devices

Method for sealing a semiconductor device and apparatus embodying t...

Sloped via contacts

Method for sealing a semiconductor device and apparatus embodying t...

Wafer-level package with silicon gasket

Die singulation using deep silicon etching

Film deposition to enhance sealing yield of microcap wafer-level pa...

Method and apparatus for hermeticity determination and leak detecti...

Process for fabricating a top side pitted diode device

Microcap wafer-level package

Microcap wafer-level package

Microcap wafer-level package

Microcap wafer-level package with vias

Patents Applicationslast 30 patents

BONDED WAFER STRUCTURE AND METHOD OF FABRICATION

PHOTOSTRUCTURABLE GLASS MICROELECTROMECHANICAL (MEMs) DEVICES AND M...

Attachment system

Protective structures and methods of fabricating protective structu...

Method for making contact through via contact to an offset contacto...

METHOD FOR PLACING METAL CONTACTS UNDERNEATH FBAR RESONATORS

Semiconductor package and fabrication method

Wafer-level packaging of optoelectronic devices

Wafer-level packaging of optoelectronic devices

Sloped via contacts

METHOD AND APPARATUS FOR HERMETICITY DETERMINATION AND LEAK DETECTI...

Die singulation using deep silicon etching

Method for sealing a semiconductor device and apparatus embodying t...

Method for sealing a semiconductor device and apparatus embodying t...

Wafer-level package with silicon gasket

Wafer-level package with silicon gasket

Sloped via contacts

Microcap wafer-level package